Conductive terminal on integrated circuit
First Claim
1. A conductive terminal on an integrated circuit, comprising:
- a conductive pad disposed on and electrically to the integrated circuit;
a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a plurality of contact openings arranged in array, and the conductive pad being partially exposed by the contact openings; and
a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings, the conductive via comprising a plurality of convex portions arranged in array, the conductive via comprising a plurality of first conductive portions embedded in the contact openings and a second conductive portion connected to the first conductive portions, the second conductive portion covering the first conductive portions and the dielectric layer, the second conductive portion comprising a plurality of first segments and a second segment connected to the first segments, the first segments covering the first conductive portions, the second segment covering the dielectric layer, a maximum thickness of each of the first segments being greater than a maximum thickness of the second segment, and the convex portions being distributed on top surfaces of the first segments.
1 Assignment
0 Petitions
Accused Products
Abstract
A conductive terminal on an integrated circuit is provided. The conductive terminal includes a conductive pad, a dielectric layer, and a conductive via. The conductive pad is disposed on and electrically to the integrated circuit. The dielectric layer covers the integrated circuit and the conductive pad, the dielectric layer includes a plurality of contact openings arranged in array, and the conductive pad is partially exposed by the contact openings. The conductive via is disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings. The conductive via includes a plurality of convex portions arranged in array. The convex portions are distributed on a top surface of the conductive via, and the convex portions are corresponding to the contact openings.
-
Citations
20 Claims
-
1. A conductive terminal on an integrated circuit, comprising:
-
a conductive pad disposed on and electrically to the integrated circuit; a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a plurality of contact openings arranged in array, and the conductive pad being partially exposed by the contact openings; and a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the contact openings, the conductive via comprising a plurality of convex portions arranged in array, the conductive via comprising a plurality of first conductive portions embedded in the contact openings and a second conductive portion connected to the first conductive portions, the second conductive portion covering the first conductive portions and the dielectric layer, the second conductive portion comprising a plurality of first segments and a second segment connected to the first segments, the first segments covering the first conductive portions, the second segment covering the dielectric layer, a maximum thickness of each of the first segments being greater than a maximum thickness of the second segment, and the convex portions being distributed on top surfaces of the first segments. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A conductive terminal on an integrated circuit, comprising:
-
a conductive pad disposed on and electrically to the integrated circuit; a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a plurality of arc-shaped contact openings, and the conductive pad being partially exposed by the arc-shaped contact openings; and a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the arc-shaped contact openings, the conductive via comprising a plurality of convex portions, the convex portions being distributed on a top surface of the conductive via, and the convex portions being corresponding to the dielectric layer covered by the conductive via, wherein the arc-shaped contact openings are separated from one another and arranged along a circular path, and a center of circle of the circular path is substantially aligned with a center of the conductive via. - View Dependent Claims (8, 9, 10, 11, 12)
-
-
13. A conductive terminal on an integrated circuit, comprising:
-
a conductive pad disposed on and electrically to the integrated circuit; a dielectric layer covering the integrated circuit and the conductive pad, the dielectric layer comprising a ring-shaped contact opening, and the conductive pad being partially exposed by the ring-shaped contact opening; and a conductive via disposed on the dielectric layer and electrically connected to the conductive pad through the ring-shaped contact opening, the conductive via comprising at least one convex portion, the at least one convex portion being distributed on a top surface of the conductive via, and the at least one convex portion being corresponding to the dielectric layer covered by the conductive via, wherein an area of the at least one convex portion ranges from about 39% to about 75% of an area occupied by the conductive via. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
-
Specification