Solid state ultracapacitor
First Claim
1. A method of manufacturing a capacitor comprising the steps of:
- a) obtaining BaTiO3 particles;
said particles having an average grain diameter of 100-700 nm;
b) treating said particles in a first furnace under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas for 60-90 minutes at 850-900°
C.;
c) coating said treated particles with a 3-20 nm thick film of SiO2 or a 3-10 nm thick film of Al2O3 whereby said coated treated particles become agglomerated;
d) separating said coated, treated particles to break up said agglomeration into individual particles;
e) incorporating said separated, coated, treated particles into an ink comprising;
i) 60-80% by weight separated, coated, treated particles;
ii) 5-50% by weight high dielectric constant glass;
said high dielectric constant glass being 0.5-10 μ
m in size;
iii) 0.1-5% by weight surfactant;
iv) 5-25% by weight solvent; and
v) 5-25% by weight organic vehicle;
f) depositing an electrode on a substrate;
said electrode having a resistance between 1 mΩ and
10Ω
;
g) sintering said substrate and electrode;
h) depositing a layer of said ink on said substrate and electrode by a deposition process so that said layer is continuous and has consistent thickness;
i) removing solvent from said layer by drying for 15-30 minutes at 120-150°
C. in air;
j) repeating steps h) and i) until desired thickness is obtained;
k) removing organic binder by exposing said substrate, electrode and ink to the following heating cycle;
i) gradually increasing temperature to 280-350°
C. over 45-90 minutes with a heating rate not exceeding 10-15°
C. per minuteii) curing at 280-350°
C. for 4-72 hours;
iii) allowing said substrate, electrode and ink to cool to ambient temperature;
l) sintering said at least one layer on said substrate by heating in a second furnace, at 850-900°
C. for less than 5 minutes and allowing it to cool to ambient under N2 atmosphere;
said N2 containing less than 25 ppm O2;
a thickness of said at least one layer being sufficient to produce a sintered layer 10-35 μ
m thick; and
m) depositing a top electrode on said at least one layer;
said top electrode having a resistance between 1 mΩ and
10Ω
.
1 Assignment
0 Petitions
Accused Products
Abstract
An ink of the formula: 60-80% by weight BaTiO3 particles coated with SiO2; 5-50% by weight high dielectric constant glass; 0.1-5% by weight surfactant; 5-25% by weight solvent; and 5-25% weight organic vehicle. Also a method of manufacturing a capacitor comprising the steps of: heating particles of BaTiO3 for a special heating cycle, under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas; depositing a film of SiO2 over the particles; mechanically separating the particles; incorporating them into the above described ink formulation; depositing the ink on a substrate; and heating at 850-900° C. for less than 5 minutes and allowing the ink and substrate to cool to ambient in N2 atmosphere. Also a dielectric made by: heating particles of BaTiO3 for a special heating cycle, under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas; depositing a film of SiO2 over the particles; mechanically separating the particles; forming them into a layer; and heating at 850-900° C. for less than 5 minutes and allowing the layer to cool to ambient in N2 atmosphere.
24 Citations
17 Claims
-
1. A method of manufacturing a capacitor comprising the steps of:
-
a) obtaining BaTiO3 particles;
said particles having an average grain diameter of 100-700 nm;b) treating said particles in a first furnace under a mixture of 70-96% by volume N2 and 4-30% by volume H2 gas for 60-90 minutes at 850-900°
C.;c) coating said treated particles with a 3-20 nm thick film of SiO2 or a 3-10 nm thick film of Al2O3 whereby said coated treated particles become agglomerated; d) separating said coated, treated particles to break up said agglomeration into individual particles; e) incorporating said separated, coated, treated particles into an ink comprising; i) 60-80% by weight separated, coated, treated particles; ii) 5-50% by weight high dielectric constant glass;
said high dielectric constant glass being 0.5-10 μ
m in size;iii) 0.1-5% by weight surfactant; iv) 5-25% by weight solvent; and v) 5-25% by weight organic vehicle; f) depositing an electrode on a substrate;
said electrode having a resistance between 1 mΩ and
10Ω
;g) sintering said substrate and electrode; h) depositing a layer of said ink on said substrate and electrode by a deposition process so that said layer is continuous and has consistent thickness; i) removing solvent from said layer by drying for 15-30 minutes at 120-150°
C. in air;j) repeating steps h) and i) until desired thickness is obtained; k) removing organic binder by exposing said substrate, electrode and ink to the following heating cycle; i) gradually increasing temperature to 280-350°
C. over 45-90 minutes with a heating rate not exceeding 10-15°
C. per minuteii) curing at 280-350°
C. for 4-72 hours;iii) allowing said substrate, electrode and ink to cool to ambient temperature; l) sintering said at least one layer on said substrate by heating in a second furnace, at 850-900°
C. for less than 5 minutes and allowing it to cool to ambient under N2 atmosphere;
said N2 containing less than 25 ppm O2;
a thickness of said at least one layer being sufficient to produce a sintered layer 10-35 μ
m thick; andm) depositing a top electrode on said at least one layer;
said top electrode having a resistance between 1 mΩ and
10Ω
. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification