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Light emitting device manufacturing method

  • US 9,853,191 B2
  • Filed: 12/09/2016
  • Issued: 12/26/2017
  • Est. Priority Date: 12/10/2015
  • Status: Active Grant
First Claim
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1. A light emitting device manufacturing method comprising:

  • bonding an electrode of a light emitting element to a conductive member of a base; and

    electrodepositing, on a surface of the light emitting element, first wavelength conversion particles containing aluminum, second wavelength conversion particles having surfaces covered with covering material containing aluminum, and filling particles that contain aluminum, that have particle size smaller than particle sizes of both the first wavelength conversion particles and the second wavelength conversion particles, and that have aspect ratio smaller than aspect ratios of both the first wavelength conversion particles and the second wavelength conversion particles, to form a wavelength conversion layer in which the filling particles are disposed among the first wavelength conversion particles and the second wavelength conversion particles.

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