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Electronic module and method of making the same

  • US 9,881,875 B2
  • Filed: 07/16/2014
  • Issued: 01/30/2018
  • Est. Priority Date: 07/31/2013
  • Status: Active Grant
First Claim
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1. A method of manufacturing an electronic module, comprising:

  • providing a circuit substrate including a first surface, at least one first ground pad, and a first predetermined area, wherein the first ground pad and the first predetermined area are disposed on the first surface, and wherein the first ground pad surrounds the first predetermined area and does not overlap with the first predetermined area;

    forming a first tape onto the first predetermined area;

    disposing at least one first electronic component on the first surface outside the first predetermined area;

    forming a first molding member on the first surface, wherein the first molding member covers the first tape and the first electronic component;

    removing the first molding member on the first predetermined area; and

    removing the first tape.

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