MEMS component and method for encapsulating MEMS components
First Claim
1. A Microelectromechanical Systems (MEMS) component comprising:
- a substrate having an active surface, wherein electrical component structures and contact areas for making electrical contact with the electrical component structures are arranged on the substrate;
metallic column structures located on the contact areas and projecting beyond the electrical component structures;
a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures together with the metallic column structures;
a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein at least one portion of selected metallic column structures and the metallic frame structure penetrates through the resist layer to an extent such that those surfaces of the metallic column structures that face away from the substrate are not covered by the resist layer; and
a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and are electrically conductively connected to the surfaces of the metallic column structures not covered by the resist layer.
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Accused Products
Abstract
A MEMS component includes, on a substrate, component structures, contact areas connected to the component structures, metallic column structures seated on the contact areas, and metallic frame structures surrounding the component structures. A cured resist layer is seated on frame structure and column structures such that a cavity is enclosed between substrate, frame structure and resist layer. A structured metallization is provided directly on the resist layer or on a carrier layer seated on the resist layer. The structured metallization includes at least external contacts of the component and being electrically conductively connected both to metallic structures and to the contact areas of the component structures.
19 Citations
19 Claims
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1. A Microelectromechanical Systems (MEMS) component comprising:
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a substrate having an active surface, wherein electrical component structures and contact areas for making electrical contact with the electrical component structures are arranged on the substrate; metallic column structures located on the contact areas and projecting beyond the electrical component structures; a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures together with the metallic column structures; a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein at least one portion of selected metallic column structures and the metallic frame structure penetrates through the resist layer to an extent such that those surfaces of the metallic column structures that face away from the substrate are not covered by the resist layer; and a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and are electrically conductively connected to the surfaces of the metallic column structures not covered by the resist layer. - View Dependent Claims (2, 3, 4, 5)
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6. A Microelectromechanical Systems (MEMS) component comprising:
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a substrate having an active surface with electrical component structures and contact areas; metallic column structures located on the contact areas; a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures and the metallic column structures; a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein selected ones of the metallic column structures penetrate through the resist layer such that surfaces of the selected metallic column structures that face away from the substrate are not covered by the resist layer; and a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and is electrically conductively connected to the surfaces of the metallic column structures. - View Dependent Claims (7, 8, 9, 10, 11, 12)
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13. A Microelectromechanical Systems (MEMS) component comprising:
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a substrate having an active surface with electrical component structures and contact areas; metallic column structures located on the contact areas; a metallic frame structure arranged on the active surface of the substrate and enclosing the electrical component structures and the metallic column structures; a resist layer seated on the metallic frame structure and the metallic column structures such that the substrate, the metallic frame structure and the resist layer form an enclosed cavity, wherein the resist layer has an interface with the enclosed cavity; and a structured metallization arranged over a surface of the resist layer that faces away from the substrate, wherein the structured metallization forms at least structured external contacts for making contact for the MEMS component and is electrically conductively connected to the metallic column structures. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification