Integrated photonics including germanium

• US 9,864,138 B2
• Filed: 01/04/2016
• Issued: 01/09/2018
• Est. Priority Date: 01/05/2015
• Status: Active Grant

• Current Assignee: The Research Foundation for The State University of New York (State University of New York)
• Original Assignee: The Research Foundation for The State University of New York (State University of New York)
• Inventors: Coolbaugh, Douglas, Adam, Thomas, Leake, Gerald L.
• Primary Examiner(s): Diaz, Jose R
• Application Number:
  US14/987,693
• Publication Number:
  US 20160197111A1
• Time in Patent Office: 736 Days
• CPC Class Codes: G02B 2006/12061 Silicon
• CPC Class Codes: G02B 2006/121 Channel; buried or the like
• CPC Class Codes: G02B 2006/12104 Mirror; Reflectors or the like
• CPC Class Codes: G02B 2006/12123 Diode
• CPC Class Codes: G02B 2006/12169 Annealing
• CPC Class Codes: G02B 6/12002 Three-dimensional structures
• CPC Class Codes: G02B 6/13 Integrated optical circuits characterised by the manufacturing method
• CPC Class Codes: G02B 6/132 by deposition of thin films
• CPC Class Codes: G02B 6/1347 using ion implantation ion implantation in glass C03C23/0055; ion implantation in general C23C
• CPC Class Codes: G02B 6/136 by etching
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 21/02381 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/0245 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02505 consisting of more than two layers
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02573 Conductivity type
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/02639 Preparation of substrate for selective deposition
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14629 Reflectors
• CPC Class Codes: H01L 31/022408 : for devices characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02327 : the optical elements being integrated or being directly associated to the device, e.g. back reflectors optical coatings H01L31/0216
• CPC Class Codes: H01L 31/028 : including, apart from doping material or other impurities, only elements of Group IV of the Periodic Table
• CPC Class Codes: H01L 31/105 : the potential barrier being of the PIN type
• CPC Class Codes: H01L 31/1808 : including only Ge
• CPC Class Codes: Y02E 10/52 : PV systems with concentrators
• CPC Class Codes: Y02E 10/547 : Monocrystalline silicon PV cells

Abstract

A photonic structure can include in one aspect one or more waveguides formed by patterning of waveguiding material adapted to propagate light energy. Such waveguiding material may include one or more of silicon (single-, poly-, or non-crystalline) and silicon nitride.

Claims

1. A method of fabricating a photodetector structure comprising:

forming dielectric material over silicon;

etching a trench in the dielectric material extending to the silicon;

epitaxially growing germanium within the trench;

annealing germanium formed by the epitaxially growing;

repeating the epitaxially growing and the annealing until the germanium overfills the trench;

planarizing an overfill portion of the germanium; and

creating top and bottom contacts using doping and metallization, wherein the method is performed so that the top contact is in contact with the germanium, wherein the method includes forming a reduced area top doping region in the germanium having an area smaller than an area of a top of the germanium in which the top doping region is formed, and wherein the method is performed so that an entirety of a perimeter of the top doping region is spaced apart inward from a perimeter of the germanium defined at a top of the germanium.

2. The method of claim 1, wherein the epitaxially growing is performed so that germanium is formed on the-silicon.

3. The method of claim 1, wherein the epitaxially growing is performed so that the photodetector structure is absent a low-temperature SiGe or Ge buffer structure adjacent to the silicon.

4. The method of claim 1, wherein the epitaxially growing of germanium is performed without use of a doping gas so that intrinsic germanium is formed by the epitaxially growing.

5. The method of claim 1, wherein the epitaxially growing of germanium is performed using a dopant precursor so that in-situ doped germanium is formed by the epitaxially growing.

6. The method of claim 1, wherein the epitaxially growing includes performing epitaxial growing at a temperature in the range of from about 550 degrees Celsius to about 850 degrees Celsius.

7. The method of claim 1, wherein the epitaxially growing includes performing epitaxial growing at a temperature in the range of from about 550 degrees Celsius to about 850 degrees Celsius and wherein the annealing includes annealing at a temperature of between about 650 degrees Celsius to about 850 degrees Celsius.

8. The method of claim 1, wherein the epitaxially growing includes performing epitaxial growing at a temperature in the range of from about 550 degrees Celsius to about 850 degrees Celsius at a pressure in the range of from about 10 Torr to about 300 Torr using germane (GeH₄) and H₂ as a precursor and carrier gas, and wherein the annealing includes annealing at a temperature of between about 650 degrees Celsius to about 850 degrees Celsius at a pressure of between about 100 Torr to about 600 Torr.

