Composite heat sink structures
First Claim
1. An apparatus comprising:
- a composite heat sink structure including;
a thermally conductive base, the thermally conductive base including a main heat transfer surface to couple to at least one component to be cooled;
a compressible, continuous sealing member;
a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base;
an in situ molded member molded over and affixed to the thermally conductive base, and molded over and securing in place the sealing member retainer, wherein a coolant-carrying compartment resides between the thermally conductive base and the in situ molded member and wherein the in situ molded member is a unitary member that contacts a surface of the thermally conductive base opposite to the main heat transfer surface and wraps around at least a portion of the thermally conductive base to secure the in situ molded member to the thermally conductive base absent use of separate fasteners; and
a coolant inlet and a coolant outlet, the coolant inlet and coolant outlet being in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow therethrough.
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Accused Products
Abstract
Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.
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Citations
19 Claims
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1. An apparatus comprising:
a composite heat sink structure including; a thermally conductive base, the thermally conductive base including a main heat transfer surface to couple to at least one component to be cooled; a compressible, continuous sealing member; a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; an in situ molded member molded over and affixed to the thermally conductive base, and molded over and securing in place the sealing member retainer, wherein a coolant-carrying compartment resides between the thermally conductive base and the in situ molded member and wherein the in situ molded member is a unitary member that contacts a surface of the thermally conductive base opposite to the main heat transfer surface and wraps around at least a portion of the thermally conductive base to secure the in situ molded member to the thermally conductive base absent use of separate fasteners; and a coolant inlet and a coolant outlet, the coolant inlet and coolant outlet being in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow therethrough. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An apparatus comprising:
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at least one electronic component; and a composite heat sink structure coupled to the at least one electronic component to facilitate cooling thereof, the composite heat sink structure including; a thermally conductive base, the thermally conductive base including a main heat transfer surface coupled to the at least one electronic component; a compressible, continuous sealing member; a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; an in situ molded member molded over and affixed to the thermally conductive base, and molded over and securing in place the sealing member retainer, wherein a coolant-carrying compartment resides between the thermally conductive base and the in situ molded member and wherein the in situ molded member is a unitary member that contacts a surface of the thermally conductive base opposite to the main heat transfer surface and wraps around at least a portion of the thermally conductive base to secure the in situ molded member to the thermally conductive base absent use of separate fasteners; and a coolant inlet and a coolant outlet, the coolant inlet and the coolant outlet being in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow therethrough. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification