Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects

• US 9,852,969 B2
• Filed: 06/23/2016
• Issued: 12/26/2017
• Est. Priority Date: 11/22/2013
• Status: Active Grant

• Current Assignee: Invensas Corporation
• Original Assignee: Invensas Corporation
• Inventors: Uzoh, Cyprian Emeka, Katkar, Rajesh
• Primary Examiner(s): WILLIAMS, ALEXANDER O
• Application Number:
  US15/191,333
• Publication Number:
  US 20160307832A1
• Time in Patent Office: 551 Days
• Field of Search: 257712, 257777, 257778, 257737, 257738, 257734, 257773, 257774, 257713
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13169 Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/1703 Bump connectors having different sizes, e.g. different diameters, heights or widths
• CPC Class Codes: H01L 2224/1718 being disposed on at least two different sides of the body, e.g. dual array
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/81825 Solid-liquid interdiffusion
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2225/06506 : Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06589 : Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49816 : Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 24/10 : Bump connectors bumps on insulating substrates, e.g. chip carriers, H01L23/49816; Manufacturing methods related thereto
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/15192 : Resurf arrangement of the internal vias
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges

Abstract

An apparatus relating generally to a die stack is disclosed. In such an apparatus, a substrate is included. A first bond via array includes first wires each of a first length extending from a first surface of the substrate. An array of bump interconnects is disposed on the first surface. A die is interconnected to the substrate via the array of bump interconnects. A second bond via array includes second wires each of a second length different than the first length extending from a second surface of the die.

Claims

1. An apparatus, comprising:

a substrate;

a first bond via array with first wire bond wires (“

first wires”

) each of a first length extending from base bonding structures thereof on a first surface of the substrate;

an array of bump interconnects disposed on the first surface of the substrate;

a package interconnected to the substrate via the array of bump interconnects coupled to a first surface of the package;

a second bond via array with second wire bond wires (“

second wires”

) each of a second length different than the first length extending from a second surface of the package opposite the first surface of the package;

a first surface of each of a first die and a second die is coupled to each of the first bond via array and the second bond via array;

a heat sink covering the first die, the second die, and the package; and

a thermal paste disposed to couple a second surface opposite the first surface of each of the first die and the second die to an interior surface of the heat sink.

2. The apparatus according to claim 1, wherein the second bond via array is disposed interior to the first bond via array and the first length is greater than the second length.

3. The apparatus according to claim 1, wherein the array of bump interconnects is disposed within the first bond via array.

4. The apparatus according to claim 1, wherein:

the second length is less than the first length for coupling the first surface of each of the first die and the second die to each of the first bond via array and the second bond via array; and

the first surface of each of the first die and the second die partially extend over the second surface of the package respectively from opposite sides of the package.

5. The apparatus according to claim 1, wherein the substrate is an interposer.

6. An apparatus, comprising:

a substrate;

a bond via array with wire bond wires (“

wires”

) extending from a first surface of the substrate;

a first array of bump interconnects disposed on the first surface of the substrate;

a first surface of a package interconnected to the substrate via the first array of bump interconnects;

a second array of bump interconnects disposed on a second surface of the package opposite the first surface of the package;

wherein the wires of the bond via array are of a length;

wherein the second array of bump interconnects are of a height less than the length for coupling a first surface of each of a first die and a second die to the bond via array and the second array of bump interconnects;

a heat sink covering the first die, the second die, and the package; and

a thermal paste disposed to couple a second surface opposite the first surface of each of the first die and the second die to an interior surface of the heat sink.

7. The apparatus according to claim 6, wherein the first surface of each of the first die and the second die partially extend over the second surface of the package respectively from opposite sides of the package.

8. The apparatus according to claim 6, wherein the second array of bump interconnects is disposed interior to the bond via array.

9. The apparatus according to claim 6, wherein the first array of bump interconnects is disposed within the bond via array.

10. The apparatus according to claim 6, wherein the substrate is an interposer.

11. An apparatus, comprising:

a first substrate;

a first bond via array with first wire bond wires (“

first wires”

) each of a first length extending from a first surface of the first substrate;

an array of bump interconnects disposed on the first surface of the first substrate;

a second substrate interconnected to the first substrate via the array of bump interconnects coupled to a first surface of the second substrate; and

a second bond via array with second wire bond wires (“

second wires”

) each of a second length different than the first length extending from a second surface of the second substrate opposite the first surface of the second substrate.

12. The apparatus according to claim 11, wherein the second bond via array is disposed interior to the first bond via array and the first length is greater than the second length.

13. The apparatus according to claim 11, wherein the array of bump interconnects is disposed within the first bond via array.

14. The apparatus according to claim 11, wherein:

the second length is less than the first length for coupling a first surface of each of a first die and a second die to each of the first bond via array and the second bond via array; and

the first surface of each of the first die and the second die partially extend over the second surface of the second substrate respectively from opposite sides of the second substrate.

15. The apparatus according to claim 12, further comprising:

a heat sink covering the first die, the second die, and the second substrate; and

a thermal paste disposed to couple a second surface opposite the first surface of each of the first die and the second die to an interior surface of the heat sink.

16. The apparatus according to claim 11, wherein the first substrate is an interposer.