Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same

• US 9,874,585 B2
• Filed: 06/30/2015
• Issued: 01/23/2018
• Est. Priority Date: 11/04/2010
• Status: Expired due to Fees

• Current Assignee: FormFactor Beaverton, Inc. (FormFactor Incorporated)
• Original Assignee: Cascade Microtech Incorporated (FormFactor Incorporated)
• Inventors: Smith, Kenneth R., Jolley, Mike, Strid, Eric, Hanaway, Peter, Gleason, K. Reed, Duckworth, Koby L.
• Primary Examiner(s): Vazquez, Arleen M
• Assistant Examiner(s): SHAH, NEEL D
• Application Number:
  US14/788,288
• Publication Number:
  US 20150301082A1
• Time in Patent Office: 938 Days
• Field of Search: 324754, 324756, 32475501
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/0735 arranged on a flexible frame or film
• CPC Class Codes: H01L 21/4825 Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
• CPC Class Codes: H01L 21/4828 Etching etching for cleaning without patterning H01L21/4835
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

Resilient electrical interposers that may be utilized to form a plurality of electrical connections between a first device and a second device, as well as systems that may utilize the resilient electrical interposers and methods of use and/or fabrication thereof. The resilient electrical interposers may include a resilient dielectric body with a plurality of electrical conduits contained therein. The plurality of electrical conduits may be configured to provide a plurality of electrical connections between a first surface of the electrical interposer and/or the resilient dielectric body and a second, opposed, surface of the electrical interposer and/or the resilient dielectric body. The systems and methods disclosed herein may provide for improved vertical compliance, improved contact force control, and/or improved dimensional stability of the resilient electrical interposers.

Claims

1. A method of increasing a dimensional stability of a plurality of electrical conduits that are contained within a resilient dielectric body of a probe head, wherein the resilient dielectric body includes a first surface and an opposed second surface, wherein each of the plurality of electrical conduits extends from the first surface to the opposed second surface, and further wherein the plurality of electrical conduits is configured to form a plurality of electrical connections with a device under test during testing of the device under test with the probe head, the method comprising:

stretching the resilient dielectric body from a first configuration to a stretched configuration;

assembling the resilient dielectric body and a space transformer by applying the resilient dielectric body to the space transformer, wherein the applying includes maintaining the resilient dielectric body in the stretched configuration, wherein the applying is subsequent to the stretching, and further wherein the applying includes aligning and contacting the plurality of electrical conduits with a plurality of respective contact pads on the space transformer; and

retaining the resilient dielectric body in the stretched configuration subsequent to the applying by adhering the resilient dielectric body to the space transformer with an adhesive.

2. The method of claim 1, wherein the retaining includes directly adhering the resilient dielectric body to the space transformer with the adhesive.

3. The method of claim 1, wherein the adhering includes adhering such that the adhesive does not contact the plurality of electrical conduits and such that the adhesive does not contact the plurality of contact pads.

4. The method of claim 1, wherein the adhering includes adhering with a permanent adhesive.

5. The method of claim 1, wherein the adhering includes adhering with a temporary adhesive.

6. The method of claim 1, wherein the stretched configuration is larger than the first configuration in a plane of the first surface.

7. The method of claim 1, wherein the applying further includes establishing electrical communication between the plurality of electrical conduits and the plurality of respective contact pads.

8. The method of claim 1, wherein, subsequent to the retaining, the method further includes removing the resilient dielectric body from the space transformer.

9. The method of claim 8, wherein the removing includes separating the resilient dielectric body from the space transformer without damage to the space transformer.

10. The method of claim 8, wherein the removing includes separating the resilient dielectric body from the space transformer without damage to the resilient dielectric body.

11. The method of claim 1, wherein the stretching includes stretching within a plane of the first surface.