Method of forming a stress released image sensor package structure

• US 9,853,079 B2
• Filed: 12/05/2016
• Issued: 12/26/2017
• Est. Priority Date: 02/24/2015
• Status: Active Grant

• Current Assignee: Optiz, Inc.
• Original Assignee: Optiz, Inc.
• Inventors: Oganesian, Vage, Lu, Zhenhua
• Primary Examiner(s): PHAM, THANHHA S
• Application Number:
  US15/369,603
• Publication Number:
  US 20170084656A1
• Time in Patent Office: 386 Days
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14643 Photodiode arrays; MOS imagers
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 27/14698 Post-treatment for the devices, e.g. annealing, impurity-gettering, shor-circuit elimination, recrystallisation

Abstract

A sensor package that includes a substrate with opposing first and second surfaces. A plurality of photo detectors are formed on or under the first surface and configured to generate one or more signals in response to light incident on the first surface. A plurality of contact pads are formed at the first surface and are electrically coupled to the plurality of photo detectors. A plurality of holes are each formed into the second surface and extending through the substrate to one of the contact pads. Conductive leads each extend from one of the contact pads, through one of the plurality of holes, and along the second surface. The conductive leads are insulated from the substrate. One or more trenches are formed into a periphery portion of the substrate each extending from the second surface to the first surface. Insulation material covers sidewalls of the one or more trenches.

Claims

1. A method of forming a sensor package, comprising:

providing a sensor chip that includes a first substrate with opposing first and second surfaces, a plurality of photo detectors formed on or under the first surface of the first substrate and configured to generate one or more signals in response to light incident on the first surface of the first substrate, and a plurality of contact pads formed at the first surface of the first substrate and which are electrically coupled to the plurality of photo detectors;

forming a plurality of holes into the second surface of the first substrate, wherein each of the plurality of holes extends through the first substrate and to one of the contact pads;

forming a plurality of conductive leads each extending from one of the contact pads, through one of the plurality of holes, and along the second surface of the first substrate;

forming one or more trenches into a periphery portion of the first substrate each extending from the second surface to the first surface; and

forming insulation material that covers sidewalls of the one or more trenches.

2. The method of claim 1, further comprising:

forming a dam structure on the first surface of the first substrate and around but not over the plurality of photo detectors;

mounting a second substrate on the dam structure, wherein the second substrate extends over the plurality of photo detectors, and wherein the dam structure and the second substrate form a sealed cavity over the plurality of photo detectors.

3. The method of claim 1, further comprising:

mounting a second substrate on the first surface, wherein the second substrate extends over the plurality of photo detectors, and wherein a cavity formed into a surface of the second substrate is positioned over and seals the plurality of photo detectors.

4. The method of claim 1, further comprising:

forming a plurality of electrical connectors each electrically connected to one of the conductive leads.

5. The method of claim 4, further comprising:

forming a layer of insulation material over the second surface of the first substrate and covering the conductive leads except for contact pad portions thereof which are in electrical contact with the plurality of electrical connectors.

6. The method of claim 1, further comprising:

forming a layer of insulation material between each of the conductive leads and the first substrate.

7. The method of claim 1, wherein each of the plurality of holes has a funnel shaped cross section.

8. The method of claim 1, wherein the sidewalls of the one or more trenches include a shoulder formed therein.

9. A method of forming a plurality of sensor packages, comprising:

providing a sensor chip that includes a first substrate with opposing first and second surfaces, and a plurality of sensors formed thereon, wherein each sensor includes a plurality of photo detectors formed on or under the first surface of the first substrate and configured to generate one or more signals in response to light incident on the first surface of the first substrate, and a plurality of contact pads formed at the first surface of the first substrate and which are electrically coupled to the plurality of photo detectors;

forming a plurality of holes into the second surface of the first substrate, wherein each of the plurality of holes extends through the first substrate and to one of the contact pads;

forming a plurality of conductive leads each extending from one of the contact pads, through one of the plurality of holes, and along the second surface of the first substrate;

forming a dam structure on the first surface of the first substrate and around but not over the plurality of photo detectors;

mounting a second substrate on the dam structure, wherein the second substrate extends over the plurality of photo detectors, and wherein the dam structure and the second substrate form a sealed cavity over the plurality of photo detectors for each of the sensors;

forming one or more trenches into the first substrate at a periphery portion of each of the sensors extending from the second surface, to the first surface, and into the dam structure; and

forming insulation material that covers sidewalls of the one or more trenches; and

singulating the first substrate into separate die at the trenches, wherein each die includes one of the sensors.

10. The method of claim 9, further comprising before the singulation:

forming a plurality of electrical connectors each electrically connected to one of the conductive leads.

11. The method of claim 10, further comprising before the singulation:

forming a layer of insulation material over the second surface of the first substrate and covering the conductive leads except for contact pad portions thereof which are in electrical contact with the plurality of electrical connectors.

12. The method of claim 9, further comprising before the singulation:

forming a layer of insulation material between each of the conductive leads and the first substrate.

13. The method of claim 9, wherein each of the plurality of holes has a funnel shaped cross section.

14. The method of claim 9, wherein the sidewalls of the one or more trenches include a shoulder formed therein.