Package structure and manufacturing method thereof

• US 9,868,630 B2
• Filed: 08/16/2016
• Issued: 01/16/2018
• Est. Priority Date: 05/20/2016
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chang, Kai-Fung, Leu, Len-Yi, Tsai, Lien-Yao
• Primary Examiner(s): Moore, Whitney T
• Assistant Examiner(s): GALVIN III, JOSEPH M
• Application Number:
  US15/237,639
• Publication Number:
  US 20170334711A1
• Time in Patent Office: 518 Days
• CPC Class Codes: B81B 2203/0315 Cavities
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: B81C 2203/036 Fusion bonding
• CPC Class Codes: B81C 3/001 Bonding of two components

Abstract

A package structure includes a device chip, a MEMS die, a cap structure, and an eutectic bonding layer. The MEMS die is over the device chip and includes a substrate having a plurality of cavities and a conductive layer covering a bottom surface and sidewalls of each of the cavities. The cap structure is coupled to the MEMS die, and the cap structure includes a base substrate having at least one seal ring located in the cavities and a bonding layer covering a first surface and at least part of sidewalls of the seal ring. The first surface of the seal ring faces the MEMS die. The eutectic bonding layer is located between the conductive layer and the bonding layer in the cavities. In addition, a method of manufacturing the package structure is provided.

Claims

1. A package structure, comprising

a device chip;

a MEMS die over the device chip, the MEMS die comprising;

a substrate having a plurality of cavities; and

a conductive layer covering a bottom surface and sidewalls of each of the cavities;

a cap structure coupled to the MEMS die, the cap structure comprising;

a base substrate having at least one seal ring, wherein the seal ring is located in the cavities; and

a bonding layer covering a first surface and at least part of sidewalls of the seal ring, wherein the first surface of the seal ring faces the MEMS die; and

an eutectic bonding layer located between the conductive layer and the bonding layer in the cavities.

2. The package structure according to claim 1, wherein part of the device chip and part of the MEMS die form a microelectromechanical system (MEMS) device.

3. The package structure according to claim 2, wherein the cap structure further comprises a plurality of stopper protrusions disposed corresponding to the MEMS device and surrounded by the seal ring, and a height of the stopper protrusions is less than a height of the seal ring.

4. The package structure according to claim 3, wherein the cap structure further comprises an anti-stiction layer over a first surface of the stopper protrusions, and the first surface of the stopper protrusions faces the MEMS device.

5. The package structure according to claim 4, wherein a material of the anti-stiction layer is the same as a material of the bonding layer.

6. The package structure according to claim 1, wherein the bonding layer aligns with another part of the sidewalls of the seal ring.

7. The package structure according to claim 1, wherein a material of the conductive layer comprises aluminum and a material of the bonding layer comprises germanium.

8. The package structure according to claim 1, wherein a material of the eutectic bonding layer comprises aluminum-germanium alloy.

9. A package structure, comprising

a device chip;

a MEMS die disposed over and electrically connected to the device chip, the MEMS die comprising;

a substrate having a plurality of cavities; and

a conductive layer disposed within and conformally covering each of the cavities;

a cap structure disposed on and coupled to the MEMS die, the cap structure comprising;

a base substrate having a plurality of first protrusions and a plurality of second protrusions, the second protrusions are located between two adjacent first protrusions, each of the first protrusions comprises a first portion and a second portion, the second portion connects the first portion and the base substrate, and the first portion is inserted into the corresponding cavity; and

a bonding layer covering the first portion; and

an eutectic bonding layer located between the conductive layer and the boding layer in the cavities.

10. The package structure according to claim 9, wherein part of the device chip and part of the MEMS die form a microelectromechanical system (MEMS) device.

11. The package structure according to claim 10, wherein the cap structure further comprises an anti-stiction layer over a first surface of the second protrusions, and the first surface of the second protrusions faces the MEMS device.

12. The package structure according to claim 11, wherein the second protrusions are disposed corresponding to the MEMS device.

13. The package structure according to claim 11, wherein a material of the anti-stiction layer is the same as a material of the bonding layer.

14. The package structure according to claim 9, wherein a material of the conductive layer comprises aluminum and a material of the bonding layer comprises germanium.

15. The package structure according to claim 9, wherein a material of the eutectic bonding layer comprises aluminum-germanium alloy.

16. The package structure according to claim 9, wherein the bonding layer aligns with sidewalls of the second portion of the first protrusions.

17. A method of manufacturing a package structure, comprising:

providing a device wafer;

providing a MEMS wafer over the device wafer;

bonding the MEMS wafer with the device wafer;

forming a plurality of cavities in a substrate of the MEMS wafer and forming a conductive layer over the substrate of the MEMS wafer and in the cavities;

providing a cap wafer;

forming a plurality of seal rings in the cap wafer and forming a bonding layer partially coveting the plurality of seal rings;

bonding the plurality of seal rings of the cap wafer with the plurality of cavities of the MEMS wafer through eutectic bonding of the bonding layer on the plurality of seal rings and the conductive layer within the plurality of cavities; and

dicing the device wafer, the MEMS wafer, and the cap wafer to form a package structure.

18. The method according to claim 17, wherein the step of forming a plurality of cavities in a substrate of the MEMS wafer and forming a conductive layer over the substrate of the MEMS wafer and in the cavities comprises:

patterning the substrate of the MEMS wafer to form the plurality of cavities;

forming a conductive material layer over the substrate and in the plurality of cavities in a conformal manner; and

patterning the conductive material layer to form the conductive layer over the substrate and in the plurality of cavities.

19. The method according to claim 17, wherein the step of forming a plurality of seal rings on the cap wafer and forming a bonding layer partially covering the plurality of seal rings comprises:

patterning a base substrate of the cap wafer to form first portions of the plurality of seal rings;

forming a bonding material layer over the base substrate and the first portions;

patterning the base substrate and the bonding material layer to form second portions of the plurality of seal rings and the bonding layer covering the first portions; and

performing a surface treatment to the bonding layer.

20. The method according to claim 19, wherein the step of patterning the base substrate and the bonding material layer further comprises:

forming a plurality of stopper protrusions and an anti-stiction layer over the plurality of stopper protrusions.