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Method of manufacturing a temperature-compensated micro-electromechanical device

  • US 9,878,903 B2
  • Filed: 05/06/2014
  • Issued: 01/30/2018
  • Est. Priority Date: 10/08/2004
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • forming a first suspended mass in a semiconductor substrate, the first suspended mass being coupled to the semiconductor substrate and movable with respect to the semiconductor substrate, the first suspended mass including a first plurality of movable electrodes that are capacitively coupled to a first plurality of fixed electrodes; and

    forming a second suspended mass in the semiconductor substrate, the second suspended mass including a second plurality of fixed electrodes that are capacitively coupled to a third plurality of fixed electrodes, the second suspended mass and the second plurality of fixed electrodes being rigidly coupled to the semiconductor substrate to prevent movement of the second suspended mass and the second plurality of fixed electrodes relative to the semiconductor substrate, the first suspended mass and the second suspended mass being configured to undergo equal strains as a result of thermal expansion of the semiconductor substrate.

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