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Ceramic cover for electronic device housing

  • US 9,871,898 B2
  • Filed: 05/08/2013
  • Issued: 01/16/2018
  • Est. Priority Date: 05/08/2013
  • Status: Active Grant
First Claim
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1. An electronic device enclosure, comprising:

  • a unitary ceramic cover formed from a sapphire material, comprising;

    a top surface;

    a bottom surface; and

    a blind recess formed into the bottom surface and extending toward the top surface, the blind recess defined by a recessed surface and interior sidewalls extending from the recessed surface to a bottom surface of the unitary ceramic cover;

    a peripheral structure overmolded over a portion of the unitary ceramic cover and into the blind recess and that defines an attachment member secured within the blind recess along the interior sidewalls and the recessed surface; and

    an outer housing member coupled with the peripheral structure opposite the unitary ceramic cover, whereina thickness of the unitary ceramic cover is less than 5 millimeters.

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