Substrate and terminals for power module and power module including the same

• US 9,853,378 B2
• Filed: 11/13/2013
• Issued: 12/26/2017
• Est. Priority Date: 02/07/2013
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Che-Heung, Kim, Chang-Sik, Booh, Seong-woon
• Primary Examiner(s): MILAKOVICH, NATHAN J
• Application Number:
  US14/079,007
• Publication Number:
  US 20140218871A1
• Time in Patent Office: 1,504 Days
• Field of Search: 361748, 439626, 439627, 439884
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48139 with an intermediate bond, e.g. continuous wire daisy chain
• CPC Class Codes: H01L 2224/49111 the connectors connecting two common bonding areas, e.g. Litz or braid wires
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01R 12/7088 Arrangements for power supply
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections

Abstract

According to example embodiments, a substrate for a power module includes first to third parts spaced apart from each other, where the third part surrounds the first and second parts, and a conductive layer on the first to third parts. A terminal of a first polarity is connected to the first part, and a terminal of a second polarity is connected to the second part. The first and second terminals may be spaced apart from each other and each have a coupling part, a body, and a contact part. The bodies of the first and second terminals may overlap each other. A power module may include the substrate.

Claims

1. A substrate for a power module, comprising:

first to third parts on a same surface of an underlying part of the substrate, wherein the first to third parts are spaced apart from each other, electrically insulated from each other, and not directly contacting each other, wherein the third part surrounds the first and second parts;

an element module on the third part;

a terminal of a first polarity on the first part;

a terminal of a second polarity on the second part; and

a conductive layer on the first to third parts, wherein the terminals directly contact the substrate.

2. The substrate for a power module of claim 1, wherein

one of the first and second polarities is positive, and

an other of the first and second polarities is negative.

3. The substrate for a power module of claim 1, wherein

the terminal of the first polarity is on a protruding part of the first part;

and the terminal of the second polarity is on a protruding part of the second part.

4. A terminal for a power module, comprising:

a first terminal configured to have a voltage of a first polarity applied thereto; and

a second terminal configured to have a voltage of a second polarity opposite the first polarity thereto,

the second terminal being adjacent to the first terminal and spaced apart from the first terminal, and

at least parts of the first and second terminals overlap each other, wherein

the first and second terminals directly contact a single substrate,

the first and second terminals are mounted on the single substrate, and

each of the first and second terminals has only one contact part contacting the single substrate.

5. The terminal for a power module of claim 4, wherein the first terminal comprises:

a first coupling part;

a first contact part contacting the single substrate; and

a first body connecting the first coupling part to the first contact part,

wherein the first body defines a first through hole.

6. The terminal for a power module of claim 4, wherein the second terminal comprises:

a coupling part;

a contact part contacting the single substrate; and

a body connecting the coupling part to the contact part,

wherein the body defines a through hole.

7. The terminal for a power module of claim 5, wherein the second terminal comprises:

a second coupling part;

a second contact part contacting the single substrate; and

a second body connecting the second coupling part to the second contact part,

wherein the second body defines a second through hole.

8. The terminal for a power module of claim 7, wherein the first and second bodies are parallel with each other.

9. The terminal for a power module of claim 7, wherein parts of the first and second through holes overlap each other.

10. The terminal for a power module of claim 7, wherein

an area of the first body is about equal to an area of the second body, and

the first and second through holes are at different locations in the first body and second body respectively.

11. The terminal for a power module of claim 4, further comprising:

at least one terminal connected to the single substrate and spaced apart from the first and second terminals.

12. A power module comprising:

a single substrate including first and second parts spaced apart from each other,

the first and second parts being conductive;

a first terminal on the first part,

the first terminal configured to have a first voltage applied thereto; and

a second terminal on the second part,

the second terminal configured to have a second voltage having a polarity different from a polarity of the first voltage applied thereto,

the first and second terminals being spaced apart from each other, and at least parts of the first and second terminals overlap each other, wherein

the first and second terminals directly contact the single substrate and each of the first and second terminals has only one contact part contacting the single substrate.

13. The power module of claim 12, wherein

the single substrate further includes a third part surrounding the first and second parts, and

the power module further comprises:

a first element module on one of the first and second parts; and

a second element module on the third part,

wherein the first element module is connected to the third part, and the second element module is connected to the first part.

14. The power module of claim 13, wherein each of the first and second element modules comprise a plurality of insulated gate bipolar transistors (IGBTs).

15. The power module of claim 13, wherein the first and second terminals contact the single substrate between the first and second element modules.

16. The power module of claim 13, wherein the first and second terminals have a half-bridge structure and cover the second element module.

17. The power module of claim 12, wherein the parts of the first and second terminals that overlap each other are on one of the first and second parts of the single substrate.

18. The power module of claim 13, further comprising:

at least one terminal on the third part and spaced apart from the first and second terminals.

19. A substrate for a power module, comprising:

first to third parts on a same surface of an underlying part of the substrate, wherein the first to third parts are spaced apart from each other, electrically insulated from each other, and not directly contacting each other, wherein the third part surrounds the first and second parts; and

an element module on the third part, wherein the element module includes a plurality of insulated gate bipolar transistors (IGBTs).