Sensor self-diagnostics using multiple signal paths

• US 9,874,609 B2
• Filed: 03/15/2013
• Issued: 01/23/2018
• Est. Priority Date: 09/24/2010
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Rasbornig, Friedrich, Motz, Mario, Scherr, Wolfgang, Granig, Wolfgang, Strasser, Michael, Schaffer, Bernhard, Pircher, Gerhard, Gastinger, Ferdinand, Hammerschmidt, Dirk
• Primary Examiner(s): Assouad, Patrick
• Assistant Examiner(s): PRETLOW, DEMETRIUS R
• Application Number:
  US13/833,852
• Publication Number:
  US 20130200909A1
• Time in Patent Office: 1,775 Days
• Field of Search: 3247503
• CPC Class Codes: B60T 2250/06 Sensor zero-point adjustment; Offset compensation
• CPC Class Codes: B60T 2270/406 Test-mode; Self-diagnosis
• CPC Class Codes: B60T 2270/411 Offset failure
• CPC Class Codes: B60T 2270/413 Plausibility monitoring, cross check, redundancy
• CPC Class Codes: B60T 8/885 using electrical circuitry
• CPC Class Codes: B60W 2050/0047 Digital-analogue (D/A) or analogue-digital (A/D) conversion
• CPC Class Codes: B60W 2050/0215 Sensor drifts or sensor failures
• CPC Class Codes: B60W 50/0205 Diagnosing or detecting failures; Failure detection models
• CPC Class Codes: G01D 3/08 with provision for safeguarding the apparatus, e.g. against abnormal operation, against breakdown
• CPC Class Codes: G01R 31/007 using microprocessors or computers
• CPC Class Codes: G01R 31/2829 Testing of circuits in sensor or actuator systems testing of apparatus for measuring electric or magnetic variables G01R35/00; testing of indicating or recording apparatus G01D; in airbag systems B60R21/0173; checking gas analysers G01N33/007; monitoring or fail-safe circuits for electromagnets H01F7/1844
• CPC Class Codes: G01R 31/3187 Built-in tests

Abstract

Embodiments relate to systems and methods for self-diagnostics and/or error detection using multiple signal paths in sensor and other systems. In an embodiment, a sensor system comprises at least two sensors, such as magnetic field sensors, and separate signal paths associated with each of the sensors. A first signal path can be coupled to a first sensor and a first digital signal processor (DSP), and a second signal path can be coupled to a second sensor and a second DSP. A signal from the first DSP can be compared with a signal from the second DSP, either on-chip or off, to detect faults, errors, or other information related to the operation of the sensor system. Embodiments of these systems and/or methods can be configured to meet or exceed relevant safety or other industry standards, such as safety integrity level (SIL) standards.

Claims

1. A monolithic integrated circuit sensor system comprising:

a first sensor device configured to sense a physical quantity and being coupled to a first signal path comprising a first digital signal processor (DSP) for a first sensor signal on a semiconductor chip, the first DSP providing a first output signal; and

a second sensor device configured to sense the same physical quantity as the first sensor device and being coupled to a second signal path for a second sensor signal on the semiconductor chip, the second signal path separate and distinct from the first signal path and comprising a second DSP, the second DSP providing a second output signal,

wherein a comparison of the first output signal and the second output signal indicates whether or not there is an error in the sensor system.

2. The sensor system of claim 1, wherein the comparison is carried out within the sensor system.

3. The sensor system of claim 1, wherein the comparison is carried out external to the sensor system.

4. The sensor system of claim 3, wherein the comparison is carried out by a control unit coupled to the sensor system.

5. The sensor system of claim 1, wherein at least one of an architecture or a function of the first DSP is different than an architecture or a function of the second DSP.

6. The sensor system of claim 1, wherein the first DSP communicates with the second DSP.

7. The sensor system of claim 1, wherein the first and second DSPs are coupled to the first and second signal paths, respectively, by first and second analog-to-digital (A/D) converters.

