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Method of forming a stress released image sensor package structure

  • US 9,853,079 B2
  • Filed: 12/05/2016
  • Issued: 12/26/2017
  • Est. Priority Date: 02/24/2015
  • Status: Active Grant
First Claim
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1. A method of forming a sensor package, comprising:

  • providing a sensor chip that includes a first substrate with opposing first and second surfaces, a plurality of photo detectors formed on or under the first surface of the first substrate and configured to generate one or more signals in response to light incident on the first surface of the first substrate, and a plurality of contact pads formed at the first surface of the first substrate and which are electrically coupled to the plurality of photo detectors;

    forming a plurality of holes into the second surface of the first substrate, wherein each of the plurality of holes extends through the first substrate and to one of the contact pads;

    forming a plurality of conductive leads each extending from one of the contact pads, through one of the plurality of holes, and along the second surface of the first substrate;

    forming one or more trenches into a periphery portion of the first substrate each extending from the second surface to the first surface; and

    forming insulation material that covers sidewalls of the one or more trenches.

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