Methods of forming conductive and insulating layers
First Claim
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1. A method of making a semiconductor device, comprising:
- providing a substrate;
disposing a semiconductor die over the substrate;
depositing an encapsulant around the semiconductor die;
forming an insulating material over a portion of the encapsulant and a portion of the semiconductor die using an inkjet printing process; and
forming a first conductive layer over the insulating material, wherein a portion of the first conductive layer over the semiconductor die is contained completely within a footprint of the insulating material.
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Abstract
Methods of forming conductive and insulating layers for semiconductor devices and packages. Substrate is provided with integrated circuit device and interconnect structure mounted thereon, the interconnect structure adjacent the integrated circuit device. The integrated circuit device and portions of the interconnect structure can be covered with an encapsulation exposing a portion of the interconnect structure. Conductive material is formed over the exposed portion of the interconnect structure by a depositing process followed by a heating process to alter the chemical properties of the conductive material. Optionally, a dispersing process may be incorporated.
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Citations
25 Claims
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1. A method of making a semiconductor device, comprising:
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providing a substrate; disposing a semiconductor die over the substrate; depositing an encapsulant around the semiconductor die; forming an insulating material over a portion of the encapsulant and a portion of the semiconductor die using an inkjet printing process; and forming a first conductive layer over the insulating material, wherein a portion of the first conductive layer over the semiconductor die is contained completely within a footprint of the insulating material. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of making a semiconductor device, comprising:
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providing a semiconductor die; depositing an encapsulant around the semiconductor die, wherein an upper surface of the semiconductor die is exposed from the encapsulant; printing an insulating material over the upper surface of the semiconductor die; and forming a first conductive layer over the insulating material, wherein the insulating material electrically isolates the first conductive layer from the upper surface of the semiconductor die. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A semiconductor device, comprising:
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a substrate; a semiconductor die disposed over the substrate; an encapsulant deposited around the semiconductor die; an insulating print material formed over the semiconductor die; and a first conductive layer including a contact pad formed over the insulating print material within a footprint of the semiconductor die, wherein the first conductive layer is electrically isolated from the semiconductor die by the insulating print material. - View Dependent Claims (15, 16, 17, 18, 19)
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20. A semiconductor device, comprising:
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a semiconductor die; an encapsulant deposited around the semiconductor die; an insulating print material on the semiconductor die; and a first conductive layer formed on the insulating print material, wherein the first conductive layer contacts the encapsulant outside a footprint of the semiconductor die and the first conductive layer is physically separated from the semiconductor die by the insulating print material. - View Dependent Claims (21, 22, 23, 24, 25)
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Specification