Sub-pixel and sub-resolution localization of defects on patterned wafers

• US 9,875,536 B2
• Filed: 03/29/2016
• Issued: 01/23/2018
• Est. Priority Date: 03/31/2015
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Konecky, Soren
• Primary Examiner(s): Grant, II, Jerome
• Application Number:
  US15/084,340
• Publication Number:
  US 20160292840A1
• Time in Patent Office: 665 Days
• Field of Search: 382149
• CPC Class Codes: G06T 2207/10061 from scanning electron microscope
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Methods and systems for determining if a defect detected on a specimen is a DOI (Defect of Interest) or a nuisance are provided. One system includes computer subsystem(s) configured for aligning output of an inspection subsystem for an area on a specimen to simulated output of the inspection subsystem for the area on the specimen and detecting a defect in the output for the area on the specimen. The computer subsystem(s) are also configured for determining a location of the defect in the output with respect to patterned features in the simulated output based on results of the detecting and aligning, determining a distance between the determined location of the defect and a known location of interest on the specimen, and determining if the defect is a DOI or a nuisance based on the determined distance.

Claims

1. A system configured to determine if a defect detected on a specimen is a defect of interest or a nuisance, comprising:

an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a specimen, and wherein the detector is configured to detect energy from the specimen and to generate output responsive to the detected energy; and

one or more computer subsystems configured for;

aligning the output of the inspection subsystem for an area on the specimen to simulated output of the inspection subsystem for the area on the specimen;

detecting a defect in the output for the area on the specimen;

determining a location of the defect in the output with respect to patterned features in the simulated output based on results of said detecting and said aligning;

determining a distance between the determined location of the defect and a known location of interest on the specimen; and

determining if the defect is a defect of interest or a nuisance based on the determined distance, wherein determining if the defect is the defect of interest or the nuisance comprises applying a threshold to the determined distance, determining that the defect is the defect of interest if the determined distance is below the threshold, and determining that the defect is the nuisance if the determined distance is greater than the threshold.

2. The system of claim 1, wherein the known location of interest comprises a known location of a defect of interest.

3. The system of claim 1, wherein the one or more computer subsystems are further configured for generating different models of the specimen for different areas on the specimen and generating the simulated output for the area by selecting one of the different models corresponding to the area and simulating how the area would appear in the output generated by the inspection subsystem for the area based on the selected one of the different models.

4. The system of claim 1, wherein said aligning comprises performing multiple alignment steps in which the output for the area is separately aligned to multiple simulated outputs for the area, determining which of the multiple alignment steps produced the best alignment, and selecting results of the multiple alignment step determined to produce the best alignment as the results of the aligning used for determining the location of the defect.

5. The system of claim 1, wherein said aligning comprises maximizing a cross-correlation between the output and the simulated output.

6. The system of claim 1, wherein said aligning aligns the output to the simulated output with sub-pixel accuracy.

7. The system of claim 1, wherein said aligning aligns the output to the simulated output with sub-resolution accuracy.

8. The system of claim 1, wherein the output used for said aligning comprises a reference image for the area, wherein the output for the area further comprises a target image, and wherein the one or more computer subsystems are further configured for aligning the target image for the area to the reference image thereby aligning the target image to the simulated output.

9. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and detecting the defect in the difference image by applying ante threshold to the difference image, and wherein the other threshold is a hot threshold.

10. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and wherein determining the location of the defect is performed by fitting a portion of the difference image corresponding to the defect to a Gaussian function.

11. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and wherein determining the location of the defect is performed by fitting a portion of the difference image corresponding to the defect to a function.

12. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and wherein determining the location of the defect is performed by fitting a portion of the difference image corresponding to the defect to an Airy disc function.

13. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and wherein determining the location of the defect is performed by determining a centroid of the defect in the difference image.

14. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and wherein determining the location of the defect comprises shifting a simulated image of a profile of the defect relative to the difference image until a cross-correlation between the simulated image of the profile of the defect and the difference image is maximized.

15. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and wherein determining the location of the defect comprises shifting a simulated image of a profile of the defect relative to the difference image until a sum-squared difference between the simulated image of the profile of the defect and the difference image is minimized.

16. The system of claim 1, wherein the output for the area comprises reference output and target output for the area, wherein detecting the defect comprises generating a difference image for the area by subtracting the reference output for the area from the target output for the area and applying a defect detection method to the difference image, and where determining the location of the defect comprises performing interpolation to upsample the difference image onto a grid of pixels that is finer than a grid of pixels in the output and using location of a center of a pixel in the finer grid of pixels with the strongest signal as the location of the defect.

17. The system of claim 1, wherein the location of the defect with respect to the patterned features is determined with sub-pixel accuracy.

18. The system of claim 1, wherein the location of the defect with respect to the patterned features is determined with sub-resolution accuracy.

19. The system of claim 1, wherein the determined location of the defect is a location in multiple dimensions, wherein the distance is determined in the multiple dimensions, and wherein determining if the defect is the defect of interest or the nuisance further comprises applying the threshold or another threshold to each of the multiple dimensions.

20. The system of claim 1, wherein the area on the specimen comprises a region of interest on the specimen that has a sub-pixel area.

21. The system of claim 1, wherein the area on the specimen comprises a region of interest on the specimen that has a sub-resolution area.

22. The system of claim 1, wherein the area on the specimen is selected while the inspection subsystem generates the output and the one or more computer subsystems detect defects on the specimen based on the output.

