Monolithic microwave integrated circuits

• US 9,871,008 B2
• Filed: 11/04/2016
• Issued: 01/16/2018
• Est. Priority Date: 08/12/2010
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Inventors: Sanders, Paul W., Burger, Wayne R., Dao, Thuy B., Keys, Joel E., Petras, Michael F., Pryor, Robert A., Ren, Xiaowei
• Primary Examiner(s): Nicely, Joseph C
• Application Number:
  US15/344,174
• Publication Number:
  US 20170077051A1
• Time in Patent Office: 438 Days
• CPC Class Codes: H01L 21/76898 formed through a semiconductor substrate
• CPC Class Codes: H01L 21/823475 interconnection or wiring or contact manufacturing related aspects
• CPC Class Codes: H01L 2223/6616 Vertical connections, e.g. vias
• CPC Class Codes: H01L 2223/6655 Matching arrangements, e.g. arrangement of inductive and capacitive components
• CPC Class Codes: H01L 2223/6683 for monolithic microwave integrated circuit [MMIC]
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2225/06541 Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
• CPC Class Codes: H01L 23/481 Internal lead connections, e.g. via connections, feedthrough structures
• CPC Class Codes: H01L 23/5223 Capacitor integral with wiring layers
• CPC Class Codes: H01L 23/5226 Via connections in a multilevel interconnection structure
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 27/0617 comprising components of the field-effect type H01L27/0251 takes precedence
• CPC Class Codes: H01L 27/0629 in combination with diodes, or resistors, or capacitors
• CPC Class Codes: H01L 27/0727 in combination with diodes, or capacitors or resistors
• CPC Class Codes: H01L 28/10 : Inductors
• CPC Class Codes: H01L 28/40 : Capacitors
• CPC Class Codes: H01L 29/7816 : Lateral DMOS transistors, i.e. LDMOS transistors
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/13062 : Junction field-effect transistor [JFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1423 : Monolithic Microwave Integrated Circuit [MMIC]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H03F 3/195 : in integrated circuits

Abstract

Low Q associated with passive components of monolithic integrated circuits (ICs) when operated at microwave frequencies can be avoided or mitigated using high resistivity (e.g., ≧100 Ohm-cm) semiconductor substrates and lower resistance inductors for the IC. This eliminates significant in-substrate electromagnetic coupling losses from planar inductors and interconnections overlying the substrate. The active transistor(s) are formed in the substrate proximate the front face. Planar capacitors are also formed over the front face of the substrate. Various terminals of the transistor(s), capacitor(s) and inductor(s) are coupled to a ground plane on the rear face of the substrate using through-substrate-vias to minimize parasitic resistance. Parasitic resistance associated with the planar inductors and heavy current carrying conductors is minimized by placing them on the outer surface of the IC where they can be made substantially thicker and of lower resistance. The result is a monolithic microwave IC previously unobtainable.

Claims

1. A monolithic microwave integrated circuit, comprising:

a semiconductor substrate having a front surface, a rear surface, and a bulk resistivity equal to or greater than 100 Ohm-cm;

a transistor proximate to the front surface of the semiconductor substrate, wherein the transistor has a doped common region in the semiconductor substrate;

multiple conductive through-substrate vias (TSVs) extending from the front surface to the rear surface of the semiconductor substrate;

electrical interconnections overlying the front surface of the semiconductor substrate to electrically couple the transistor with at least some of the multiple conductive TSVs; and

a reference node supported by a rear surface of the semiconductor substrate and electrically coupled with at least some of the multiple conductive TSVs.

2. The integrated circuit of claim 1, further comprising:

a dielectric layer over the front surface of the semiconductor substrate and overlying the doped common region; and

multiple interlayer conductive vias in the first dielectric layer and electrically coupled to the doped common region and to the electrical interconnections.

3. The integrated circuit of claim 1, wherein first ones of the multiple conductive TSVs electrically couple the doped common region of the transistor to the reference node.

4. The integrated circuit of claim 3, further comprising:

a capacitor that is monolithically formed over the semiconductor substrate, wherein second ones of the multiple conductive TSVs electrically couple a first terminal of the capacitor to the reference node.

