Piezoelectric MEMS microphone

• US 9,853,201 B2
• Filed: 08/05/2014
• Issued: 12/26/2017
• Est. Priority Date: 06/30/2008
• Status: Active Grant

• Current Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Original Assignee: Board of Regents of the University of Michigan (University of Michigan)
• Inventors: Grosh, Karl, Littrell, Robert J.
• Primary Examiner(s): GORDON, BRYAN P
• Application Number:
  US14/451,670
• Publication Number:
  US 20140339657A1
• Time in Patent Office: 1,239 Days
• Field of Search: 310330, 310331, 310332, 29 2535
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 3/0021 Transducers for transforming electrical into mechanical energy or vice versa dynamo-electric machines H02K99/00; electrostatic machines H02N1/00; piezoelectric devices H10N30/00
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 1/00158 Diaphragms, membranes manufacture process for semi-permeable inorganic membranes B01D67/0039
• CPC Class Codes: H04R 17/00 Piezoelectric transducers; Electrostrictive transducers piezoelectric or electrostrictive elements in general H10N30/00; details of piezoelectric or electrostrictive motors, generators or positioners H10N30/00
• CPC Class Codes: H04R 17/02 Microphones
• CPC Class Codes: H04R 17/10 Resonant transducers, i.e. adapted to produce maximum output at a predetermined frequency
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H10N 30/05 Manufacture of multilayered piezoelectric or electrostrictive devices, or parts thereof, e.g. by stacking piezoelectric bodies and electrodes
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/306 Cantilevers
• CPC Class Codes: H10N 30/50 having a stacked or multilayer structure

Abstract

A piezoelectric MEMS microphone comprising a multi-layer sensor that includes at least one piezoelectric layer between two electrode layers, with the sensor being dimensioned such that it provides a near maximized ratio of output energy to sensor area, as determined by an optimization parameter that accounts for input pressure, bandwidth, and characteristics of the piezoelectric and electrode materials. The sensor can be formed from single or stacked cantilevered beams separated from each other by a small gap, or can be a stress-relieved diaphragm that is formed by deposition onto a silicon substrate, with the diaphragm then being stress relieved by substantial detachment of the diaphragm from the substrate, and then followed by reattachment of the now stress relieved diaphragm.

Claims

1. A piezoelectric MEMS device comprising:

a substrate comprising an opening in the substrate;

a suspension element;

a multi-layer, piezoelectric microphone diaphragm configured to respond to a pressure differential at one or more acoustic frequencies, with the pressure differential being between a top portion of the multi-layer, piezoelectric microphone diaphragm and a bottom portion of the multi-layer, piezoelectric microphone diaphragm, with the multi-layer, piezoelectric microphone diaphragm being suspended above the opening in the substrate via the suspension element, the multi-layer, piezoelectric microphone diaphragm comprising at least three layers including a first electrode layer, a piezoelectric layer deposited over the first electrode layer, and a second electrode layer deposited over the piezoelectric layer, with the first electrode layer comprising an upper central electrode and an upper outer ring electrode, with the second electrode layer comprising a lower central electrode and a lower outer ring electrode;

wherein a first end of the suspension element is affixed to the substrate and wherein a second end of the suspension element is affixed to a first portion of the multi-layer, piezoelectric microphone diaphragm at or adjacent the lower outer ring electrode; and

a removable connection between the substrate and attached to the multi-layer, piezoelectric microphone diaphragm at one or more second re-attached portions of the lower outer ring electrode.

2. The piezoelectric MEMS device of claim 1, wherein the multi-layer, piezoelectric microphone diaphragm is attached to at least a portion of the substrate about at least a portion of a perimeter of the multi-layer, piezoelectric microphone diaphragm, the perimeter of the multi-layer, piezoelectric microphone diaphragm comprising:

a first portion directly deposited onto the substrate; and

a second portion adhered to the substrate.

3. The piezoelectric MEMS device of claim 2, wherein the upper and lower central electrodes are located substantially centrally on the multi-layer, piezoelectric microphone diaphragm and include lead traces that extend to the substrate at the first portion.

4. The piezoelectric MEMS device of claim 3, wherein the lower outer ring electrode is disposed between the substrate and the piezoelectric layer in a band shape surrounding a portion of the lower central electrode, wherein the lower outer ring electrode is electrically isolated from the lower central electrode;

and

the upper outer ring electrode is disposed over the piezoelectric layer in a region overlapping the lower outer ring electrode, the upper outer ring electrode surrounding a portion of the lower central electrode, wherein the upper outer ring electrode is electrically isolated from the upper central electrode.

5. The piezoelectric MEMS device of claim 4, wherein the upper central and upper outer ring electrodes are electrically connected together and the lower central and lower outer ring electrodes are electrically connected together.

6. The piezoelectric MEMS device of claim 5, wherein the multi-layer, piezoelectric microphone diaphragm is covered with an insulating layer, whereby the piezoelectric MEMS device comprises a hydrophone.