9. The method of claim 1, wherein the growing is preceded by an ex-situ wet-chemical and an in-situ dry cleaning process for removal of organic and metallic contamination and native oxide.

10. The method of claim 1, wherein the growing is further preceded by an in-situ thermal treatment in a reducing H₂-environment for removal of sub-stoiciometric surface silicon oxide.

11. The method of claim 1, wherein the method is performed so that the top contact is in contact with the germanium and further so that an entirety of a perimeter of the top contact at a location contacting the germanium is spaced apart from a perimeter of the germanium defined at a top of the germanium.

12. The method of claim 1, wherein the method is performed so that a top doping region is formed in the germanium and wherein the method is performed so that the top contact is in contact with the germanium by being in contact with the top doping region of the germanium and further so that an entirety of a perimeter of the top contact at a location contacting the top doping region of the germanium is spaced apart from a perimeter of the top doping region.

13. The method of claim 1, wherein the method is performed so that an entirety of a perimeter of the top doping region is spaced apart inward from a perimeter of the germanium defined at a top of the germanium and wherein the method is performed so that the top contact is in contact with the top doping region of the germanium and further so that an entirety of a perimeter of the top contact at a location contacting the top doping region of the germanium is spaced apart inward from the perimeter of the top doping region.

14. The method of claim 1, wherein the method includes forming a top doping region in the germanium and wherein the method is performed so that an entirety of a perimeter of the top doping region is spaced apart inward from a perimeter of the germanium defined at a top of the germanium and wherein the method is performed so that the top contact is in contact with the top doping region of the germanium and further so that an entirety of a perimeter of the top contact at a location contacting the top doping region of the germanium is spaced apart inward from the perimeter of the top doping region.

15. The method of claim 1, wherein the annealing germanium formed by the epitaxially growing is performed without reflow of the germanium.

16. The method of claim 1, wherein the repeating the epitaxially growing and the annealing until the germanium overfills the trench includes finalizing of the overfill with a growing rather than the annealing.

17. The method of claim 1, wherein each iteration of the epitaxially growing germanium within the trench increases a height of the germanium by less than 500 nm, and wherein the etching a trench includes performing the etching so that the trench has a width of less than about 10 um.

18. The method of claim 1, wherein the etching a trench includes etching a trench in the dielectric material extending to a top elevation of the silicon, and wherein the epitaxially growing includes epitaxially growing germanium within the trench so that a bottom elevation of the germanium is at the top elevation of the silicon.

19. The method of claim 1, wherein repeating the epitaxially growing and the annealing includes performing the repeating so that prior to the overfill and subsequent to each iteration of the annealing the germanium retains a defined formation characterized by a top elevation being at a center of the formation and lower elevations at a perimeter of the formation.

20. A method of fabricating a photodetector structure comprising:

forming dielectric material over silicon;

etching a trench in the dielectric material extending to the silicon;

epitaxially growing germanium within the trench;

annealing germanium formed by the epitaxially growing;

repeating the epitaxially growing and the annealing until the germanium overfills the trench;

planarizing an overfill portion of the germanium; and

creating top and bottom contacts using doping and metallization, wherein the epitaxially growing includes performing the epitaxial growing so that initially deposited germanium formed on the silicon is epitaxially grown at a temperature in the range of from about 550 degrees Celsius to about 850 degrees Celsius.

21. The method of claim 20, wherein the method is performed so that the top contact is in contact with the germanium at a location that includes an area in alignment with a portion of the silicon that delimits the trench.

22. The method of claim 20, wherein the method includes forming a reduced area top doping region in the germanium having an area smaller than an area of a top of the germanium in which the top doping region is formed.

23. The method of claim 20, wherein the etching a trench includes etching a trench in the dielectric material extending to a top elevation of the silicon, and wherein the epitaxially growing includes epitaxially growing germanium within the trench so that a bottom elevation of the germanium is at the top elevation of the silicon.

24. The method of claim 20, wherein repeating the epitaxially growing and the annealing includes performing the repeating so that prior to the overfill and subsequent to each iteration of the annealing the germanium retains a defined formation characterized by a top elevation being at a center of the formation and lower elevations at a perimeter of the formation.

