Methods of forming parts using laser machining

• US 9,878,401 B1
• Filed: 05/22/2015
• Issued: 01/30/2018
• Est. Priority Date: 01/15/2013
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Veeramani, Arun S., Jensen, Heath A., Frodis, Uri, Wiita, Christopher G., Lockard, Michael S., Boguslavsky, Irina, Lembrikov, Pavel, Smalley, Dennis R., Chen, Richard T.
• Primary Examiner(s): Heinrich, Samuel M
• Application Number:
  US14/720,719
• Time in Patent Office: 984 Days
• Field of Search: 21912167-12169, 21912172, 438 33, 438113, 438458, 438463
• CPC Class Codes: B23K 2103/56 semiconducting
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/382 by boring
• CPC Class Codes: C25D 5/028 one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
• CPC Class Codes: C25D 5/48 After-treatment of electroplated surfaces
• CPC Class Codes: C25D 7/00 Electroplating characterised by the article coated
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips

Abstract

Embodiments are directed to the formation micro-scale or millimeter scale structures or methods of making such structures wherein the structures are formed from at least one sheet structural material and may include additional sheet structural materials or deposited structural materials wherein all or a portion of the patterning of the structural materials occurs via laser cutting. In some embodiments, selective deposition is used to provide a portion of the patterning. In some embodiments the structural material or structural materials are bounded from below by a sacrificial bridging material (e.g. a metal) and possibly from above by a sacrificial capping material (e.g. a metal).

Claims

1. A method of forming a plurality of laterally displaced micro-scale or millimeter-scale structure, comprising:

a) providing at least one sheet of structural material having a front side and a backside and extending laterally in a plane of the sheet;

b) locating a bridging sacrificial material directly or indirectly on the backside of the at least one sheet of structural material;

c) using a laser beam to cut completely through the at least one sheet from the front side to the backside along cutting paths to define cross-sectional boundaries of each of the plurality of laterally displaced structures without cutting completely through the bridging sacrificial material along the cutting paths for the plurality of structures, wherein individual structures have cross-sectional configurations defined by the cross-sectional boundaries created by cutting using the laser beam; and

d) after the defining of the cross-sectional boundaries of the plurality of laterally displaced structures, releasing the laterally displaced structures from one another, wherein the releasing comprises removing the bridging sacrificial material.

2. The method of claim 1 wherein a sacrificial capping material is located directly or indirectly on the opposite side of the at least one sheet structural material relative to the bridging sacrificial material and wherein the laser beam cuts through the capping material as well as the at least one sheet.

3. The method of claim 2 wherein the structural material of the sheet comprises a metal, the bridging sacrificial material comprises a metal, and the capping sacrificial material comprises a metal.

4. The method of claim 2 wherein the bridging sacrificial material is deposited directly or indirectly onto the at least one sheet of structural material by electroplating and the capping sacrificial material is deposited directly or indirectly onto the at least one sheet of structural material by electroplating.

5. The method of claim 1 wherein the bridging sacrificial material is attached directly or indirectly to a base which comprises a frame to which the bridging sacrificial material is attached.

6. The method of claim 5 wherein the attachment to the base comprises a method selected from the group consisting of (a) locating a solidifiable polymer between the base and the bridging sacrificial material and then solidifying the polymer, or (b) electroplating a sacrificial material through openings in the base onto the bridging sacrificial material that is being pressed against the base.

7. The method of claim 1 wherein the plurality of structures are selected from the group consisting of (a) a plurality of compliant pins, (b) a plurality of probes for use in a probe card for testing integrated circuits, (c) a plurality of electrical spring contactors, and (d) a plurality of multi-component devices.

8. The method of claim 1 wherein cutting by the laser beam occurs by a method selected from the group consisting of:

(a) using a single pass over each location to be cut that cuts completely through the sheet material, (b) using multiple passes over to cause cutting completely through the sheet material while each of at least two passes traces a common cutting path around a perimeter of each of the plurality of structures, and (c) using multiple passes over each location to be cut while at least two passes trace offset cutting paths when cutting the structural material around a perimeter of each of the plurality of structures.

9. The method of claim 1 wherein the direct or indirect locating of the bridging sacrificial material on the sheet of structural material comprises indirect locating of at least one intermediate material between the bridging sacrificial material and the sheet of structural material wherein the at least one material is selected from the group consisting of (a) one single material layer, (b) a plurality of single material layers, (c) a single multi-material layer, (d) a plurality of multi-material layers, and (e) a combination of at least one multi-material layer and at least one single material layer.

10. The method of claim 2 wherein the direct or indirect locating of the capping sacrificial material on the sheet of structural material comprises indirect locating as at least one intermediate material is positioned between the capping sacrificial material and the sheet of structural material wherein the at least one material is selected from the group consisting of (a) one single material layer, (b) a plurality of single material layers, (c) a single multi-material layer, (d) a plurality of multi-material layers, and (e) a combination of at least one multi-material layer and at least one single material layer.

11. The method of claim 1 wherein the angle of incidence of a laser beam onto the sheet material is different when cutting at least two different lateral portions of the sheet material.

12. The method of claim 1 wherein the plurality of structures are inspected and wherein at least one step is implemented that is selected from the group consisting of (a) flagging any failed structure for special handling;

(b) prior to removing the bridging sacrificial material cutting any failed structure into two or more pieces to enable them to be readily distinguished from structures that did not fail inspection;

(c) using an additional material attaching any failed structures to adjacent structural material so that removal of the bridging sacrificial material does not result in separation of the failed structures from other portions of the sheet of structural material.

13. The method of claim 9 wherein at least one planarization operation is used to set a boundary level for at least one layer of the at least one intermediate material.

14. The method of claim 1 wherein the plurality of structures comprise a plurality of identical structures.

15. The method of claim 1 wherein the plurality of structures comprise a plurality of structures with at least two of the plurality having different lateral configurations.

16. The method of claim 1 wherein the at least one sheet material includes at least one region that undergoes vertical narrowing by laser ablation prior to cutting out the perimeter region of the at least one structure.

17. The method of claim 1 wherein the at least one sheet material includes at least one region that undergoes vertical narrowing prior to locating at least one additional layer of material, wherein the at least one sheet material undergoes laser ablation to form at least one through hole prior to locating at least one additional layer of material.

18. The method of claim 1 wherein during laser cutting the sacrificial bridging material is cut completely through in only a portion of the locations along the cutting path for any given structure being formed such that the bridging material still holds the structure to the rest of the sheet material.

19. The method of claim 1 wherein during laser cutting the sacrificial bridging material is not cut completely through in any locations.

20. The method of claim 1 wherein laser cutting of the sheet material or of another structural material occurs from both the top and bottom surfaces.