Low temperature fabrication of lateral thin film varistor
First Claim
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1. A lateral thin film varistor device, comprising:
- a substrate;
a first dielectric layer on the substrate;
a second dielectric layer on the first dielectric layer;
a continuous, varistor layer on the second dielectric layer and comprising alternating regions of a first metal oxide layer and a second metal oxide layer located between, and in contact with, two laterally spaced electrodes for lateral flow of transient voltages; and
a third dielectric layer on said continuous, varistor layer.
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Abstract
A structure and method for fabricating a laterally configured thin film varistor surge protection device using low temperature sputtering techniques which do not damage IC device components contiguous to the varistor being fabricated. The lateral thin film varistor may include a continuous layer of alternating regions of a first metal oxide layer and a second metal oxide layer formed between two laterally spaced electrodes using a low temperature sputtering process followed by a low temperature annealing process.
16 Citations
20 Claims
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1. A lateral thin film varistor device, comprising:
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a substrate; a first dielectric layer on the substrate; a second dielectric layer on the first dielectric layer; a continuous, varistor layer on the second dielectric layer and comprising alternating regions of a first metal oxide layer and a second metal oxide layer located between, and in contact with, two laterally spaced electrodes for lateral flow of transient voltages; and a third dielectric layer on said continuous, varistor layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of forming a lateral thin film varistor device, comprising:
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forming a continuous, varistor layer comprising alternating regions of a first metal oxide layer and a second metal oxide layer between two laterally spaced electrodes for lateral flow of transient voltages, and using a sputtering process followed by an annealing process, including forming the continuous, varistor layer above separate first and second dielectric layers; and forming a third dielectric layer on said continuous, varistor layer. - View Dependent Claims (12, 13, 14, 15)
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16. A lateral thin film varistor device, comprising:
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a substrate; a first dielectric layer on the substrate; a capping layer on the first dielectric layer a second dielectric layer on the first dielectric layer; an isolation layer on the second dielectric layer; a continuous, varistor layer in the isolation layer, above the second dielectric layer and comprising alternating regions of a first metal oxide layer and a second metal oxide layer located between, and in contact with, two laterally spaced electrodes; and a third dielectric layer on said continuous, varistor layer. - View Dependent Claims (17, 18, 19, 20)
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Specification