Semiconductor device and method for manufacturing the same

• US 9,859,439 B2
• Filed: 09/12/2014
• Issued: 01/02/2018
• Est. Priority Date: 09/18/2013
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Miyairi, Hidekazu
• Primary Examiner(s): Pizarro, Marcos D
• Assistant Examiner(s): LE, LONG HUYNH
• Application Number:
  US14/484,408
• Publication Number:
  US 20150076495A1
• Time in Patent Office: 1,208 Days
• CPC Class Codes: H01L 21/02565 Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
• CPC Class Codes: H01L 21/02667 Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/78642 Vertical transistors
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

To provide a transistor having highly stable electric characteristics and also a miniaturized structure. Further, also high performance and high reliability of a semiconductor device including the transistor can be achieved. The transistor is a vertical transistor in which a first electrode having an opening, an oxide semiconductor layer, and a second electrode are stacked in this order, a gate insulating layer is provided in contact with side surfaces of the first electrode, the oxide semiconductor layer, and the second electrode, and a ring-shaped gate electrode facing the side surfaces of the first electrode, the oxide semiconductor layer, and the second electrode with the gate insulating layer interposed therebetween is provided. In the opening in the first electrode, an insulating layer in contact with the oxide semiconductor layer is embedded.

Claims

1. A semiconductor device comprising:

a first electrode;

an oxide semiconductor layer over the first electrode;

a second electrode overlapping with the first electrode with the oxide semiconductor layer interposed therebetween;

a gate insulating layer in contact with the first electrode, the oxide semiconductor layer, and the second electrode; and

a gate electrode facing a side surface of the oxide semiconductor layer with the gate insulating layer interposed therebetween,

wherein the first electrode has an opening through which the oxide semiconductor layer is exposed,

wherein an insulating layer which is in contact with the oxide semiconductor layer is embedded in the opening,

wherein an upper surface of the insulating layer is aligned with an upper surface of the first electrode,

wherein the insulating layer is in contact with a side surface of the opening,

wherein the first electrode functions as one of a source electrode and a drain electrode, and

wherein the second electrode functions as the other of the source electrode and the drain electrode, and

wherein a top surface of the gate electrode, a top surface of the gate insulating layer, and a top surface of the second electrode are coplanar.

2. The semiconductor device according to claim 1, wherein the insulating layer contains oxygen.

3. The semiconductor device according to claim 2, wherein the insulating layer entirely fills the opening, Fig. 1A.

4. The semiconductor device according to claim 2, wherein the insulating layer contains oxygen in excess of stoichiometric composition.

5. An electronic device comprising the semiconductor device according to claim 1.

6. The semiconductor device according to claim 1, wherein the first electrode, the second electrode, the gate electrode and the oxide semiconductor form a transistor.

7. The semiconductor device according to claim 1, wherein a region of the gate electrode facing the oxide semiconductor layer is formed substantially orthogonal to a top surface of the oxide semiconductor layer.

8. The semiconductor device according to claim 1, wherein a shape of the gate electrode is a ring.

9. The semiconductor device according to claim 1, wherein a shape of the first electrode is a ring.

10. A semiconductor device comprising:

a first electrode having a first opening;

a first insulating layer embedded in the first opening;

an oxide semiconductor layer that is over the first electrode and in contact with the first insulating layer;

a second electrode overlapping with the first electrode with the oxide semiconductor layer interposed therebetween;

a second insulating layer over the second electrode;

a gate insulating layer in contact with the first electrode, the oxide semiconductor layer, the second electrode, and the second insulating layer; and

a gate electrode facing a side surface of the oxide semiconductor layer with the gate insulating layer interposed therebetween,

wherein an upper surface of the first insulating layer is aligned with an upper surface of the first electrode,

wherein the first insulating layer is in contact with a side surface of the first opening,

wherein the first electrode functions as one of a source electrode and a drain electrode, and

wherein the second electrode functions as the other of the source electrode and the drain electrode, and

wherein a top surface of the gate electrode, a top surface of the gate insulating layer, and a top surface of the second electrode are coplanar.

11. The semiconductor device according to claim 10, wherein the first insulating layer contains oxygen.

12. The semiconductor device according to claim 11, wherein the first insulating layer contains oxygen in excess of stoichiometric composition.

13. The semiconductor device according to claim 10,

wherein the second electrode has a second opening, and

wherein the second insulating layer is in contact with the oxide semiconductor layer in the second opening.

14. The semiconductor device according to claim 13,

wherein the second insulating layer contains oxygen.

15. The semiconductor device according to claim 13,

wherein the second insulating layer is in contact with a side surface of the second opening.

16. An electronic device comprising the semiconductor device according to claim 10.

17. The semiconductor device according to claim 10, wherein the first insulating layer entirely fills the first opening.

18. The semiconductor device according to claim 10, wherein the first electrode, the second electrode, the gate electrode and the oxide semiconductor form a transistor.

19. The semiconductor device according to claim 10, wherein a region of the gate electrode facing the oxide semiconductor layer is formed substantially orthogonal to a top surface of the oxide semiconductor layer.

20. The semiconductor device according to claim 10, wherein a shape of the gate electrode is a ring.

21. The semiconductor device according to claim 10, wherein a shape of the first electrode is a ring.

22. A semiconductor device comprising a transistor, the transistor comprising:

a first electrode;

an insulating layer,

an oxide semiconductor layer;

a second electrode;

a gate electrode; and

a gate insulating layer,

wherein the oxide semiconductor layer is on and in electric contact with the first electrode,

wherein the oxide semiconductor layer is on and in direct contact with the insulating layer,

wherein the second electrode is on and in electric contact with the oxide semiconductor layer,

wherein each of the first electrode and the insulating layer overlaps with the second electrode with the oxide semiconductor layer interposed therebetween,

wherein the first electrode surrounds the insulating layer when seen from the above,

wherein an inner side surface of the first electrode is in contact with a side surface of the insulating layer, and

wherein a top surface of the gate electrode, a top surface of the gate insulating layer, and a top surface of the second electrode are coplanar.

23. The semiconductor device according to claim 22, wherein the insulating layer contains oxygen.

24. The semiconductor device according to claim 22, wherein a shape of the first electrode is a ring when seen from the above.

25. The semiconductor device according to claim 22, wherein a shape of the gate electrode is a ring when seen from the above.