8. The sensor system of claim 7, wherein the first A/D converter is different from the second A/D converter.

9. The sensor system of claim 1, further comprising at least one additional sensor device.

10. The sensor system of claim 9, wherein the at least one additional sensor device forms part of a third signal path at least partially distinct from the first and second signal paths.

11. The sensor system of claim 9, wherein the at least one additional sensor device is coupled to one of the first signal path or the second signal path by a multiplexer.

12. The sensor system of claim 9, wherein the at least one additional sensor device is selected from the group consisting of a temperature sensor, a stress sensor, a current sensor, a voltage sensor and a magnetic field sensor.

13. The sensor system of claim 1, wherein the first and second sensor devices comprise magnetic field sensors.

14. The sensor system of claim 1, further comprising a compensation sensor device coupled to one of the first signal path or the second signal path to provide an analog compensation signal thereto, and wherein the other of the first signal path or the second signal path is configured to receive a different compensation signal.

15. The sensor system of claim 14, wherein the different compensation signal comprises a digital compensation signal.

16. The sensor system of claim 1, wherein the first signal path, when compared with the second signal path, has at least one characteristic selected from the group consisting of being faster, being more precise, having less noise and having a different working principle.

17. The sensor system of claim 1, further comprising a first power supply coupled to the first signal path and a second power supply coupled to the second signal path.

18. The sensor system of claim 1, further comprising a first power supply coupled to the first DSP and a second power supply coupled to the second DSP.

19. The sensor system of claim 1, further comprising a first oscillator device coupled to the first DSP and a second oscillator device coupled to the second DSP.

20. A method of comparing signals in a monolithic integrated circuit sensor system comprising:

implementing, on a single semiconductor chip, a main signal path comprising a main sensor and a first digital signal processor (DSP);

implementing, on the single semiconductor chip, a secondary signal path comprising a secondary sensor and a second DSP, the main and secondary sensors being responsive to the same physical quantity, the secondary signal path being separate and distinct from the main signal path, and the second DSP being different from the first DSP by at least one of an architecture or a function; and

comparing an output signal of the first DSP with an output signal of the second DSP.

21. The method of claim 20, further comprising implementing, on the single semiconductor chip, at least one auxiliary sensor and a third signal path, the third signal path being at least partially distinct from each of the main and secondary signal paths.

22. The method of claim 21, further comprising compensating at least one of a signal of the main signal path or a signal of the secondary signal path by a signal of the third signal path.

23. The method of claim 22, further comprising compensating the other of the signal of the main signal path or the signal of the secondary signal path by a digital compensation signal.

24. The method of claim 20, further comprising:

implementing a first analog-to-digital (A/D) conversion technique on the main signal path; and

implementing a second A/D conversion technique on the secondary signal path, the first and second A/D conversion techniques being different from one another.

25. The method of claim 20, further comprising:

implementing a first algorithm by the first DSP; and

implementing a second algorithm by the second DSP, the second algorithm being different from the first algorithm.

26. The method of claim 25, wherein the second algorithm is different from the first algorithm according to at least one of a temporal sequence of operations, a function carried out, or a compensation technique applied.

27. The method of claim 24, further comprising providing protected circuitry by implementing security bits in at least one of the first DSP or the second DSP.

28. The method of claim 26, wherein the protected circuitry comprises at least one of a memory circuit, a register area, a control bus, a signal bus, a data bus or a data path.

29. The method of claim 24, wherein at least one of the first DSP or the second DSP comprises a forward error correction (FEC) block.

30. The method of claim 20, further comprising exchanging the main sensor and the secondary sensor such that the main sensor is coupled to the second DSP and the secondary sensor is coupled to the first DSP.

31. The method of claim 20, further comprising conducting a plausibility check of the first or second DSP by the other of the second or first DSP.

32. The method of claim 31, wherein conducting a plausibility check further comprises conducting the plausibility check using at least one of a lower data rate or a different DSP implementation between the first and second DSPs.