5. The integrated circuit of claim 1, further comprising:

at least one passive component over the front surface of the semiconductor substrate and electrically coupled to the transistor.

6. The integrated circuit of claim 5, wherein the at least one passive component comprises:

at least one capacitor over the front surface of the semiconductor substrate.

7. The integrated circuit of claim 5, wherein the at least one passive component comprises:

at least one inductor over the front surface of the semiconductor substrate.

8. The integrated circuit of claim 5, wherein the at least one passive component comprises:

two monolithic capacitors formed over the front surface of the semiconductor substrate, each having first and second terminals; and

two monolithic inductors formed over the front surface of the semiconductor substrate, each having first and second terminals,

wherein the first terminal of the first capacitor is coupled to the first terminal of the first inductor and the second terminal of the first capacitor is coupled to a first of the multiple conductive TSVs, and the second terminal of the first inductor is coupled to the doped common region of the transistor,

wherein the second capacitor and second inductor are serially coupled to form a combination, the combination having first and second terminals, and

wherein the first terminal of the combination is coupled to a doped output region of the transistor and the second terminal of the combination is coupled to a second of the multiple conductive TSVs.

9. The integrated circuit of claim 1, wherein each of the multiple conductive TSVs comprise:

a central conductor; and

a dielectric liner between the central conductor and the semiconductor substrate.

10. A monolithic microwave integrated circuit comprising:

a semiconductor substrate having a front surface, a rear surface, and a bulk resistivity equal to or greater than 100 Ohm-cm;

a Laterally-Diffused-Metal-Oxide-Semiconductor (LDMOS) transistor proximate to the front surface of the semiconductor substrate, wherein the LDMOS transistor has a gate, a drain region, and a source region;

multiple conductive through-substrate vias (TSVs) extending from the front surface of the semiconductor substrate to the rear surface of the semiconductor substrate; and

electrical interconnections overlying the front surface of the semiconductor substrate to electrically couple the transistor with at least some of the multiple conductive TSVs.

11. The integrated circuit of claim 10, wherein each of the multiple conductive TSVs comprise:

a central conductor; and

a dielectric liner between the central conductor and the semiconductor substrate.

12. The integrated circuit of claim 10, further comprising:

a reference node supported by the rear surface of the semiconductor substrate and electrically coupled with at least some of the multiple conductive TSVs.

13. The integrated circuit of claim 12, wherein:

the electrical interconnections electrically couple the source region with first ones of the multiple conductive TSVs, and the first ones of the multiple conductive TSVs are connected to the reference node.

14. The integrated circuit of claim 10, wherein the semiconductor substrate has a bulk resistivity equal to or greater than 500 Ohm-cm.

15. The integrated circuit of claim 10, wherein the semiconductor substrate substantially comprises float zone silicon.

16. A monolithic microwave integrated circuit comprising:

a semiconductor substrate having a front surface and a rear surface;

a transistor at least partially formed in the semiconductor substrate, wherein the transistor includes a doped common region;

a first dielectric layer over the front surface of the semiconductor substrate;

a first through-substrate via (“

TSV”

) extending through the first dielectric layer and the semiconductor substrate, wherein a region of the semiconductor substrate through which the first TSV passes has a bulk resistivity equal to or greater than 1000 Ohm-cm;

an interlayer via in the first dielectric layer, the first TSV electrically coupled to the doped common region of the transistor through the interlayer via;

a passive component formed over the front surface of the semiconductor substrate;

planar interconnections overlying the front surface of the semiconductor substrate and coupling the transistor and the passive component; and

a reference node supported by the rear surface of the semiconductor substrate, which is electrically coupled to the transistor through the first TSV.

17. The integrated circuit of claim 16, wherein the passive component comprises:

a capacitor formed over the front surface of the semiconductor substrate.

18. The integrated circuit of claim 17, wherein the capacitor is a monolithically formed planar capacitor.

19. The integrated circuit of claim 16, wherein the passive component comprises:

an inductor formed over the front surface of the semiconductor substrate.

20. The integrated circuit of claim 19, wherein the inductor is a monolithically formed planar inductor.