Tightly-coupled near-field communication-link connector-replacement chips

• US 9,853,696 B2
• Filed: 10/07/2013
• Issued: 12/26/2017
• Est. Priority Date: 12/23/2008
• Status: Active Grant

• Current Assignee: Molex LLC (KOCH Industries Incorporated)
• Original Assignee: Keyssa, Inc.
• Inventors: McCormack, Gary D.
• Primary Examiner(s): Tran, Tuan A
• Application Number:
  US14/047,924
• Publication Number:
  US 20140038521A1
• Time in Patent Office: 1,541 Days
• Field of Search: 455 411, 455 412, 455 39, 455 903, 3405721, 3405724, 3405727, 340571, 3405391, 34053911, 340 101, 3405722, 3405728, 3405681
• CPC Class Codes: H04B 5/48 Transceivers

Abstract

Tightly-coupled near-field transmitter/receiver pairs are deployed such that the transmitter is disposed at a terminal portion of a first conduction path, the receiver is disposed at a terminal portion of a second conduction path, the transmitter and receiver are disposed in close proximity to each other, and the first conduction path and the second conduction path are discontiguous with respect to each other. In some embodiments of the present invention, close proximity refers to the transmitter antenna and the receiver antenna being spaced apart by a distance such that, at wavelengths of the transmitter carrier frequency, near-field coupling is obtained. In some embodiments, the transmitter and receiver are disposed on separate substrates that are moveable relative to each other. In alternative embodiments, the transmitter and receiver are disposed on the same substrate.

Claims

1. A system comprising:

a plurality of transceiver chips disposed along one edge of a first substrate;

a first transceiver chip of the plurality of transceiver chips comprising;

a first near-field receiver having an input connected to a first antenna to receive a modulated first carrier signal at a first transmit carrier frequency in an extremely high frequency (EHF) range, the first antenna configured to near-field couple with a second antenna connected to a first near-field transmitter disposed on a second substrate at the first transmit carrier frequency, when the first antenna and the second antenna are disposed within a near-field coupling distance from each other at the first transmitter carrier frequency, wherein the first near-field receiver and the first near-field transmitter are located on opposite sides of the one edge of the first substrate; and

a second transceiver chip of the plurality of transceiver chips, the second transceiver chip disposed on the first substrate and adjacent to the first transceiver chip, the second transceiver chip comprising;

a second near-field transmitter having an output connected to a third antenna to transmit a modulated second carrier signal at a second transmit carrier frequency in the EHF range, the second transmit carrier frequency being the same as the first transmit carrier frequency.

2. The system of claim 1, wherein the first near-field transmitter is disposed on a first integrated circuit.

3. The system of claim 1, wherein the first near-field receiver is disposed on a first integrated circuit.

4. The system of claim 1, wherein the second near-field transmitter is disposed on a second integrated circuit.

5. The system of claim 1, wherein a second near-field receiver is disposed on a second integrated circuit.

6. The system of claim 1, wherein the first transceiver chip is embedded in a plastic package.

7. The system of claim 1, wherein the second transceiver chip is embedded in a plastic package.

8. The system of claim 1, wherein the first antenna and the first transceiver chip are embedded within a plastic package.

9. The system of claim 1, wherein the first transmit carrier frequency is substantially the same as the second transmit carrier frequency.

10. The system of claim 1, wherein the third near-field transmitter is disposed on a third integrated circuit.

11. A system comprising:

a plurality of transceiver chips disposed along one edge of a first substrate;

a first transceiver chip of the plurality of transceiver chips comprising;

a first near-field receiver having an input connected to the first antenna to receive a modulated first carrier signal at a first transmit carrier frequency, the first antenna configured to near-field couple with a second antenna connected to a first near-field transmitter at the first transmit carrier frequency, when the first antenna and the second antenna are disposed within a near-field coupling distance from each other at the first transmitter carrier frequency; and

a second transceiver chip of the plurality of transceiver chips, the second transceiver chip disposed on the first substrate and adjacent to the first transceiver chip, the second transceiver chip comprising;

a second near-field transmitter having an output connected to a third antenna to transmit a modulated second carrier signal at a second transmit carrier frequency in the EHF range, the second transmit carrier frequency being the same as the first transmit carrier frequency;

a first input terminal coupled to a first signal path; and

a second input terminal coupled to a second signal path,

wherein the second transceiver chip combines information from the first signal path and information from the second signal path to generate the modulated second carrier signal.

12. The system of claim 11, wherein the first near-field transmitter is disposed on a second substrate.