Magnetic inductor stacks with multilayer isolation layers

• US 9,859,357 B1
• Filed: 07/14/2016
• Issued: 01/02/2018
• Est. Priority Date: 07/14/2016
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Deligianni, Hariklia, Doris, Bruce B., O'Sullivan, Eugene J., Wang, Naigang
• Primary Examiner(s): Ha, Nathan W
• Application Number:
  US15/209,803
• Publication Number:
  US 20180019295A1
• Time in Patent Office: 537 Days
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 28/10 Inductors
• CPC Class Codes: H01L 28/26 with an active material comprising an organic conducting material, e.g. conducting polymers
• CPC Class Codes: H01L 28/40 Capacitors

Abstract

A magnetic laminating structure and process includes alternating layers of a magnetic material and a multilayered insulating material, wherein the multilayered insulating material is intermediate adjacent magnetic material layers and comprises a first insulating layer abutting at least one additional insulating layer, wherein the first insulating layer and the at least one additional insulating layer comprise different dielectric materials and/or are formed by a different deposition process, and wherein the layers of the magnetic material have a cumulative thickness greater than 1 micron.

Claims

1. An inductor structure comprising:

a plurality of metal lines; and

a laminated film stack comprising alternating layers of a magnetic material and a multilayered insulating material enclosing the metal lines, wherein the multilayered insulating material is intermediate adjacent magnetic material layers and comprises a first insulating layer abutting at least one additional insulating layer, and wherein the first insulating layer and the at least one additional insulating layer comprise different dielectric materials and/or are formed by a different deposition process.

2. The inductor structure of claim 1, wherein the first insulating layer and/or the at least one additional insulating layer comprises one or more pinholes and are discontinuous between the first insulating layer and the at least one additional insulating layer.

3. The inductor structure of claim 1, wherein the magnetic material is selected from the group consisting of CoFe, CoFeB, CoZrTi, CoZrTa, CoZr, CoZrNb, CoZrMo, CoTi, CoNb, CoHf, CoW, FeCoN, FeCoAlN, CoP, FeCoP, CoPW, CoBW, CoPBW, FeTaN, FeCoBSi, FeNi, CoFeHfO, CoFeSiO, CoZrO, CoFeAlO, and combinations thereof.

4. The inductor structure of claim 1, wherein the dielectric materials are selected from the group consisting of silicon dioxide, thermal oxide Si, silicon oxynitride, magnesium oxide, aluminum oxide, boron oxide, tantalum oxide, titanium oxide, silicon nitride, and combinations thereof.

5. The inductor structure of claim 1, wherein the multilayered insulating material layer has a thickness of about one half of a thickness of the magnetic material layer.

6. The inductor structure of claim 1, wherein the multilayered insulating material layer has a thickness effective to electrically isolate each magnetic material layer from other magnetic material layers in the inductor structure.

7. The inductor structure of claim 1, wherein first insulating layer comprises silicon dioxide and the insulating layer abutting at least one additional comprises insulating layer silicon nitride.

8. The inductor structure of claim 1, wherein the multilayered insulating material layer comprises a first silicon dioxide layer overlaying a silicon nitride layer, wherein the silicon nitride layer overlays a second silicon dioxide layer.

9. The inductor structure of claim 1, wherein the multilayered insulating material layer comprises a first silicon nitride layer overlaying a silicon dioxide layer, wherein the silicon dioxide layer overlays a second silicon nitride layer.

10. An inductor structure, comprising:

a laminated film stack comprising alternating layers of a magnetic material and a multilayered insulating material, wherein the multilayered insulating material is intermediate adjacent magnetic material layers and comprises a first insulating layer abutting at least one additional insulating layer, and wherein the first insulating layer and the at least one additional insulating layer comprise different dielectric materials and/or are formed by a different deposition process.