Method for transfer of semiconductor devices

• US 9,871,023 B2
• Filed: 03/18/2016
• Issued: 01/16/2018
• Est. Priority Date: 03/20/2015
• Status: Active Grant

• Current Assignee: Rohinni, Inc., Rohinni LLC
• Original Assignee: Rohinni LLC
• Inventors: Huska, Andrew, Peterson, Cody, Adams, Clinton, Kupcow, Sean
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US15/074,994
• Publication Number:
  US 20160276195A1
• Time in Patent Office: 669 Days
• CPC Class Codes: G02F 1/133603 with LEDs
• CPC Class Codes: G02F 1/133605 including specially adapted reflectors
• CPC Class Codes: G02F 1/133606 including a specially adapted diffusing, scattering or light controlling members
• CPC Class Codes: G02F 1/133612 Electrical details
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/67265 of substrates stored in a container, a magazine, a carrier, a boat or the like
• CPC Class Codes: H01L 21/67715 Changing the direction of the conveying path
• CPC Class Codes: H01L 21/67778 involving loading and unloading of wafers
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 21/68742 characterised by a lifting arrangement, e.g. lift pins
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2221/68322 Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68381 : Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: H01L 2223/54413 : comprising digital information, e.g. bar codes, data matrix
• CPC Class Codes: H01L 2223/54426 : for alignment
• CPC Class Codes: H01L 2223/54433 : containing identification or tracking information
• CPC Class Codes: H01L 2223/54486 : Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 2224/16238 : the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/75252 : in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75261 : Laser
• CPC Class Codes: H01L 2224/75262 : in the lower part of the bonding apparatus, e.g. in the apparatus chuck
• CPC Class Codes: H01L 2224/75303 : of the pressing surface
• CPC Class Codes: H01L 2224/7531 : of other parts
• CPC Class Codes: H01L 2224/75314 : Auxiliary members on the pressing surface
• CPC Class Codes: H01L 2224/75317 : Removable auxiliary member
• CPC Class Codes: H01L 2224/75651 : Belt conveyor
• CPC Class Codes: H01L 2224/75753 : Means for optical alignment, e.g. sensors
• CPC Class Codes: H01L 2224/75824 : Translational mechanism
• CPC Class Codes: H01L 2224/75842 : Rotational mechanism
• CPC Class Codes: H01L 2224/75843 : Pivoting mechanism
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/81205 : Ultrasonic bonding
• CPC Class Codes: H01L 2224/81224 : using a laser
• CPC Class Codes: H01L 2224/83224 : using a laser
• CPC Class Codes: H01L 23/53242 : the principal metal being a noble metal, e.g. gold
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/75 : Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/89 : using at least one connector not provided for in any of the groups H01L24/81 - H01L24/86
• CPC Class Codes: H01L 25/0753 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/405 : Wavelength
• CPC Class Codes: H01L 2933/0066 : relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method of transferring semiconductor devices to a product substrate includes positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and actuating a transfer mechanism to cause the transfer mechanism to engage a second surface of the semiconductor wafer. The second surface of the semiconductor wafer is opposite the first surface of the semiconductor wafer. Actuating the transfer mechanism includes causing a pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position. The method further includes detaching the particular semiconductor device from the second surface of the semiconductor wafer, and attaching a particular semiconductor device to the product substrate.

Claims

1. A method for transferring semiconductor devices to a product substrate, the method comprising:

providing a transfer mechanism including a pin and an actuator configured to cause the pin to thrust reciprocatively, and a fixing device configured to emit energy to affix the semiconductor devices to the product substrate;

positioning a surface of the product substrate to face a first surface of a semiconductor wafer having the semiconductor devices thereon, and positioning the semiconductor wafer and the product substrate in a transfer position with respect to the transfer mechanism;

actuating the actuator of the transfer mechanism to cause the pin to engage a second surface of the semiconductor wafer, the second surface of the semiconductor wafer being opposite the first surface of the semiconductor wafer, and the actuating the transfer mechanism including causing the pin to thrust against a position on the second surface of the semiconductor wafer corresponding to a position of a particular semiconductor device located on the first surface of the semiconductor wafer, and retracting the pin to a rest position;

detaching the particular semiconductor device from the second surface of the semiconductor wafer; and

attaching the particular semiconductor device to the product substrate by applying energy directly on the product substrate during a transfer operation via the fixing device.

2. The method according to claim 1, further comprising disposing a circuit trace on the surface of the product substrate,

wherein the attaching the particular semiconductor device to the product substrate includes attaching the particular semiconductor device to the product substrate via the circuit trace.

3. The method according to claim 1, wherein the particular semiconductor is a first particular semiconductor device, and

wherein the method further comprises repositioning the first surface of the semiconductor wafer with respect to the surface of the product substrate so as to align a second particular semiconductor device to be attached to the surface of the product substrate.

4. The method according to claim 1, further comprising applying a conductive material to the surface of the product substrate prior to the attaching of the particular semiconductor device,

wherein the attaching the particular semiconductor device to the product substrate includes attaching the particular semiconductor device in contact with the conductive material.

5. The method according to claim 1, further comprising applying a sealant over the attached particular semiconductor device.

6. The method according to claim 1, wherein the providing further includes providing a product frame configured to secure the product substrate.

7. The method according to claim 1, wherein the providing further includes providing a wafer substrate frame configured to secure the semiconductor wafer.