23. The system of claim 1, wherein the one or more computer subsystems are further configured to correlate the output of the inspection subsystem for the defect to output generated for the area on the specimen by a different output acquisition subsystem.

24. The system of claim 1, wherein the specimen comprises a wafer.

25. The system of claim 1, wherein the specimen comprises a reticle.

26. The system of claim 1, wherein the energy directed to the specimen comprises light, and wherein the energy detected from the specimen comprises light.

27. The system of claim 1, wherein the energy directed to the specimen comprises electrons, and wherein the energy detected from the specimen comprises electrons.

28. The system of claim 1, wherein the one or more computer subsystems are further configured for performing said aligning and said detecting for multiple instances of the area on the specimen thereby detecting multiple defects in the multiple instances of the area, performing said determining the location for the multiple defects, combining the determined locations of the multiple defects, and altering one or more parameters of one or more steps performed by the one or more computer subsystems for the specimen based on the combined locations.

29. The system of claim 28, wherein the determined locations of the multiple defects comprise x and y locations determined for all of the multiple defects, and wherein said altering comprises tuning a recipe for the one or more steps using the x and y locations as attributes.

30. The system of claim 1, wherein the area on the specimen comprises one of multiple regions of interest on the specimen.

31. The system of claim 30, wherein each of the multiple regions of interest is determined based on the known location of interest or another known location of interest on the specimen.

32. The system of claim 30, wherein each of the multiple regions of interest corresponds to a different known location of interest on the specimen.

33. The system of claim 30, wherein each of the multiple regions of interest is determined based on the known location of interest or another known location of interest on the specimen, and wherein determining if the defect is the defect of interest or the nuisance further comprises determining if the defect is outside of the multiple regions of interest and eliminating the defect if it is determined to be outside of the multiple regions of interest as not corresponding to a defect type of interest.

34. The system of claim 30, wherein one or more of the multiple regions of interest are determined based on information about where defects of interest are supposed to be on the specimen.

35. The system of claim 30, wherein one or more of the multiple regions of interest are at P-type metal-oxide-semiconductor locations on the specimen where missing material occurs.

36. The system of claim 1, wherein the one or more computer subsystems are further configured for performing said aligning and said detecting for multiple instances of the area on the specimen thereby detecting multiple defects in the multiple instances of the area, performing said determining the location for the multiple defects, and displaying the locations determined for all of the multiple defects detected within a particular type of pattern on the specimen in a single image.

37. The system of claim 36, wherein the particular type of pattern on the specimen comprises a static random access memory cell.

38. The system of claim 36, wherein the one or more computer subsystems are further configured for overlaying the single image with information for the particular type of pattern.

39. The system of claim 38, wherein the information for the particular type of pattern comprises an image of the particular type of pattern or design for the particular type of pattern.

40. The system of claim 36, wherein the one or more computer subsystems are further configured for defining sub-pixel areas of interest based on the single image and setting defect detection thresholds differently for different sub-pixel areas of interest.

41. The system of claim 40, wherein the defect detection thresholds are set lower in the sub-pixel areas of interest where defects are expected or known to be and higher in the sub-pixel areas of interest that are nuisance areas.

42. The system of claim 41, wherein the sub-pixel areas of interest where the defects are expected or known to be comprise gate edges to a side of P-type metal-oxide-semiconductor fins.

43. The system of claim 41, wherein the sub-pixel areas of interest that are the nuisance areas comprise ends of P-type metal-oxide-semiconductor fins on or below gates.

44. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for determining if a defect detected on a specimen is a defect of interest or a nuisance, wherein the computer-implemented method comprises:

aligning output of an inspection subsystem for an area on a specimen to simulated output of the inspection subsystem for the area on the specimen, wherein the inspection subsystem comprises at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to the specimen, and wherein the detector is configured to detect energy from the specimen and to generate the output responsive to the detected energy;

detecting a defect in the output for the area on the specimen;

determining a location of the defect in the output with respect to patterned features in the simulated output based on results of said detecting and said aligning;

determining a distance between the determined location of the defect and a known location of interest on the specimen; and

determining if the defect is a defect of interest or a nuisance based on the determined distance, wherein determining if the defect is the defect of interest or the nuisance comprises applying a threshold to the determined distance, determining that the defect is the defect of interest if the determined distance is below the threshold, and determining that the defect is the nuisance if the determined distance is greater than the threshold, and wherein aligning the output, detecting the defect, determining the location, determining the distance, and determining if the defect is a defect of interest or a nuisance are performed by one or more computer subsystems.

45. A computer-implemented method for determining if a defect detected on a specimen is a defect of interest or a nuisance, comprising:

aligning output of an inspection subsystem for an area on a specimen to simulated output of the inspection subsystem for the area on the specimen, wherein the inspection subsystem comprises at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to the specimen, and wherein the detector is configured to detect energy from the specimen and to generate the output responsive to the detected energy;

detecting a defect in the output for the area on the specimen;

determining a location of the defect in the output with respect to patterned features in the simulated output based on results of said detecting and said aligning;

determining a distance between the determined location of the defect and a known location of interest on the specimen; and

determining if the defect is a defect of interest or a nuisance based on the determined distance, wherein determining if the defect is the defect of interest or the nuisance comprises applying a threshold to the determined distance, determining that the defect is the defect of interest if the determined distance is below the threshold, and determining that the defect is the nuisance if the determined distance is greater than the threshold, and wherein aligning the output, detecting the defect, determining the location, determining the distance, and determining if the defect is a defect of interest or a nuisance are performed by one or more computer subsystems.