Infrared imager with integrated metal layers
First Claim
1. A system comprising:
- a focal plane array (FPA) integrated circuit comprising;
an array of infrared sensors adapted to image a scene;
a plurality of active circuit components;
a first metal layer disposed above and connected to the circuit components;
a second metal layer disposed above the first metal layer and connected to the first metal layer;
a third metal layer disposed above the second metal layer and below the infrared sensors, wherein the third metal layer is connected to the second metal layer and the infrared sensors;
wherein the first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components; and
wherein the first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.
2 Assignments
0 Petitions
Accused Products
Abstract
Various techniques are provided for implementing, operating, and manufacturing infrared imaging devices using integrated circuits. In one example, a system includes a focal plane array (FPA) integrated circuit comprising an array of infrared sensors adapted to image a scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, and a third metal layer disposed above the second metal layer and below the infrared sensors. The third metal layer is connected to the second metal layer and the infrared sensors. The first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components. The first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors.
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Citations
20 Claims
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1. A system comprising:
a focal plane array (FPA) integrated circuit comprising; an array of infrared sensors adapted to image a scene; a plurality of active circuit components; a first metal layer disposed above and connected to the circuit components; a second metal layer disposed above the first metal layer and connected to the first metal layer; a third metal layer disposed above the second metal layer and below the infrared sensors, wherein the third metal layer is connected to the second metal layer and the infrared sensors; wherein the first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components; and wherein the first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method comprising:
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imaging a scene using a focal plane array (FPA) integrated circuit comprising; an array of infrared sensors adapted to image the scene, a plurality of active circuit components, a first metal layer disposed above and connected to the circuit components, a second metal layer disposed above the first metal layer and connected to the first metal layer, a third metal layer disposed above the second metal layer and below the infrared sensors, wherein the third metal layer is connected to the second metal layer and the infrared sensors, and wherein the first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components; and routing signals between the circuit components and the infrared sensors through the first, second, and third metal layers. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a focal plane array (FPA) integrated circuit, the method comprising:
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forming a plurality of active circuit components; forming a plurality of insulating layers above the active circuit components; forming first, second, and third metal layers above the active circuit components; forming a plurality of infrared sensors above the metal layers and the insulating layers; wherein the circuit components, the first metal layer, the second metal layer, the third metal layer, and the infrared sensors are separated by corresponding ones of the insulating layers; wherein the first, second, and third metal layers are the only metal layers of the FPA between the infrared sensors and the circuit components; and wherein the first, second, and third metal layers are adapted to route signals between the circuit components and the infrared sensors. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification