Wearable device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor

• US 9,862,594 B2
• Filed: 03/12/2014
• Issued: 01/09/2018
• Est. Priority Date: 03/15/2013
• Status: Active Grant

• Current Assignee: Versana Micro Inc.
• Original Assignee: Versana Micro Inc.
• Inventors: Gogoi, Bishnu Prasanna
• Primary Examiner(s): Zarroli, Michael
• Application Number:
  US14/207,461
• Publication Number:
  US 20140268523A1
• Time in Patent Office: 1,399 Days
• CPC Class Codes: B81B 2201/0207 Bolometers
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2201/0228 Inertial sensors
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/05 Arrays
• CPC Class Codes: B81B 2207/09 Packages
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: H01L 27/14 including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation radiation-sensitive components structurally associated with one or more electric light sources only H01L31/14; couplings of light guides with optoelectronic elements G02B6/42
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H05K 7/02 Arrangements of circuit components or wiring on supporting structure
• CPC Class Codes: H10B 61/00 Magnetic memory devices, e.g. magnetoresistive RAM [MRAM] devices
• CPC Class Codes: H10N 19/00 Integrated devices, or assemblies of multiple devices, comprising at least one thermoelectric or thermomagnetic element covered by groups H10N10/00 - H10N15/00
• CPC Class Codes: H10N 30/302 Sensors
• CPC Class Codes: H10N 30/308 Membrane type
• CPC Class Codes: H10N 59/00 Integrated devices, or assemblies of multiple devices, comprising at least one galvanomagnetic or Hall-effect element covered by groups H10N50/00 - H10N52/00 MRAM devices H10B61/00

Abstract

A wearable device is provided having multiple sensors configured to detect and measure different parameters of interest. The wearable device includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The wearable device couples a first parameter to be measured directly to the direct sensor. Conversely, the wearable device can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the wearable device by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device.

Claims

1. A wearable device comprising a plurality of sensors where the plurality of sensors is configured to be worn and where the plurality of sensors comprises a monolithic integrated multi-sensor (MIMS) comprising at least two sensors of different types formed overlying a semiconductor substrate wherein the MIMS of the wearable device comprises a first sensor and a second sensor, wherein a layer is formed in common to the first and the second sensors, wherein at least a portion of the layer is etched, wherein the layer seals a cavity in the first sensor, wherein the layer seals a cavity in the second sensor, wherein a volume of the cavity of the first sensor is fixed, and wherein a volume of the cavity of the second sensor is configured to vary according to a stimulus.

2. The wearable device of claim 1 where the wearable device comprises one of a pendant, ring, bracelet, watch, necklace, or jewelry.

3. The wearable device of claim 1 where the wearable device couples to the muscular-skeletal system to measure a biological parameter.

4. The wearable device of claim 1 where the wearable device couples to clothing.

5. The wearable device of claim 1 where the MIMS of the wearable device includes a direct sensor and an indirect sensor.

6. The wearable device of claim 1 wherein the MIMS comprises at least two MEMs sensors.

7. The wearable device of claim 1 further including a second layer deposited on the MIMS where the second layer flexes in at least one sensor and where the second layer does not flex in at least one sensor of the MIMS.

8. The wearable device of claim 1 wherein the MIMS comprises at least three sensors of different types.

9. The wearable device of claim 1 wherein the layer is a deposited layer comprising at least one of silicon oxide, PSG (phosphosilicate glass), BSG (borosilicate glass), BPSG (Boron Phosphosilicate Glass), PECVD Oxide, TEOS (tetraethylorthosilicate), plasma assisted oxide, laser assisted CVD oxide, sputtered oxide, amorphous silicon, silicon nitride, silicon oxynitride, silicon carbide, silicon germanium, germanium, diamond, polymer, photoresist, or metals such as aluminum, gold, copper, silver, tungsten, nickel, titanium, chrome, platinum, or iridium.

10. The wearable device of claim 1 wherein the MIMS comprises at least one of an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, an IR sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an optical sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, or a biological sensor.