25. The method of claim 20, wherein the epitaxially growing includes using a variable temperature.

26. The method of claim 20, wherein the epitaxially growing is performed so that the photodetector structure is absent a low-temperature buffer structure adjacent to the silicon.

27. The method of claim 20, wherein the epitaxially growing is performed so that the germanium is formed directly on the silicon to form an epitaxially grown germanium formation and further so that the photodetector structure is absent a low-temperature buffer structure between the silicon and the epitaxially grown germanium formation.

28. The method of claim 20, wherein the method includes forming a reduced area shallow top doping region spaced apart from an oxide trench so that there is defined spacing distance between a perimeter of the germanium and a perimeter of a doping region, and wherein the oxide trench is the trench formed by the etching a trench in the dielectric material.

29. The method of claim 20, wherein the method is performed so that the top contact is in contact with the germanium, wherein the method includes forming a reduced area top doping region in the germanium having an area smaller than an area of a top of the germanium in which the top doping region is formed, and wherein the method is performed so that an entirety of a perimeter of the top doping region is spaced apart inward from a perimeter of the germanium defined at a top of the germanium.

30. The method of claim 20, wherein the method includes forming a top doping region in the germanium and wherein the method is performed so that an entirety of a perimeter of the top doping region is spaced apart inward from a perimeter of the germanium defined at a top of the germanium and wherein the method is performed so that the top contact is in contact with the top doping region of the germanium and further so that an entirety of a perimeter of the top contact at a location contacting the top doping region of the germanium is spaced apart inward from the perimeter of the top doping region.

31. The method of claim 20, wherein the method is performed so that the silicon includes a silicon portion delimiting the trench, and wherein the method is performed so that the top contact is in contact with the germanium at a location that includes an area in alignment with the silicon portion delimiting the trench.

32. A method of fabricating a photodetector structure comprising:

forming dielectric material over silicon;

etching a trench in the dielectric material extending to the silicon;

epitaxially growing germanium within the trench;

annealing germanium formed by the epitaxially growing;

repeating the epitaxially growing and the annealing until the germanium overfills the trench;

planarizing an overfill portion of the germanium; and

creating top and bottom contacts using doping and metallization, wherein the method is performed so that the silicon includes a silicon portion delimiting the trench, and wherein the method is performed so that the top contact is in contact with the germanium at a location that includes an area in alignment with the silicon portion delimiting the trench.

33. The method of claim 32, wherein an entirety of a perimeter of the top contact at the location contacting the germanium is substantially uniformly disposed with respect to a perimeter of the germanium defined at a top of the germanium.

34. The method of claim 33, wherein the method is performed so that the top contact is in contact with the germanium by being in contact with a doping region of the germanium and wherein the method is performed so that the entirety of the perimeter of the top contact at the location contacting the germanium is substantially uniformly disposed with respect to a perimeter of the germanium by being substantially uniformly spaced apart from the perimeter of the germanium defined at a top of the germanium.

35. A method of fabricating a photodetector structure comprising:

forming dielectric material over silicon;

etching a trench in the dielectric material extending to the silicon;

epitaxially growing germanium within the trench;

annealing germanium formed by the epitaxially growing;

repeating the epitaxially growing and the annealing until the germanium overfills the trench;

planarizing an overfill portion of the germanium; and

creating top and bottom contacts using doping and metallization, wherein the method includes forming a top doping region in the germanium and wherein the method is performed so that an entirety of a perimeter of the top doping region is spaced apart inward from a perimeter of the germanium defined at a top of the germanium and wherein the method is performed so that the top contact is in contact with the top doping region of the germanium and further so that an entirety of a perimeter of the top contact at a location contacting the top doping region of the germanium is spaced apart inward from the perimeter of the top doping region.

36. A method of fabricating a photodetector structure comprising:

forming dielectric material over silicon;

etching a trench in the dielectric material extending to the silicon;

epitaxially growing germanium within the trench;

annealing germanium formed by the epitaxially growing;

repeating the epitaxially growing and the annealing until the germanium overfills the trench;

planarizing an overfill portion of the germanium; and

creating top and bottom contacts using doping and metallization, wherein the epitaxially growing includes performing epitaxial growing at a temperature in the range of from about 550 degrees Celsius to about 850 degrees Celsius at a pressure in the range of from about 10 Torr to about 300 Torr using germane (GeH₄) and H₂ as a precursor and carrier gas, and wherein the annealing includes annealing at a temperature of between about 650 degrees Celsius to about 850 degrees Celsius at a pressure of between about 100 Torr to about 600 Torr.