Ball grid array system

• US 9,867,295 B2
• Filed: 01/07/2014
• Issued: 01/09/2018
• Est. Priority Date: 01/07/2014
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Patel, Bhavesh, Farkas, Sandor, Ables, Wallace Huson
• Primary Examiner(s): ZARNEKE, DAVID A
• Application Number:
  US14/148,856
• Publication Number:
  US 20150195910A1
• Time in Patent Office: 1,463 Days
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: B23K 3/0623 for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
• CPC Class Codes: B23K 3/087 Soldering or brazing jigs, fixtures or clamping means
• CPC Class Codes: G01R 31/71 Testing of solder joints
• CPC Class Codes: G06F 1/181 Enclosures for portable computers G06F1/1613
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2224/13028 the bump connector being disposed on at least two separate bonding areas, e.g. bond pads
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/1319 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/13582 Two-layer coating
• CPC Class Codes: H01L 2224/13647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13655 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/14051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/14131 being uniform, i.e. having a uniform pitch across the array
• CPC Class Codes: H01L 2224/14135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/14136 Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/14179 : Corner adaptations, i.e. disposition of the bump connectors at the corners of the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/14505 : Bump connectors having different materials
• CPC Class Codes: H01L 2224/14517 : including bump connectors providing primarily mechanical bonding
• CPC Class Codes: H01L 2224/16106 : the bump connector connecting one bonding area to at least two respective bonding areas
• CPC Class Codes: H01L 2224/16227 : the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/17051 : Bump connectors having different shapes
• CPC Class Codes: H01L 2224/17135 : Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/17136 : Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/17517 : including bump connectors providing primarily mechanical support
• CPC Class Codes: H01L 2224/811 : the bump connector being supplied to the parts to be connected in the bonding apparatus
• CPC Class Codes: H01L 2224/81139 : Guiding structures on the body
• CPC Class Codes: H01L 2224/81193 : wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/8121 : using a reflow oven
• CPC Class Codes: H01L 2224/8123 : Polychromatic or infrared lamp heating
• CPC Class Codes: H01L 2224/81815 : Reflow soldering
• CPC Class Codes: H01L 2224/81907 : Intermediate bonding, i.e. intermediate bonding step for temporarily bonding the semiconductor or solid-state body, followed by at least a further bonding step
• CPC Class Codes: H01L 23/562 : Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/14 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H05K 1/144 : Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 1/145 : Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
• CPC Class Codes: H05K 2201/0221 : Insulating particles having an electrically conductive coating
• CPC Class Codes: H05K 2201/10022 : Non-printed resistor
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2203/041 : Solder preforms in the shape of solder balls
• CPC Class Codes: H05K 2203/159 : Using gravitational force; Processing against the gravity direction; Using centrifugal force
• CPC Class Codes: H05K 2203/162 : Testing a finished product, e.g. heat cycle testing of solder joints
• CPC Class Codes: H05K 2203/163 : Monitoring a manufacturing process
• CPC Class Codes: H05K 3/3436 : having an array of bottom contacts, e.g. pad grid array or ball grid array components
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

Systems and methods for providing a ball grid array connection include providing a circuit board having a circuit board surface including a plurality of pads. A ball grid array component includes a plurality of solder balls. The ball grid array component is coupled to the circuit board to position each of the plurality of solder balls adjacent a respective one of the plurality of pads. A solder reflow process is then performed to produce a plurality of soldered connections from each of the plurality of solder balls and a respective one of the plurality of pads. At least one spacer member is provided between the ball grid array component and the circuit board during the solder reflow process to provide a mechanical stop between the ball grid array component and the circuit board and a minimum height for each of the plurality of soldered connections.

Claims

1. An information handling system (IHS), comprising:

an IHS chassis; and

a circuit board located in the IHS chassis and having a circuit board surface, the circuit board including;

a plurality of pads that are located on the circuit board surface; and

a ball grid array component that is soldered to the circuit board, the ball grid array component including;

a plurality of soldered connections between the ball grid array component and the circuit board, wherein each of the plurality of soldered connections has a first melting temperature and has been soldered to a respective one of the plurality of pads during a reflow process; and

a plurality of conductive spacer members that each engage the circuit board and the ball grid array component to complete a ball grid array monitoring circuit that is configured to measure a strength of the plurality of soldered connections, wherein each of the plurality of conductive spacer members has a second melting temperature greater than the first melting temperature such that each of the plurality of conductive spacer members provide a mechanical stop between the ball grid array component and the circuit board during the reflow process that is performed at a temperature below the second melting temperature, and a minimum height for each of the plurality of soldered connections.

2. The IHS of claim 1, further comprising:

at least one connection in at least one of the circuit board and the ball grid array component that engages the plurality of conductive spacer members to complete the ball grid array monitoring circuit.

3. The IHS of claim 1, wherein at least one of the plurality of conductive spacer members includes a resistor.

4. The IHS of claim 2, further comprising:

a ball grid array monitoring engine coupled to the ball grid array monitoring circuit and configured to measure a strength of the ball grid array monitoring circuit to measure the strength of the plurality of soldered connections.

5. The IHS of claim 4, wherein the ball grid array monitoring engine is provided by a Basic Input/Output System (BIOS) that is provided in the IHS chassis.

6. The IHS of claim 1, wherein the plurality of conductive spacer members includes at least one first conductive spacer member and at least one second conductive spacer member, and wherein the at least one first conductive spacer member is located on a first side of a perimeter of the plurality of soldered connections, and the at least one second conductive spacer member is located on a second side of the perimeter of the plurality of soldered connections that is different than the first side.

7. The IHS of claim 1, wherein the ball grid array component includes a processor that is coupled to the plurality of soldered connections.

8. The IHS of claim 1, wherein the circuit board is a first circuit board, and wherein the ball grid array component includes a second circuit board.