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Ball grid array system

  • US 9,867,295 B2
  • Filed: 01/07/2014
  • Issued: 01/09/2018
  • Est. Priority Date: 01/07/2014
  • Status: Active Grant
First Claim
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1. An information handling system (IHS), comprising:

  • an IHS chassis; and

    a circuit board located in the IHS chassis and having a circuit board surface, the circuit board including;

    a plurality of pads that are located on the circuit board surface; and

    a ball grid array component that is soldered to the circuit board, the ball grid array component including;

    a plurality of soldered connections between the ball grid array component and the circuit board, wherein each of the plurality of soldered connections has a first melting temperature and has been soldered to a respective one of the plurality of pads during a reflow process; and

    a plurality of conductive spacer members that each engage the circuit board and the ball grid array component to complete a ball grid array monitoring circuit that is configured to measure a strength of the plurality of soldered connections, wherein each of the plurality of conductive spacer members has a second melting temperature greater than the first melting temperature such that each of the plurality of conductive spacer members provide a mechanical stop between the ball grid array component and the circuit board during the reflow process that is performed at a temperature below the second melting temperature, and a minimum height for each of the plurality of soldered connections.

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