Use of an external getter to reduce package pressure
First Claim
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1. A method of reducing pressure between wafers during a wafer level package (WLP) bonding process, the method comprising:
- providing a window cap wafer and a device wafer, each of the window cap wafer and the device wafer having a substrate and a seal structure formed on a portion of a surface of the substrate, the substrate being defined by a WLP region and an external region, and the seal structure forming a perimeter of the WLP region;
depositing a first layer of getter material on at least a portion of the external region and outside the seal structure and the WLP region of the substrate of at least one of the window cap wafer and the device wafer;
aligning the window cap wafer with the device wafer;
bonding the window cap wafer and the device wafer to each other to form the wafer level package; and
during the bonding, removing outgassed elements across the window cap wafer and the device wafer using the first layer of getter material.
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Abstract
A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.
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Citations
20 Claims
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1. A method of reducing pressure between wafers during a wafer level package (WLP) bonding process, the method comprising:
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providing a window cap wafer and a device wafer, each of the window cap wafer and the device wafer having a substrate and a seal structure formed on a portion of a surface of the substrate, the substrate being defined by a WLP region and an external region, and the seal structure forming a perimeter of the WLP region; depositing a first layer of getter material on at least a portion of the external region and outside the seal structure and the WLP region of the substrate of at least one of the window cap wafer and the device wafer; aligning the window cap wafer with the device wafer; bonding the window cap wafer and the device wafer to each other to form the wafer level package; and during the bonding, removing outgassed elements across the window cap wafer and the device wafer using the first layer of getter material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of reducing wafer vacuum pressure in a wafer level package (WLP), the method comprising:
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providing a device wafer having a first substrate, and a window cap wafer having a second substrate; forming a seal structure on a respective surface of each of the first and second substrates, the surface of each substrate being defined by a WLP region and an external region, and the seal structure forming a perimeter of the WLP region; depositing a first layer of getter material on at least a portion of the external region of the surface of the first substrate; depositing a second layer of getter material on at least a portion of the external region of the surface of the second substrate; activating the first and the second layers of getter material; and bonding the window cap wafer and the device wafer together under vacuum conditions to form the wafer level package having a sealed cavity within the WLP regions, the first and second layers of getter material being configured to remove a portion of material outgassed by at least one of the window cap wafer and the device wafer during the bonding, thereby reducing the wafer vacuum pressure of the wafer level package. - View Dependent Claims (11, 12, 13)
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14. A wafer for use in forming a wafer level package comprising:
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a substrate having a seal structure formed on a portion of a surface of the substrate, the surface defined by a wafer level package (WLP) region and an external region, the seal structure forming a perimeter of the WLP region, and the external region including a saw-to-reveal (STR) region; and a discontinuous layer of getter material disposed on at least a portion of the STR region of the surface of the substrate and outside the seal structure and the WLP region. - View Dependent Claims (15, 16, 17, 18, 19, 20)
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Specification