Wireless communication device

• US 9,864,943 B2
• Filed: 09/16/2014
• Issued: 01/09/2018
• Est. Priority Date: 07/14/2011
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Dokai, Yuya
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Hu, Jennifer F
• Application Number:
  US14/487,209
• Publication Number:
  US 20150001305A1
• Time in Patent Office: 1,211 Days
• Field of Search: 343748
• CPC Class Codes: G06K 19/0726 the arrangement including a circuit for tuning the resonance frequency of an antenna on the record carrier
• CPC Class Codes: G06K 19/07722 the record carrier being multilayered, e.g. laminated sheets flat articles in general, see B32B37/00
• CPC Class Codes: G06K 19/07754 the connection being galvanic
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 1/38 formed by a conductive layer on an insulating support patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142
• CPC Class Codes: H01Q 1/48 Earthing means; Earth screens; Counterpoises
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: H01Q 9/06 Details
• CPC Class Codes: H04B 5/24 Inductive coupling
• CPC Class Codes: H04B 5/77 for interrogation

Abstract

A wireless communication device includes a wireless IC device, a multilayer substrate including a stack of a plurality of dielectric layers, a resonant circuit that is connected to the wireless IC device and that includes a capacitance element provided in the multilayer substrate and an inductance element provided outside the multilayer substrate, and a radiation conductor connected to the resonant circuit.

Claims

1. A wireless communication device comprising:

a wireless IC device;

a multilayer substrate including a stack of a plurality of dielectric layers;

a resonant circuit connected to the wireless IC device, the resonant circuit including a capacitance element and an inductance element; and

a radiation conductor connected to the resonant circuit;

wherein

of the capacitance element and the inductance element included in the resonant circuit, only the capacitance element is provided inside of the multilayer substrate;

the inductance element of the resonant circuit is provided outside of the multilayer substrate and not inside the multilayer substrate;

each of the capacitance element and the inductance element are connected in parallel to the wireless IC device; and

the inductance element and the radiation conductor are provided on or in a common substrate.

2. The wireless communication device according to claim 1, wherein the capacitance element includes:

first and second electrode patterns located on at least one of the plurality of dielectric layers; and

third and fourth electrode patterns located on at least another one of the plurality of dielectric layers and opposed to the first and second electrode patterns;

wherein

the first and fourth electrode patterns have an identical or substantially identical potential, and the second and third electrode patterns have an identical or substantially identical potential; and

in plan view in a stacking direction of the plurality of dielectric layers, an outline of one of the first and third electrode patterns is located inside an outline of the other of the first and third electrode patterns, and an outline of one of the second and fourth electrode patterns is located inside an outline of the other of the second and fourth electrode patterns.

3. The wireless communication device according to claim 1, wherein

the multilayer substrate includes first and second external electrodes disposed on one of a principal surface of the multilayer substrate and a back surface of the multilayer substrate opposite to the principal surface, the first and second external electrodes being arranged to connect the multilayer substrate to a printed circuit board;

the capacitance element includes first and second electrode patterns located on at least one of the plurality of dielectric layers, the first and second electrode patterns being opposed to the first and second external electrodes in a stacking direction of the plurality of dielectric layers; and

in plan view in the stacking direction, the first electrode pattern has the same or substantially the same outline dimensions as outline dimensions of the first external electrode, and the second electrode pattern has the same or substantially the same outline dimensions as outline dimensions of the second external electrode.

4. The wireless communication device according to claim 1, wherein the inductance element includes a loop defined by at least a portion of the radiation conductor.

5. The wireless communication device according to claim 1, wherein

the wireless IC device is configured to input/output a high frequency signal obtained by modulating a carrier by using information that is to be transmitted;

and

a resonant frequency of the resonant circuit is equal or substantially equal to a frequency of the carrier.

6. The wireless communication device according to claim 1, wherein the wireless IC device is mounted on a principal surface of the multilayer substrate.

7. The wireless communication device according to claim 1, wherein the radiation conductor defines a ground conductor located on or in a printed circuit board.