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Watertight welding methods and components

  • US 9,849,538 B2
  • Filed: 12/24/2014
  • Issued: 12/26/2017
  • Est. Priority Date: 12/24/2014
  • Status: Active Grant
First Claim
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1. A method of forming a watertight enclosure for electronic components, comprising:

  • providing a first component portion comprising a first groove and a protruding ridge located therein, the first groove including a floor, an inside ridge, and an outside ridge, the inside ridge and the outside each extending from the floor and separated from each other in a first direction, whereinthe protruding ridge comprises a bonding material,the first groove comprises a second groove inside the first groove, andthe second groove and the protruding ridge comprising the bonding material are spaced apart in the first direction;

    providing a second component portion comprising a tenon, the tenon shaped to follow a profile of the first groove;

    disposing the tenon inside the first groove, such that the tenon contacts the protruding ridge;

    applying energy from a power source near the first groove to cause the protruding ridge to melt; and

    applying a force to the first component portion relative to the second component portion, such thata portion of the protruding ridge is disposed in a bonding seam formed between an outside surface of the tenon and an inside surface of the first groove,the first component portion and the second component portion are brought together to form the enclosure that is configured to allow one or more electronic components to be disposed therein,a space defined by the second groove is positioned so that the tenon is not disposed within the defined space when the first component portion and the second component portion are brought together to form the enclosure, andat least a portion of excess bonding material flows inside the second groove when the first component portion and the second component portion are brought together to form the enclosure.

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