Light emitting diode for surface mount technology, method of manufacturing the same, and method of manufacturing light emitting diode module

• US 9,859,469 B2
• Filed: 12/02/2016
• Issued: 01/02/2018
• Est. Priority Date: 06/28/2012
• Status: Active Grant

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Inventors: Chae, Jong Hyeon, Jang, Jong Min, Roh, Won Young, Suh, Dae Woong, Kang, Min Woo, Lee, Joon Sub, Kim, Hyun A
• Primary Examiner(s): COLEMAN, WILLIAM D
• Application Number:
  US15/367,464
• Publication Number:
  US 20170084790A1
• Time in Patent Office: 396 Days
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/06 within the light emitting region, e.g. quantum confinement structure or tunnel barrier
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/32 containing nitrogen
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/40 Materials therefor
• CPC Class Codes: H01L 33/405 Reflective materials
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/46 Reflective coating, e.g. dielectric Bragg reflector
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting diode (LED) includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on a portion of the first semiconductor layer, a second semiconductor layer disposed on the active layer, a first conductive layer disposed on a portion of the first semiconductor layer, a second conductive layer disposed on the second semiconductor layer, and an insulating layer overlapping the first semiconductor layer, the second semiconductor layer, and the reflection pattern, in which the insulating layer has a first region having different thicknesses and a second region having a substantially constant thickness.

Claims

1. A light emitting diode (LED), comprising:

a substrate;

a first semiconductor layer disposed on the substrate;

an active layer disposed on a portion of the first semiconductor layer;

a second semiconductor layer disposed on the active layer;

a first conductive layer disposed on a portion of the first semiconductor layer;

a second conductive layer disposed on the second semiconductor layer; and

an insulating layer overlapping the first semiconductor layer, the second semiconductor layer, and the second conductive layer,

wherein;

the insulating layer has a first region having different thicknesses and a second region having a substantially constant thickness; and

the thickness of the first region varies along a direction extending across the second semiconductor layer.

2. The LED of claim 1, wherein the second region of the insulating layer is disposed on an end portion of the first semiconductor layer.

3. The LED of claim 1, wherein the second region of the insulating layer is disposed on an end portion of the second semiconductor layer.

4. The LED of claim 1, wherein the insulating layer covers at least two sides of at least one of the second semiconductor layer and the second conductive layer.

5. The LED of claim 1, wherein the first region of the insulating layer is disposed on the first semiconductor layer.

6. The LED of claim 1, wherein the first region of the insulating layer is disposed on the second semiconductor layer.

7. The LED of claim 1, wherein at least a portion of the first region of the insulating layer has a greater thickness than the second region of the insulating layer.

8. The LED of claim 1, wherein the first conductive layer comprises a first portion configured to be in ohmic-contact with an upper surface and an end portion of the first semiconductor layer.

9. The LED of claim 2, wherein the first region of the insulating layer comprises an intermediate portion of the insulating layer and overlaps the second semiconductor layer.

10. The LED of claim 2, wherein at least one of the first conductive layer and the second conductive layer comprises a reflective material.

11. The LED of claim 4, wherein the insulating layer covers at least three sides of at least one of the second semiconductor layer and the second conductive layer.

12. A light emitting diode (LED), comprising:

a substrate;

a first semiconductor layer disposed on the substrate;

an active layer disposed on a portion of the first semiconductor layer;

a second semiconductor layer disposed on the active layer;

a first conductive layer disposed on a portion of the first semiconductor layer;

a second conductive layer disposed on the second semiconductor layer; and

an insulating layer overlapping the first semiconductor layer, the second semiconductor layer, and the second conductive layer,

wherein;

the insulating layer has a first region having different thicknesses and a second region having a substantially constant thickness; and

the thickness of the first region varies from a maximum thickness adjacent the ends of the second semiconductor layer to a minimum thickness adjacent the middle of the second semiconductor layer.

13. The LED of claim 12, wherein the minimum thickness is equal to or greater than 0.

14. A light emitting diode (LED), comprising:

a substrate;

a first semiconductor layer disposed on the substrate;

an active layer disposed on a portion of the first semiconductor layer;

a second semiconductor layer disposed on the active layer;

a first conductive layer disposed on a portion of the first semiconductor layer;

a second conductive layer disposed on the second semiconductor layer; and

an insulating layer overlapping the first semiconductor layer, the second semiconductor layer, and the second conductive layer,

wherein;

the insulating layer has a first region having different thicknesses and a second region having a substantially constant thickness; and

the first region comprises;

a first thickness adjacent to each end of the second semiconductor layer;

a second thickness adjacent to the middle of the second semiconductor layer; and

a third thickness between the first and second thicknesses that gradually varies between the first and second thicknesses.

15. A light emitting diode (LED), comprising:

a first semiconductor layer;

a mesa disposed on the first semiconductor layer, the mesa comprising an active layer and a second semiconductor layer;

a first conductive layer disposed on the mesa, the first conductive layer comprising a first n-contact region and a second n-contact region spaced apart from each other by the mesa and configured to be in ohmic-contact with an upper surface of the first semiconductor layer;

a second conductive layer disposed on the second semiconductor layer;

a lower insulating layer disposed between the mesa and the first conductive layer, the lower insulating layer configured to insulate the first conductive layer from the mesa; and

an upper insulating layer covering the first conductive layer, the upper insulating layer comprising a first hole disposed between the first and second n-contact regions and exposing a first portion of the lower insulating layer.

16. The LED of claim 15, wherein at least one of the first and second n-contact regions have at least one of generally circular shape and a generally polygonal shape in plan view.

17. The LED of claim 15, wherein at least one of the first and second n-contact regions have a rectangular shape in plan view.

18. The LED of claim 15, wherein the shape of the first hole of the upper insulating layer is different from the shape of the first and second n-contact regions in plan view.

19. The LED of claim 15, wherein the lower insulating layer comprises:

a first region having different thicknesses along a transverse direction of the second semiconductor layer; and

a second region having a substantially constant thickness.

20. The LED of claim 15, wherein:

the first n-contact region is disposed on an outer region of the first semiconductor layer; and

the second n-contact region is disposed on an inner region of the first semiconductor layer.

21. The LED of claim 15, wherein the lower insulating layer comprises a first region having different thicknesses and a second region having a substantially constant thickness.

22. The LED of claim 15, wherein the first hole of the upper insulating layer exposes the second conductive layer.

23. The LED of claim 19, wherein the thickness of the first region varies from a maximum thickness adjacent the ends of the second semiconductor layer to a minimum thickness adjacent the middle of the second semiconductor layer.

24. The LED of claim 19, wherein the first region comprises:

a first thickness adjacent to each end of the second semiconductor layer;

a second thickness adjacent to the middle of the second semiconductor layer; and

a third thickness between the first and second thicknesses that gradually varies between the first and second thicknesses.

25. The LED of claim 20, further comprising a third n-contact region disposed outwardly from the first n-contact region.

26. The LED of claim 25, wherein the second n-contact region is disposed between the first and third n-contact regions.

27. The LED of claim 21, wherein:

the first region of the lower insulating layer is disposed on the mesa; and

the second region of the lower insulating layer is disposed on an end portion of the mesa.