Electronic module and method of making the same
First Claim
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1. A method of manufacturing an electronic module, comprising:
- providing a circuit substrate including a first surface, at least one first ground pad, and a first predetermined area, wherein the first ground pad and the first predetermined area are disposed on the first surface, and wherein the first ground pad surrounds the first predetermined area and does not overlap with the first predetermined area;
forming a first tape onto the first predetermined area;
disposing at least one first electronic component on the first surface outside the first predetermined area;
forming a first molding member on the first surface, wherein the first molding member covers the first tape and the first electronic component;
removing the first molding member on the first predetermined area; and
removing the first tape.
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Abstract
A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.
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Citations
18 Claims
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1. A method of manufacturing an electronic module, comprising:
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providing a circuit substrate including a first surface, at least one first ground pad, and a first predetermined area, wherein the first ground pad and the first predetermined area are disposed on the first surface, and wherein the first ground pad surrounds the first predetermined area and does not overlap with the first predetermined area; forming a first tape onto the first predetermined area; disposing at least one first electronic component on the first surface outside the first predetermined area; forming a first molding member on the first surface, wherein the first molding member covers the first tape and the first electronic component; removing the first molding member on the first predetermined area; and removing the first tape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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Specification