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Thermo-compression head, soldering system, and LED tube lamp

  • US 9,869,431 B2
  • Filed: 10/20/2016
  • Issued: 01/16/2018
  • Est. Priority Date: 09/28/2014
  • Status: Active Grant
First Claim
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1. A thermo-compression head for heating a solder and bonding at least one first soldering pad on a first object and at least one second soldering pad on a second object, the first object overlaying a part of the second object, the at least one second soldering pad being between the first object and the second object, the at least one first soldering pad being aligned with the at least one second soldering pad, wherein the thermo-compression head comprises:

  • a bonding plane for touching the second object;

    a restraining plane adjacent to the bonding plane for touching the first object;

    at least one concave guiding tank formed on the bonding plane, and wherein an end of the at least one concave guiding tank is opened near an edge of the bonding plane while an opposite end of the at least one concave guiding tank is closed; and

    at least one concave molding tank formed on the restraining plane and positioned beside the at least one concave guiding tank, and wherein the at least one concave molding tank communicates with the at least one concave guiding tank via the open end of the at least one concave guiding tank.

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