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Use of an external getter to reduce package pressure

  • US 9,865,519 B2
  • Filed: 01/10/2017
  • Issued: 01/09/2018
  • Est. Priority Date: 10/20/2015
  • Status: Active Grant
First Claim
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1. A method of reducing pressure between wafers during a wafer level package (WLP) bonding process, the method comprising:

  • providing a window cap wafer and a device wafer, each of the window cap wafer and the device wafer having a substrate and a seal structure formed on a portion of a surface of the substrate, the substrate being defined by a WLP region and an external region, and the seal structure forming a perimeter of the WLP region;

    depositing a first layer of getter material on at least a portion of the external region and outside the seal structure and the WLP region of the substrate of at least one of the window cap wafer and the device wafer;

    aligning the window cap wafer with the device wafer;

    bonding the window cap wafer and the device wafer to each other to form the wafer level package; and

    during the bonding, removing outgassed elements across the window cap wafer and the device wafer using the first layer of getter material.

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