Method for dividing a composite into semiconductor chips, and semiconductor chip
First Claim
Patent Images
1. Method for dividing a composite into a plurality of semiconductor chips along a dividing pattern, comprising the following steps:
- a) providing a composite which has a carrier, a semiconductor layer sequence and a functional layer;
b) forming separating trenches in the carrier along the dividing pattern, the separating trenches extending through the carrier and exposing the functional layer; and
c) cutting through the functional layer by means of coherent radiation along the dividing pattern;
wherein the divided semiconductor chips each have a part of the semiconductor layer sequence, of the carrier and of the functional layer.
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Abstract
The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
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Citations
16 Claims
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1. Method for dividing a composite into a plurality of semiconductor chips along a dividing pattern, comprising the following steps:
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a) providing a composite which has a carrier, a semiconductor layer sequence and a functional layer; b) forming separating trenches in the carrier along the dividing pattern, the separating trenches extending through the carrier and exposing the functional layer; and c) cutting through the functional layer by means of coherent radiation along the dividing pattern; wherein the divided semiconductor chips each have a part of the semiconductor layer sequence, of the carrier and of the functional layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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- 12. Semiconductor chip having a semiconductor body, a carrier body and a functional layer which are disposed one on another in a vertical direction, wherein, on at least one side surface of the semiconductor chip, the functional layer has traces of a material removal by coherent radiation, and wherein the carrier body has a grooved structure extending through the carrier and exposing the functional layer, resulting from a chemical material removal.
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16. Method for dividing a composite into a plurality of semiconductor chips along a dividing pattern, comprising the following steps:
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a) providing a composite which has a carrier, a semiconductor layer sequence and a functional layer; b) forming separating trenches in the carrier along the dividing pattern by means of a chemical method, the separating trenches extending through the carrier and exposing the functional layer; and c) cutting through the functional layer by means of coherent radiation along the dividing pattern; wherein the divided semiconductor chips each have a part of the semiconductor layer sequence, of the carrier and of the functional layer.
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Specification