Compliant wearable patch capable of measuring electrical signals

• US 9,861,289 B2
• Filed: 10/22/2014
• Issued: 01/09/2018
• Est. Priority Date: 10/22/2014
• Status: Active Grant

• Current Assignee: Vivalnk Inc.
• Original Assignee: Vivalnk Inc.
• Inventors: Li, Jiang, Mei, Junfeng, Wang, Zhigang
• Primary Examiner(s): Cohen, Lee S
• Assistant Examiner(s): KIM, EUN HWA
• Application Number:
  US14/520,674
• Publication Number:
  US 20160113544A1
• Time in Patent Office: 1,175 Days
• Field of Search: 606391
• CPC Class Codes: A61B 2560/0412 Low-profile patch shaped housings
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/002 Monitoring the patient using a local or closed circuit, e.g. in a room or building A61B5/0017 takes precedence
• CPC Class Codes: A61B 5/0024 for multiple sensor units attached to the patient, e.g. using a body or personal area network
• CPC Class Codes: A61B 5/25 Bioelectric electrodes therefor
• CPC Class Codes: A61B 5/6833 Adhesive patches

Abstract

A wearable patch capable of wireless communications includes an elastic layer, an adhesive layer under the elastic layer, and a shearable electrode layer that includes: a support substrate comprising one or more openings so positioned to allow the shearable electrode layer to be sheared and elongated, and breathable, an upper electrode layer on the support substrate, and a lower electrode layer under the support substrate. The support substrate can include a via that is conductively connected to the upper electrode layer and the lower electrode layer. The lower electrode can be in contact with a user'"'"'s body and to pick up electric signals from the user'"'"'s body.

Claims

1. A wearable patch, comprising:

an elastic layer;

an adhesive layer under the elastic layer; and

a shearable electrode layer under the adhesive layer, comprising;

a support substrate;

an upper electrode layer on the support substrate; and

a lower electrode layer under the support substrate, wherein the support substrate includes a via that is conductively connected to the upper electrode layer and the lower electrode layer,

wherein the shearable electrode layer comprises one or more openings through the support substrate, the upper electrode layer, and the lower electrode layer to allow the shearable electrode layer to be sheared and elongated, and breathable,

wherein the lower electrode layer is configured to be in contact with a user'"'"'s body and to pick up electric signals from the user'"'"'s body.

2. The wearable patch of claim 1, wherein the elastic layer and the adhesive layer respectively include registered openings, which expose an upper surface of the upper electrode layer.

3. The wearable patch of claim 2, wherein the registered openings are configured to allow an electric lead to connect the upper electrode layer to an external device.

4. The wearable patch of claim 1, wherein the elastic layer and the adhesive layer are wider than the shearable electrode layer.

5. The wearable patch of claim 4, wherein the elastic layer and the adhesive layer are wider than the shearable electrode layer by an edge clearance along an edge, wherein the edge clearance has a width between 0.5 mm and 100 mm.

6. The wearable patch of claim 1, wherein the support substrate has a Young'"'"'s Modulus higher than 0.5 Gpa.

7. The wearable patch of claim 1, wherein the support substrate is thinner than 1.0 mm.

8. The wearable patch of claim 1, wherein the elastic layer has a Young'"'"'s Modulus lower than 0.3 Gpa.

9. A wearable patch capable of wireless communications, comprising:

an elastic layer;

an adhesive layer under the elastic layer; and

a shearable electrode layer under the adhesive layer, comprising;

a first circuit module comprising;

a first support substrate;

a conductive circuit embedded in the first support substrate; and

a semiconductor chip in connection with the conductive circuit; and

a second circuit module comprising;

a second support substrate;

an upper electrode layer on the second support substrate; and

a lower electrode layer under the second support substrate, wherein the second support substrate includes a via that is conductively connected to the upper electrode layer and the lower electrode layer, wherein the second circuit module comprises one or more openings through the second support substrate, the upper electrode layer, and the lower electrode layer to allow the shearable electrode layer to be sheared and elongated, and breathable,

wherein the lower electrode is configured to be in contact with a user'"'"'s body and to pick up electrical signals from the user'"'"'s body; and

a flexible ribbon that connect the first support substrate in the first circuit module and the second support substrate in the second circuit module, wherein the flexible ribbon is embedded with a connecting line configured to transmit the electrical signals from the upper electrode layer to the first circuit module.

10. The wearable patch of claim 9, wherein the first circuit module is configured to receive or transmit wireless signals in communications with an external device.

11. The wearable patch of claim 10, wherein the conductive circuit includes an antenna circuit configured to receive or transmit wireless signals in communications with an external device.

12. The wearable patch of claim 10, wherein the first circuit module is configured to wirelessly communicate with the external device based on near field communication (NFC), Wi-Fi, Bluetooth, or RFID wireless communication standard.

13. The wearable patch of claim 9, wherein the second support substrate has a Young'"'"'s Modulus higher than 0.5 Gpa.

14. The wearable patch of claim 9, wherein the second support substrate is thinner than 0.5 mm.

15. The wearable patch of claim 9, wherein the elastic layer has a Young'"'"'s Modulus lower than 0.3 Gpa.

16. The wearable patch of claim 9, the flexible ribbon comprises:

a polymer matrix; and

a conductive trace layer embedded in the polymer matrix, wherein the conductive trace layer has a zigzag structure, wherein the conductive trace layer is configured to connect the conductive circuit in the first circuit module and the upper electrode layer in the second circuit module.