Use of an external getter to reduce package pressure

• US 9,865,519 B2
• Filed: 01/10/2017
• Issued: 01/09/2018
• Est. Priority Date: 10/20/2015
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Black, Stephen H., Kennedy, Adam M.
• Primary Examiner(s): Potter, Roy
• Application Number:
  US15/402,329
• Publication Number:
  US 20170148695A1
• Time in Patent Office: 364 Days
• CPC Class Codes: H01L 21/3221 of silicon bodies, e.g. for gettering
• CPC Class Codes: H01L 21/3225 Thermally inducing defects using oxygen present in the silicon body for intrinsic gettering H01L21/3226 takes precedence
• CPC Class Codes: H01L 21/4817 for containers, e.g. caps H01L21/4871 takes precedence
• CPC Class Codes: H01L 21/54 Providing fillings in containers, e.g. gas fillings
• CPC Class Codes: H01L 23/041 the container being a hollow construction having no base used as a mounting for the semiconductor body
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/26 including materials for absorbing or reacting with moisture or other undesired substances , e.g. getters

Abstract

A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.

Claims

1. A method of reducing pressure between wafers during a wafer level package (WLP) bonding process, the method comprising:

providing a window cap wafer and a device wafer, each of the window cap wafer and the device wafer having a substrate and a seal structure formed on a portion of a surface of the substrate, the substrate being defined by a WLP region and an external region, and the seal structure forming a perimeter of the WLP region;

depositing a first layer of getter material on at least a portion of the external region and outside the seal structure and the WLP region of the substrate of at least one of the window cap wafer and the device wafer;

aligning the window cap wafer with the device wafer;

bonding the window cap wafer and the device wafer to each other to form the wafer level package; and

during the bonding, removing outgassed elements across the window cap wafer and the device wafer using the first layer of getter material.

2. The method of claim 1, wherein the first layer of getter material is deposited on the substrate of the device wafer, and further comprising:

depositing a second layer of getter material on at least a portion of the external region and outside the seal structure and the WLP region of the substrate of the window cap wafer; and

during the bonding, removing the outgassed elements across the window cap wafer and the device wafer using the first and the second layers of getter material.

3. The method of claim 1, wherein the first layer of getter material reduces pressure in a region between the window cap wafer and the device wafer during the bonding.

4. The method of claim 1, wherein the external region comprises a saw-to-reveal (STR) region and the first layer of getter material is deposited in the STR region, and wherein depositing the first layer of getter material includes depositing the first layer of getter material in the STR region.

5. The method of claim 4, wherein depositing the first layer of getter material includes depositing the first layer of getter material in a discontinuous pattern within the STR region.

6. The method of claim 1, further comprising activating the first layer of getter material.

7. The method of claim 6, wherein the bonding is performed under vacuum, and wherein activating the first layer of getter material includes heating the first layer of getter material to a temperature of at least 300°

C.

8. The method of claim 1, further comprising depositing a third layer of getter material on at least a portion of the WLP region of at least one of the window cap wafer and the device wafer.

9. The method of claim 8, wherein the first layer of getter material reduces a load on the third layer of getter material.

10. A method of reducing wafer vacuum pressure in a wafer level package (WLP), the method comprising:

providing a device wafer having a first substrate, and a window cap wafer having a second substrate;

forming a seal structure on a respective surface of each of the first and second substrates, the surface of each substrate being defined by a WLP region and an external region, and the seal structure forming a perimeter of the WLP region;

depositing a first layer of getter material on at least a portion of the external region of the surface of the first substrate;

depositing a second layer of getter material on at least a portion of the external region of the surface of the second substrate;

activating the first and the second layers of getter material; and

bonding the window cap wafer and the device wafer together under vacuum conditions to form the wafer level package having a sealed cavity within the WLP regions, the first and second layers of getter material being configured to remove a portion of material outgassed by at least one of the window cap wafer and the device wafer during the bonding, thereby reducing the wafer vacuum pressure of the wafer level package.

11. The method of claim 10, wherein the external region comprises a saw-to-reveal (STR) region and the first and second layers of getter material are deposited in the STR region.

12. The method of claim 11, wherein depositing the first and second layers of getter material includes depositing the first and second layers of getter material in a discontinuous pattern within the STR region.

13. The method of claim 10, further comprising depositing a third layer of getter material within the WLP region of at least one of the window cap wafer and the device wafer.

14. A wafer for use in forming a wafer level package comprising:

a substrate having a seal structure formed on a portion of a surface of the substrate, the surface defined by a wafer level package (WLP) region and an external region, the seal structure forming a perimeter of the WLP region, and the external region including a saw-to-reveal (STR) region; and

a discontinuous layer of getter material disposed on at least a portion of the STR region of the surface of the substrate and outside the seal structure and the WLP region.

15. The wafer of claim 14, wherein the discontinuous layer of getter material is disposed in the STR region as a pattern of elongated ovals within the STR region.

16. The wafer of claim 14, wherein the discontinuous layer of getter material is disposed in the STR region as a pattern of circles within the STR region.

17. The wafer of claim 14, wherein the discontinuous layer of getter material is disposed in the STR region as a pattern of rectangles within the STR region.

18. The wafer of claim 14, wherein the discontinuous layer of getter material is disposed in the STR region as a pattern of squares within the STR region.

19. The wafer of claim 14, wherein the getter material comprises at least one of titanium (Ti), zirconium (Zr), ruthenium (Ru), tantalum (Ta), hafnium (Hf), lanthanum (La) and molybdenum (Mo).

20. The wafer of claim 14, further comprising an additional layer of getter material disposed in the WLP region.