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Methods of forming conductive and insulating layers

  • US 9,865,575 B2
  • Filed: 07/05/2016
  • Issued: 01/09/2018
  • Est. Priority Date: 06/27/2013
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor device, comprising:

  • providing a substrate;

    disposing a semiconductor die over the substrate;

    depositing an encapsulant around the semiconductor die;

    forming an insulating material over a portion of the encapsulant and a portion of the semiconductor die using an inkjet printing process; and

    forming a first conductive layer over the insulating material, wherein a portion of the first conductive layer over the semiconductor die is contained completely within a footprint of the insulating material.

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