Ceramic cover for electronic device housing

• US 9,871,898 B2
• Filed: 05/08/2013
• Issued: 01/16/2018
• Est. Priority Date: 05/08/2013
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Kwong, Kelvin
• Primary Examiner(s): Wu, James
• Application Number:
  US13/890,141
• Publication Number:
  US 20140334077A1
• Time in Patent Office: 1,714 Days
• Field of Search: 174 50, 174520, 174521, 174559, 174560, 174561, 174563, 36167901, 36167921, 3616793, 361732, 349 58, 368276, 368286, 368287, 368291, 368295, 368316, 368317
• CPC Class Codes: G06F 1/1626 with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
• CPC Class Codes: G06F 1/1656 Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203
• CPC Class Codes: H04M 1/0249 Details of the mechanical connection between the housing parts or relating to the method of assembly
• CPC Class Codes: H04M 1/185 Improving the rigidity of the casing or resistance to shocks
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

An electronic device having an enclosure formed from at least one ceramic cover and a peripheral structure adjacent the periphery of the ceramic cover is disclosed. The peripheral structure can be secured adjacent to the ceramic cover with an attachment member. The ceramic cover can include a recess to receive the attachment member. The peripheral structure can be molded adjacent the ceramic cover so that a gapless interface can be formed between the peripheral structure and the periphery of the ceramic cover.

Claims

1. An electronic device enclosure, comprising:

a unitary ceramic cover formed from a sapphire material, comprising;

a top surface;

a bottom surface; and

a blind recess formed into the bottom surface and extending toward the top surface, the blind recess defined by a recessed surface and interior sidewalls extending from the recessed surface to a bottom surface of the unitary ceramic cover;

a peripheral structure overmolded over a portion of the unitary ceramic cover and into the blind recess and that defines an attachment member secured within the blind recess along the interior sidewalls and the recessed surface; and

an outer housing member coupled with the peripheral structure opposite the unitary ceramic cover, wherein

a thickness of the unitary ceramic cover is less than 5 millimeters.

2. The electronic device enclosure as recited in claim 1, wherein the ceramic cover comprises at least one of sapphire and zirconia.

3. The electronic device enclosure as recited in claim 1, wherein the blind recess is a laser ablated recess extending into a peripheral portion of the ceramic cover.

4. The electronic device enclosure as recited in claim 1,

wherein the attachment member comprises at least one tenon configured to extend into the blind recess of the ceramic cover.

5. The electronic device enclosure as recited in claim 4, wherein the tenon comprises an angled tenon, and wherein the recess comprises a dovetail recess configured to interlock mechanically with the angled tenon.

6. The electronic device enclosure as recited in claim 4, wherein the tenon of the attachment member is integral with a portion of the peripheral structure.

7. The electronic device enclosure as recited in claim 1, wherein overmolding of the peripheral structure to the ceramic cover results in a gap-free interface.

8. The electronic device enclosure as recited in claim 1, wherein the peripheral structure comprises a polymer.

9. The electronic device enclosure as recited in claim 1, wherein the peripheral structure comprises ceramic fibers.

10. The electronic device enclosure as recited in claim 1, wherein the peripheral structure and the ceramic cover have substantially similar coefficients of thermal expansion.

11. The electronic device enclosure as recited in claim 10, wherein the peripheral structure comprises additives that are configured to modify the coefficient of thermal expansion of the peripheral structure, the additives including particles or fibers made of a ceramic material.

12. The electronic device enclosure as recited in claim 1,

wherein the outer housing member has at least one securement feature that mechanically interlocks with the peripheral structure, thereby coupling the peripheral structure and the outer housing member.

13. The electronic device enclosure as recited in claim 1, wherein

the ceramic cover has a Vickers hardness that is greater than seven hundred.

14. The electronic device enclosure as recited in claim 1,

wherein the blind recess extends into the ceramic cover by at least 0.3 millimeter.

15. The electronic device enclosure as recited in claim 1, wherein the ceramic cover is substantially transparent.

16. The electronic device enclosure as recited in claim 1, wherein the ceramic cover has an at least partly crystalline structure.

17. The electronic device enclosure of claim 1, wherein:

the top surface of the unitary ceramic cover defines at least a portion of a front of the unitary ceramic cover; and

the entire front of the unitary ceramic cover is unobstructed by the peripheral structure.

18. The electronic device enclosure of claim 17, wherein the entire front of the unitary ceramic cover is completely exposed.

19. A consumer electronic device, comprising:

a monolithic sapphire cover defining outer and inner surfaces of the consumer electronic device and defining an exterior surface of a display, the monolithic sapphire cover having a recessed channel defined by interior sidewalls extending from the inner surface to a recessed surface that is substantially parallel to, and positioned less than 5 millimeters from, the inner surface;

a peripheral structure molded over a side surface of the monolithic ceramic cover and along the interior sidewalls and recessed surface of the recessed channel; and

an outer housing member having a securement feature that mechanically interlocks with a portion of the peripheral structure.

20. The consumer electronic device as recited in claim 19, wherein:

the ceramic cover comprises at least one of sapphire and zirconia; and

the consumer electronic device is one of;

a media player, a media storage device, a portable digital assistant, a tablet personal computer, a computer, a mobile phone, a smart phone, a global positioning system unit, or a remote control.

21. The consumer electronic device as recited in claim 19, wherein a portion of the peripheral structure that is molded along the interior sidewalls and recessed surface defines an attachment member that couples the monolithic sapphire cover and the peripheral structure.

22. An electronic device enclosure, comprising:

a ceramic cover formed from a sapphire material and defining first and second surfaces of the electronic device enclosure, the ceramic cover having a laser-etched blind recess defined by interior sidewalls extending into the second surface by a distance of less than 5 millimeters and toward the first surface;

an overmolded peripheral structure, comprising;

a side portion overmolded over a side surface of the ceramic cover; and

a tenon formed into the laser-etched blind recess and abutting the interior sidewalls to mechanically interlock the ceramic cover and the peripheral structure; and

an outer housing member coupled with the peripheral structure.

23. The electronic device enclosure as recited in claim 22, wherein:

the laser-etched blind recess is a first laser-etched blind recess;

the tenon is a first tenon;

the electronic device enclosure further comprises;

a second laser-etched blind recess extending inwardly from the side surface of the ceramic cover;

a second tenon member coupled to the side portion of the peripheral section.

24. The electronic device enclosure as recited in claim 23, wherein the first and second laser-etched blind recesses are formed using laser ablation.

25. The electronic device enclosure as recited in claim 23, wherein the second tenon is formed into the second laser-etched blind recess of the ceramic cover.

26. The electronic device enclosure as recited in claim 22, wherein the laser-etched blind recess is positioned at a peripheral portion of the ceramic cover.

27. The electronic device enclosure as recited in claim 26, wherein the tenon in the recess provides a substantially gap-free interface between the peripheral structure and the ceramic cover.

28. The electronic device enclosure as recited in claim 22:

wherein the outer housing member has at least one securement feature that engages the peripheral structure.