Substrate processing system and method

• US 9,875,922 B2
• Filed: 04/14/2016
• Issued: 01/23/2018
• Est. Priority Date: 11/08/2011
• Status: Expired due to Fees

• Current Assignee: Intevac
• Original Assignee: Intevac
• Inventors: Pederson, Terry, Hieslmair, Henry, Chun, Moon, Prabhakar, Vinay, Adibi, Babak, Bluck, Terry
• Primary Examiner(s): BRAYTON, JOHN JOSEPH
• Application Number:
  US15/099,523
• Publication Number:
  US 20160233122A1
• Time in Patent Office: 649 Days
• CPC Class Codes: H01L 21/26506 in group IV semiconductors
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/6776 Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: H01L 31/1876 Particular processes or apparatus for batch treatment of the devices
• CPC Class Codes: H02N 13/00 Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

Claims

1. A wafer processing system, comprising:

a vacuum enclosure having a processing region;

a processing chamber attached to the vacuum enclosure and defining a processing zone within the vacuum enclosure;

a first rail assembly positioned inside the vacuum enclosure on one side of the processing chamber;

a first elevation mechanism coupled to the first rail assembly and configured to raise the first rail assembly to elevated position and lower the first rail assembly to lower position;

a second rail assembly positioned inside the vacuum enclosure on opposite side of the first rail assembly;

a second elevation mechanism coupled to the second rail assembly and configured to raise the second rail assembly to elevated position and lower the second rail assembly to lower position;

a first chuck assembly positioned and configured to ride on the first rail assembly in a forward travel direction while traversing under the processing region when the first rail assembly is in the elevated position to thereby perform pass-by processing; and

,

a second chuck assembly positioned and configured to ride on the second rail assembly in a forward travel direction while traversing under the processing region when the second rail assembly is in the elevated position to thereby perform pass-by processing.

2. The system of claim 1, further comprising a wafer delivery mechanism positioned inside the vacuum enclosure and a wafer removal mechanism positioned inside the vacuum enclosure.

3. The system of claim 2, further comprising a first pick-and-place assembly configured to transfer wafers from the wafer delivery mechanism to the first and second chuck assemblies, and a second pick-and-place assembly configured to transfer wafers from the first and second chuck assemblies to the wafer removal mechanism.

4. The system of claim 3, wherein the wafer delivery mechanism comprises a first conveyor belt and the wafer removal mechanism comprises a second conveyor belt.

5. The system of claim 4, wherein the pick-and-place assembly comprises a pickup head having a plurality of pickup chucks configured for simultaneously chucking a plurality of wafers.

6. The system of claim 5, wherein each of the chuck assemblies comprises a plurality of electrostatic chucks.

7. The system of claim 6, wherein the pick-and-place assembly further comprises actuators configured to align the wafers to the plurality of chucks.

8. The system of claim 7, wherein each of the chuck assemblies comprises a plurality of alignment pins configured for aligning the wafers by urging the wafers against the alignment pins.

9. The system of claim 1, wherein the first chuck assembly is positioned on a first cantilevered shelf configured to ride on the first rail assembly;

and,

wherein the second chuck assembly is positioned on a second cantilevered shelf configured to ride on the second rail assembly.

10. The system of claim 1, further comprising a transport mechanism configured to operate such that when the first chuck assembly exits the processing zone, the second chuck assembly immediately enters the processing zone and when the second chuck assembly exits the processing zone, the first chuck assembly immediately enters the processing zone.

11. The system of claim 1, wherein each of the first and second chuck assemblies is further configured to ride on its respective first and second rail assemblies in the backwards direction when the respective first and second rail assembly is in the lower position, to thereby pass under the other one of the first and second chuck assemblies.

12. The system of claim 11, wherein each of the first and second chuck assemblies travels in the backward direction in a speed that is faster than speed of the forward travel direction.

13. The system of claim 1, wherein the processing region comprises an ion implantation beam.

14. The system of claim 13, wherein ion implantation beam is a wide ion beam such that it can cover sections of several substrates simultaneously.

15. The system of claim 1, wherein the processing region comprises a sputtering target.

16. The system of claim 1, wherein when both first and second rail assemblies are in the elevated position, the first and second chuck assemblies are aligned in the travel direction.