11. A wearable device comprising a plurality of sensors where the plurality of sensors is configured to be worn and where the plurality of sensors comprises a monolithic integrated multi-sensor (MIMS) comprising at least three sensors of different types wherein the MIMS of the wearable device comprises a first sensor, a second sensor, and a third sensor wherein a layer is formed in common to the first and the second sensors, wherein at least a portion of the layer is etched, wherein the layer seals a cavity in the first sensor, wherein the layer seals a cavity in the second sensor, wherein a volume of the cavity of the first sensor is fixed, and wherein a volume of the cavity of the second sensor is configured to vary according to a stimulus.

12. The wearable device of claim 11 where the wearable device comprises one of a pendant, ring, bracelet, watch, necklace, or jewelry.

13. The wearable device of claim 11 where the wearable device is configured to couple to the muscular-skeletal system to measure a biological parameter.

14. The wearable device of claim 11 where the wearable device couples to clothing.

15. The wearable device of claim 11 where the MIMS of the wearable device comprises a direct sensor and an indirect sensor.

16. The wearable device of claim 11 wherein the layer is a deposited layer comprising at least one of silicon oxide, PSG (phosphosilicate glass), BSG (borosilicate glass), BPSG (Boron Phosphosilicate Glass), PECVD Oxide, TEOS (tetraethylorthosilicate), plasma assisted oxide, laser assisted CVD oxide, sputtered oxide, amorphous silicon, silicon nitride, silicon oxynitride, silicon carbide, silicon germanium, germanium, diamond, polymer, photoresist, or metals such as aluminum, gold, copper, silver, tungsten, nickel, titanium, chrome, platinum, or iridium.

17. The wearable device of claim 11 comprises at least two of an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, an IR sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, an optical sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, or a biological sensor.

18. A wearable device comprising a plurality of sensors where the plurality of sensors is configured to be worn and where the plurality of sensors comprises a monolithic integrated multi-sensor (MIMS) comprising at least four sensors of different types wherein the MIMS of the wearable device comprises a first sensor, a second sensor, a third sensor, and a fourth sensor wherein a layer is formed in common to the first and the second sensors, wherein at least a portion of the layer is etched, wherein the layer seals a cavity in the first sensor, wherein the layer seals a cavity in the second sensor, wherein a volume of the cavity of the first sensor is fixed, and wherein a volume of the cavity of the second sensor is configured to vary according to a stimulus.

19. The wearable device of claim 18 where the wearable device comprises one of a pendant, ring, bracelet, watch, necklace, jewelry, or clothing.

20. The wearable device of claim 18 where the wearable device is configured to measure a biological parameter.

21. The wearable device of claim 18 where the wearable device couples to clothing.

22. The wearable device of claim 18 where the MIMS of the wearable device includes a direct sensor and an indirect sensor.

23. The wearable device of claim 18 further including a second layer deposited on the MIMS where the second layer flexes in at least one sensor and where the second layer does not flex in at least one sensor of the MIMS.

24. The wearable device of claim 18 wherein the MIMS comprises at least two MEMs sensors.

25. The wearable device of claim 18 wherein the MIMS comprises at least three MEMs sensors.

26. The wearable device of claim 18 wherein the MIMS comprises at least four MEMs sensors.

27. The wearable device of claim 18 wherein the layer is a deposited layer comprising at least one of silicon oxide, PSG (phosphosilicate glass), BSG (borosilicate glass), BPSG (Boron Phosphosilicate Glass), PECVD Oxide, TEOS (tetraethylorthosilicate), plasma assisted oxide, laser assisted CVD oxide, sputtered oxide, amorphous silicon, silicon nitride, silicon oxynitride, silicon carbide, silicon germanium, germanium, diamond, polymer, photoresist, or metals such as aluminum, gold, copper, silver, tungsten, nickel, titanium, chrome, platinum, or iridium.

28. The wearable device of claim 18 wherein the MIMS comprises at least two of an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, an IR sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, or a biological sensor.

29. The wearable device of claim 18 wherein the MIMS comprises at least three of an inertial sensor, a pressure sensor, a tactile sensor, a humidity sensor, a temperature sensor, a microphone, a force sensor, an IR sensor, a load sensor, a magnetic sensor, a flow sensor, a light sensor, an optical sensor, an electric field sensor, an electrical impedance sensor, a galvanic skin response sensor, a chemical sensor, a gas sensor, a liquid sensor, a solids sensor, or a biological sensor.