Electronic module and method of making the same

• US 9,881,875 B2
• Filed: 07/16/2014
• Issued: 01/30/2018
• Est. Priority Date: 07/31/2013
• Status: Active Grant

• Current Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chen, Jen-Chun, Cheng, Tsung Jung, Liu, Chia Cheng
• Primary Examiner(s): Hauth, Galen H
• Application Number:
  US14/332,970
• Publication Number:
  US 20150036297A1
• Time in Patent Office: 1,294 Days
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49805 the leads being also applied on the sidewalls or the bottom of the substrate, e.g. leadless packages for surface mounting
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

A method of manufacturing electronic module is provided. The method can perform selective partial molding by forming the tapes in a predetermined area on the circuit substrate, setting electronic components out the predetermined area on the circuit substrate, forming the molding member encapsulating the whole circuit substrate and removing the tapes along of the molding member thereon. Following, forming an EMI shielding layer on the molding member and setting optoelectronics in the predetermined area on the circuit substrate could protect the electronic components from electromagnetic disturbance and avoid the optoelectronics being encapsulated.

Claims

1. A method of manufacturing an electronic module, comprising:

providing a circuit substrate including a first surface, at least one first ground pad, and a first predetermined area, wherein the first ground pad and the first predetermined area are disposed on the first surface, and wherein the first ground pad surrounds the first predetermined area and does not overlap with the first predetermined area;

forming a first tape onto the first predetermined area;

disposing at least one first electronic component on the first surface outside the first predetermined area;

forming a first molding member on the first surface, wherein the first molding member covers the first tape and the first electronic component;

removing the first molding member on the first predetermined area; and

removing the first tape.

2. The method of manufacturing an electronic module according to claim 1, wherein forming the first tape on the first predetermined area includes:

attaching a tape on the entire circuit substrate;

laser trenching the tape above the first ground pad; and

removing the tape outside the first predetermined area.

3. The method of manufacturing an electronic module according to claim 1, wherein the first ground pad is located between the first electronic component and the first predetermined area, removing the first molding member further comprising:

laser trenching the first molding member above the first ground pad; and

laser trimming the first molding member above the first predetermined area.

4. The method of manufacturing an electronic module according to claim 1, wherein in removing the first tape, the first tape falls off by heating.

5. The method of manufacturing an electronic module according to claim 1, wherein the first tape is a UV tape film, and in removing the first tape, ultraviolet light shines on the first tape.

6. The method of manufacturing an electronic module according to claim 1 further comprising:

disposing at least one of optoelectronic, connector, insertion hole or receptacle on the first predetermined area.

7. The method of manufacturing an electronic module according to claim 1, wherein after removing the first tape the method further comprising:

forming a first mask layer on the first predetermined area;

forming a first EMI shielding layer and electrically connected to the first ground pad; and

removing the first mask layer.

8. The method of manufacturing an electronic module according to claim 1 further comprising:

laser trenching the first molding member above the first ground pad, wherein the first ground pad is located between the first electronic component and the first predetermined area; and

forming a first EMI shielding layer above the first molding member and the first ground pad.

9. The method of manufacturing an electronic module according to claim 1 further comprising:

providing the circuit substrate including a second surface, at least one second ground pad, at least one second electronic component and a second predetermined area, wherein the second predetermined area, the second electronic component and the second ground pad are disposed on the second surface;

forming a second tape on the second predetermined area;

forming a second molding member on the second surface, wherein the second molding member covers the second tape and the second electronic component;

removing the second molding member above the second predetermined area; and

removing the second tape.

10. The method of manufacturing an electronic module according to claim 9, wherein forming the second tape on the second predetermined area includes:

attaching a tape on the entire circuit substrate;

laser trenching the tape above the second ground pad; and

removing the tape outside the second predetermined area.

11. The method of manufacturing an electronic module according to claim 9, removing the second molding member further comprising:

laser trenching the second molding member above the second ground pad, wherein the second ground pad is located between the second electronic component and the second predetermined area; and

laser trimming the second molding member above the second predetermined area.

12. The method of manufacturing an electronic module according to claim 9, wherein in removing the second tape, the second tape falls off by heating.

13. The method of manufacturing an electronic module according to claim 9, wherein the second tape is a UV tape film, and in removing the second tape, ultraviolet light shines on the second tape.

14. The method of manufacturing an electronic module according to claim 9 further comprising:

disposing at least one of optoelectronic, connector, insertion hole or receptacle on the second predetermined area.

15. The method of manufacturing an electronic module according to claim 9, wherein after removing the second tape the method further comprising:

forming a second mask layer on the second predetermined area;

forming a second EMI shielding layer and electrically connected to the second ground pad; and

removing the second mask layer.

16. The method of manufacturing an electronic module according to claim 9 further comprising:

laser trenching the second molding member above the second ground pad, wherein the second ground pad is located between the second electronic component and the second predetermined area; and

forming a second EMI shielding layer, the second EMI shielding layer being electrically connected to the second ground pad.

17. The method of manufacturing an electronic module according to claim 1 further comprising:

laser trenching the first molding member above the first ground pad, wherein the first ground pad has a first laser absorption level different from a second laser absorption level of the first molding member, and the first ground pad serves as a stop for the laser trenching.

18. The method of manufacturing an electronic module according to claim 1 further comprising:

forming at least one side wall of the first molding member by laser trenching the first molding member above the first ground pad, wherein the at least one side wall of the first molding member and the first surface of the circuit substrate form an angle ranging between 85 degrees and 90 degrees.