Transparent conductive component with interconnect circuit tab comprising cured organic polymeric material

• US 9,857,930 B2
• Filed: 12/16/2015
• Issued: 01/02/2018
• Est. Priority Date: 12/16/2015
• Status: Expired due to Fees

• Current Assignee: 3M Innovative Properties Company (3M Company)
• Original Assignee: 3M Innovative Properties Company (3M Company)
• Inventors: Sebastian, Muthu, Barton, Roger W., Travasso, Dominic M.
• Primary Examiner(s): Cheng, Joe H
• Application Number:
  US14/970,695
• Publication Number:
  US 20170177108A1
• Time in Patent Office: 748 Days
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2457/208 Touch screens
• CPC Class Codes: B32B 27/06 as the main or only constituent of a layer, which is next to another layer of the same or of a different material next to a layer of a particular substance B32B9/045; next to a bituminous or tarry layer B32B11/046; next to a water setting substance layer B32B13/12; next to a metal layer B32B15/08; next to a glass layer B32B17/10; next to a layer formed of natural mineral fibres or particles B32B19/045; next to a wood layer B32B21/08; next to a cellulosic plastic layer B32B23/08; next to a natural or synthetic rubber layer B32B25/08
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H05K 1/118 specially for flexible printed circuits, e.g. using folded portions
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/0108 Transparent
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/28 Applying non-metallic protective coatings H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673

Abstract

In one embodiment a transparent conductive component is described comprising a flexible transparent substrate; a transparent conductive layer disposed on the flexible transparent substrate; and a plurality of metal traces disposed on and in electrical communication with the transparent conductive layer. A portion of the flexible transparent substrate comprising the transparent conductive layer and metal traces forms an interconnect circuit tab. At least the interconnect circuit tab comprises a cured organic polymeric material disposed on the (e.g. patterned) transparent conductive layer and metal traces metal traces and flexible transparent substrate such that the cured organic polymeric material forms an exposed surface layer. The cured organic polymeric material is optionally disposed at the bezel region and/or at a central region of the transparent conductive component (e.g. touch sensor).

Claims

1. A transparent conductive component comprising:

a flexible transparent substrate;

a transparent conductive layer disposed on the flexible transparent substrate at least at a central region of the flexible transparent substrate;

a plurality of metal traces disposed on and in electrical communication with the transparent conductive layer wherein a portion of the flexible transparent substrate, metal traces and optionally the transparent conductive layer forms an interconnect circuit tab;

wherein at least the interconnect circuit tab comprises an exposed surface layer of cured organic polymeric material.

2. The transparent conductive component of claim 1 wherein at least the interconnect circuit tab is free of PET coverlay.

3. The transparent conductive component of claim 1 wherein the cured organic polymeric material is disposed at a bezel region adjacent the interconnect circuit tab of the transparent conductive component.

4. The transparent conductive component of claim 3 wherein the bezel region is free of PET coverlay.

5. The transparent conductive component of claim 1 wherein a cover layer is disposed upon a central region of the transparent conductive layer except for the interconnect tab.

6. The transparent conductive component of claim 5 wherein the cover layer is glass, a polymeric coverlay, or a cured organic polymeric material.

7. The transparent conductive component of claim 1 wherein the cured organic polymeric material has a thickness ranging from 5 to 50 microns.

8. The transparent conductive component of claim 1 wherein the cured organic polymeric material has a thickness ranging from 5 to 10 microns.

9. The transparent conductive component of claim 1 wherein the transparent conductive layer has a thickness less than 100 or 75 nanometers.

10. The transparent conductive component of claim 1 wherein the cured organic polymeric material has a tensile modulus ranging from 1 to 5 GPa.

11. The transparent conductive component of claim 1 wherein the cured organic polymeric material comprises a cured (meth)acrylate or cured epoxy polymerizable resin.

12. The transparent conductive component of claim 1 wherein the flexible transparent substrate has a thickness ranging from about 50 to 200 microns.

13. The transparent conductive component of claim 1 wherein the transparent conductive layer comprises indium tin oxide.

14. The transparent conductive component of claim 1 wherein the metal traces have a thickness ranging from about 3 to 15 microns and a width ranging from about 25 to 60 microns.

15. The transparent conductive component of claim 1 wherein the flexible transparent substrate of the interconnect circuit tab further comprises perforation.

16. The transparent conductive component of claim 1 wherein the metal traces form bonding pad near a peripheral edge of the interconnect circuit tab and a stiffening layer is disposed on the opposing surface of the flexible transparent substrate as the bonding pads.

17. The transparent conductive component of claim 16 wherein a bezel region lacks the cured organic material and comprises a corrosion resistant metal material at the exposed surface layer.

18. The transparent conductive component of claim 1 wherein the metal traces do not crack when the interconnect circuit tab is bent to a radius of 2 mm at least 40 cycles.

19. A touch sensor comprising the transparent conductive component of claim 1.

20. A method of making a transparent conductive component comprising:

providing a flexible transparent substrate comprising a transparent conductive layer disposed on the flexible transparent substrate and a plurality of metal traces disposed on the flexible transparent substrate such that the metal traces are in electrical communication with the transparent conductive layer and a portion of the flexible transparent substrate comprising the metal traces forms an interconnect circuit tab;

applying a layer of an organic polymerizable material to the metal traces and flexible transparent substrate of at least the interconnect circuit tab;

curing the organic polymerizable material.

21. The method of claim 20 wherein the organic polymerizable material comprises a dry film solder mask.

22. The method of claim 20 wherein the organic polymerizable material comprises a liquid polymerizable resin.

23. The method of claim 20 wherein the curing comprises photocuring, thermal curing, or a combination thereof.