7. The piezoelectric MEMS device of claim 1, wherein the multi-layer, piezoelectric microphone diaphragm comprises a reattached diaphragm formed from deposition of material onto the substrate that is at least substantially detached from the substrate to stress-relieve the multi-layer, piezoelectric microphone diaphragm prior to reattachment.

10. The piezoelectric MEMS device of claim 1, wherein the device comprises a piezoelectric MEMS microphone or an acoustic transducer.

11. The piezoelectric MEMS device of claim 1, wherein the suspension element comprises a spring.

12. The piezoelectric MEMS device of claim 1, wherein the multi-layer, piezoelectric diaphragm is partially attached to the substrate via electrostatic clamping.

18. The piezoelectric MEMS device of claim 1, wherein the multi-layer, piezoelectric microphone diaphragm is further configured to vibrate in response to sound waves to produce electrical signals, or to vibrate in response to electrical signals to produce sound waves.

19. The piezoelectric MEMS device of claim 1, wherein a first portion of a periphery of the multi-layer, piezoelectric microphone diaphragm is positioned in proximity to a first edge portion of the substrate, and a second portion of the periphery of the multi-layer, piezoelectric microphone diaphragm is positioned in proximity to a second edge portion of the substrate such that the multi-layer, piezoelectric microphone diaphragm and substrate together form a substantially contiguous structure for resisting airflow through the piezoelectric MEMS device.

20. The piezoelectric MEMS device of claim 1, wherein the substrate further comprises first and second edge portions that at least in part define the opening in the substrate;

and

wherein the multi-layer, piezoelectric microphone diaphragm is attached to the suspension element to enable motion of a perimeter of the multi-layer, piezoelectric microphone diaphragm relative to the substrate, the multi-layer, piezoelectric diaphragm being configured to resist airflow through the piezoelectric MEMS device at one or more audio frequencies by being suspended over the opening in the substrate with a first portion of a periphery of the multi-layer, piezoelectric diaphragm being positioned in proximity to a first edge portion of the substrate and by a second portion of the periphery of the multi-layer, piezoelectric diaphragm being positioned in proximity to a second edge portion of the substrate.

21. The piezoelectric MEMS device of claim 1, wherein the removable connection comprises an electrostatic force connection.

22. The piezoelectric MEMS device of claim 21, wherein the electrostatic force connection is an electrostatic clamp.

8. A method of manufacturing a piezoelectric MEMS microphone, comprising:

depositing, onto a substrate, alternating layers of electrode and piezoelectric materials to form a piezoelectric diaphragm;

releasing a portion of the deposited layers of the piezoelectric diaphragm from the substrate; and

reattaching the released portion of the piezoelectric diaphragm to the substrate about a periphery of the substrate such that the piezoelectric diaphragm has a first peripheral portion that is attached to the substrate as a direct deposition of at least one of the deposited layers onto the substrate, and has a second peripheral portion attached to the substrate by reattachment of the second peripheral portion onto the substrate.

9. The method set forth in claim 8, wherein reattaching the released portion of the piezoelectric diaphragm to the substrate comprises adhering the released portion of the piezoelectric diaphragm to the substrate.

13. A piezoelectric MEMS device comprising:

a substrate;

a suspension element; and

a multi-layer, piezoelectric microphone diaphragm suspended above the substrate and configured to respond to a pressure differential across the multi-layer, piezoelectric microphone diaphragm at one or more acoustic frequencies, the multi-layer, piezoelectric microphone diaphragm being configured to resist airflow through the piezoelectric MEMS device at one or more frequencies by being suspended over the substrate via the suspension element, with the multi-layer, piezoelectric microphone diaphragm comprising at least three layers that include a first electrode layer, a piezoelectric layer deposited over the first electrode layer, and a second electrode layer deposited over the piezoelectric layer, with the first electrode layer comprising an upper central electrode and an upper outer ring electrode, with the second electrode layer comprising a lower central electrode and a lower outer ring electrode;

wherein a first end of the suspension element is affixed to the substrate and wherein a second end of the suspension element is affixed to a first portion of the multi-layer, piezoelectric microphone diaphragm at or adjacent the lower outer ring electrode; and

a removable connection between the substrate and attached to the multi-layer, piezoelectric microphone diaphragm at one or more second re-attached portions of the lower outer ring electrode.

14. The piezoelectric MEMS device of claim 13, wherein the multi-layer, piezoelectric microphone diaphragm is not continuously attached around a perimeter of the multi-layer, piezoelectric diaphragm based on attachment of the multi-layer, piezoelectric microphone diaphragm to the suspension element.

15. The piezoelectric MEMS device of claim 13, wherein the piezoelectric MEMS device comprises a piezoelectric MEMS microphone or an acoustic transducer.

16. The piezoelectric MEMS device of claim 13, wherein the multi-layer, piezoelectric microphone diaphragm is not continuously, directly attached to the substrate around a perimeter of the multi-layer, piezoelectric microphone diaphragm.

17. The piezoelectric MEMS device of claim 16, wherein the multi-layer, piezoelectric microphone diaphragm is continuously, indirectly attached around the perimeter of the multi-layer, piezoelectric microphone diaphragm via the suspension element.