Cobalt etch back
First Claim
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1. A method of processing a substrate in a chamber, the method comprising:
- cyclically,(a) conducting a deposition, comprising exposing a substrate to a boron-containing halide gas and an additive selected from the group consisting of hydrogen-containing and halogen-containing gases for a duration sufficient to selectively deposit a first layer of boron-containing halide material on a surface of a mask on the substrate, the mask comprising a material consisting of elements selected from the group consisting of nitrogen, oxygen, carbon, and titanium atoms, and the duration sufficient to selectively deposit a second layer of boron-containing halide material on a surface of a non-volatile metal of the substrate selected from the group consisting of cobalt, iron, manganese, nickel, platinum, palladium, and ruthenium on the substrate, wherein the first layer is thicker than the second layer due at least in part to chemical selectivity; and
(b) conducting an activation, comprising exposing the substrate to an activation gas and an activation source that ionizes the activation gas to form an activated activation gas to react with the first and second layers of boron-containing halide material on the mask and the non-volatile metal to form etch products in a self-limiting etch of the substrate;
wherein (a) and (b) are conducted for a first set of cycles, followed by (a) and (b) conducted for a second set of cycles, in which the duration of (a) is longer in the first set of cycles than the duration of (a) in the second set of cycles resulting in a net deposition process, and in which the duration of (b) in the second set of cycles is longer than the duration of (b) in the first set of cycles, resulting in a net etch process.
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Abstract
Methods of etching cobalt on substrates are provided. Some methods involve exposing the substrate to a boron-containing halide gas and an additive, and exposing the substrate to an activation gas and a plasma. Additives improve selectively depositing a thicker layer of a boron-containing halide material on a surface of a mask than on a surface of a metal. Additives include H2, CH4, CF4, NF3, and Cl2. Boron-containing halide gases include BCl3, BBr3, BF3, and BI3. Exposures may be performed in two or more cycles, with variations in durations and/or bias power for each exposure in the two or more cycles.
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Citations
19 Claims
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1. A method of processing a substrate in a chamber, the method comprising:
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cyclically, (a) conducting a deposition, comprising exposing a substrate to a boron-containing halide gas and an additive selected from the group consisting of hydrogen-containing and halogen-containing gases for a duration sufficient to selectively deposit a first layer of boron-containing halide material on a surface of a mask on the substrate, the mask comprising a material consisting of elements selected from the group consisting of nitrogen, oxygen, carbon, and titanium atoms, and the duration sufficient to selectively deposit a second layer of boron-containing halide material on a surface of a non-volatile metal of the substrate selected from the group consisting of cobalt, iron, manganese, nickel, platinum, palladium, and ruthenium on the substrate, wherein the first layer is thicker than the second layer due at least in part to chemical selectivity; and (b) conducting an activation, comprising exposing the substrate to an activation gas and an activation source that ionizes the activation gas to form an activated activation gas to react with the first and second layers of boron-containing halide material on the mask and the non-volatile metal to form etch products in a self-limiting etch of the substrate; wherein (a) and (b) are conducted for a first set of cycles, followed by (a) and (b) conducted for a second set of cycles, in which the duration of (a) is longer in the first set of cycles than the duration of (a) in the second set of cycles resulting in a net deposition process, and in which the duration of (b) in the second set of cycles is longer than the duration of (b) in the first set of cycles, resulting in a net etch process. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification