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Heat dissipation for substrate assemblies

  • US 9,848,512 B2
  • Filed: 11/02/2016
  • Issued: 12/19/2017
  • Est. Priority Date: 02/27/2014
  • Status: Active Grant
First Claim
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1. A heat sink for dissipating heat, comprising:

  • an attachment structure defining a slot configured to receive an edge of a substrate and thermally couple to a ground plane of the substrate; and

    a tab located opposite to the slot, the tab being configured to slide into a card guide slot of an assembly rack, such that in use, heat generated by at least one electronic component on the substrate is at least partially transferred through the ground plane to the attachment structure to be dissipated.

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