Method for manufacturing semiconductor device
First Claim
1. A semiconductor device comprising:
- a transistor;
a terminal portion;
a first metal layer and a second metal layer, the first metal layer and the second metal layer comprising copper;
a first insulating layer over the first metal layer and the second metal layer;
an oxide semiconductor film over the first insulating layer;
a third metal layer and a fourth metal layer over the first insulating layer, the third metal layer and the fourth metal layer comprising copper;
a second insulating layer over the oxide semiconductor film, the third metal layer and the fourth metal layer; and
a pixel electrode and an electrode over the second insulating layer, wherein the pixel electrode and the electrode are transparent,wherein the first metal layer and the second metal layer are formed by a stack of a first titanium film and a first copper film,wherein the third metal layer is electrically connected to the oxide semiconductor film,wherein the oxide semiconductor film comprises a channel region of the transistor,wherein the first metal layer comprises a gate electrode of the transistor,wherein the fourth metal layer is directly in contact with the second metal layer through a first contact hole of the first insulating layer,wherein the pixel electrode is electrically connected to the third metal layer,wherein the electrode is electrically connected to the second metal layer through the fourth metal layer, andwherein the terminal portion comprises the second metal layer, the fourth metal layer, and the electrode.
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Abstract
An object is to establish a processing technique in manufacture of a semiconductor device in which an oxide semiconductor is used. A gate electrode is formed over a substrate, a gate insulating layer is formed over the gate electrode, an oxide semiconductor layer is formed over the gate insulating layer, the oxide semiconductor layer is processed by wet etching to form an island-shaped oxide semiconductor layer, a conductive layer is formed to cover the island-shaped oxide semiconductor layer, the conductive layer is processed by dry etching to form a source electrode, and a drain electrode and part of the island-shaped oxide semiconductor layer is removed by dry etching to form a recessed portion in the island-shaped oxide semiconductor layer.
234 Citations
22 Claims
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1. A semiconductor device comprising:
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a transistor; a terminal portion; a first metal layer and a second metal layer, the first metal layer and the second metal layer comprising copper; a first insulating layer over the first metal layer and the second metal layer; an oxide semiconductor film over the first insulating layer; a third metal layer and a fourth metal layer over the first insulating layer, the third metal layer and the fourth metal layer comprising copper; a second insulating layer over the oxide semiconductor film, the third metal layer and the fourth metal layer; and a pixel electrode and an electrode over the second insulating layer, wherein the pixel electrode and the electrode are transparent, wherein the first metal layer and the second metal layer are formed by a stack of a first titanium film and a first copper film, wherein the third metal layer is electrically connected to the oxide semiconductor film, wherein the oxide semiconductor film comprises a channel region of the transistor, wherein the first metal layer comprises a gate electrode of the transistor, wherein the fourth metal layer is directly in contact with the second metal layer through a first contact hole of the first insulating layer, wherein the pixel electrode is electrically connected to the third metal layer, wherein the electrode is electrically connected to the second metal layer through the fourth metal layer, and wherein the terminal portion comprises the second metal layer, the fourth metal layer, and the electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A semiconductor device comprising:
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a transistor; a terminal portion; a first metal layer and a second metal layer; a first insulating layer over the first metal layer and the second metal layer, the first metal layer and the second metal layer comprising copper; an oxide semiconductor film over the first insulating layer; a third metal layer and a fourth metal layer over the first insulating layer, the third metal layer and the fourth metal layer comprising copper; a second insulating layer over the oxide semiconductor film, the third metal layer and the fourth metal layer; and a pixel electrode and an electrode over the second insulating layer, wherein the pixel electrode and the electrode are transparent, wherein the first metal layer and the second metal layer are formed by a stack of a first titanium film and a first copper film, wherein the third metal layer is electrically connected to the oxide semiconductor film, wherein the oxide semiconductor film comprises a channel region of the transistor, wherein the oxide semiconductor film comprises a region overlapping the third metal layer, wherein a thickness of the channel region is thinner than the region, wherein the first metal layer comprises a gate electrode of the transistor, wherein the fourth metal layer is directly in contact with the second metal layer through a first contact hole of the first insulating layer, wherein the pixel electrode is electrically connected to the third metal layer, wherein the electrode is electrically connected to the second metal layer through the fourth metal layer, and wherein the terminal portion comprises the second metal layer, the fourth metal layer, and the electrode. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A semiconductor device comprising:
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a transistor; a terminal portion; a first metal layer and a second metal layer, the first metal layer and the second metal layer comprising copper; a first insulating layer over the first metal layer and the second metal layer; an oxide semiconductor film over the first insulating layer; a third metal layer and a fourth metal layer over the first insulating layer, the third metal layer and the fourth metal layer comprising copper; a second insulating layer over the oxide semiconductor film, the third metal layer and the fourth metal layer; and a pixel electrode and an electrode over the second insulating layer, wherein the pixel electrode and the electrode are transparent, wherein the first metal layer and the second metal layer are formed by a stack of a first titanium film and a first copper film, wherein the third metal layer is electrically connected to the oxide semiconductor film, wherein the oxide semiconductor film comprises a channel region of the transistor, wherein the oxide semiconductor film comprises a region overlapping the third metal layer, wherein a thickness of the channel region is thinner than the region, wherein the second insulating layer is directly in contact with the channel region, wherein the first metal layer comprises a gate electrode of the transistor, wherein the fourth metal layer is directly in contact with the second metal layer through a first contact hole of the first insulating layer, wherein the pixel electrode is electrically connected to the third metal layer, wherein the electrode is electrically connected to the second metal layer through the fourth metal layer, and wherein the terminal portion comprises the second metal layer, the fourth metal layer, and the electrode. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification