Co-packaging photonic integrated circuits and application specific integrated circuits
First Claim
Patent Images
1. A co-packaging arrangement comprising:
- a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC) positioned beside the PIC, wherein the PIC and the ASIC are disposed on a substrate within a housing;
wherein the PIC is edge-coupled to an optical fiber, and wherein the PIC comprises one or more optical modulators and one or more optical detectors;
wherein the substrate comprises electrical interconnects configured to electrically connect the PIC to the ASIC; and
wherein the one or more optical modulators are driven directly from a digital-to-analog converter (DAC) that is located on the ASIC.
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Abstract
Disclosed herein are designs, structures and techniques for advanced packaging of multi-function photonic integrated circuits that allow such high-performance multi-function photonic integrated circuits to be co-packaged with a high-performance multi-function ASIC thereby significantly reducing strenuous interconnect challenges and lowering costs, power and size of the overall devices.
126 Citations
16 Claims
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1. A co-packaging arrangement comprising:
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a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC) positioned beside the PIC, wherein the PIC and the ASIC are disposed on a substrate within a housing; wherein the PIC is edge-coupled to an optical fiber, and wherein the PIC comprises one or more optical modulators and one or more optical detectors; wherein the substrate comprises electrical interconnects configured to electrically connect the PIC to the ASIC; and wherein the one or more optical modulators are driven directly from a digital-to-analog converter (DAC) that is located on the ASIC. - View Dependent Claims (2, 3, 5, 6, 7, 8, 9, 10, 11)
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4. A co-packaging arrangement comprising:
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a photonic integrated circuit (PIC) and an application specific integrated circuit (ASIC) positioned beside the PIC, wherein the PIC and the ASIC are disposed on a substrate within a housing; wherein the PIC comprises a coherent transceiver having one or more optical modulators driven directly from a digital-to-analog converter (DAC) that is located on the ASIC; and a tunable laser disposed outside of the housing, such that there are no cooling devices within the housing. - View Dependent Claims (12, 13, 14, 15, 16)
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Specification