Semiconductor package with three-dimensional antenna
First Claim
1. A semiconductor package, comprising:
- a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region;
a semiconductor die disposed on the package substrate in the first region;
a conductive shielding element disposed on the package substrate and covering the semiconductor die;
a three-dimensional (3D) antenna, comprising;
a planar structure portion disposed on the package substrate in the second region; and
a bridge structure portion above the planar structure portion and connected thereto; and
a molding compound encapsulating the conductive shielding element and the 3D antenna.
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Accused Products
Abstract
A semiconductor package is provided. The semiconductor package includes a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region. A semiconductor die is disposed on the package substrate in the first region. A three-dimensional (3D) antenna is disposed on the package substrate in the second region. The 3D antenna includes a planar structure portion and a bridge or wall structure portion. A molding compound encapsulates the semiconductor die and at least a portion of the 3D antenna. A conductive shielding element is inside the molding compound or partially covers the molding compound. A semiconductor package assembly having the semiconductor package is also provided.
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Citations
26 Claims
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1. A semiconductor package, comprising:
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a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region; a semiconductor die disposed on the package substrate in the first region; a conductive shielding element disposed on the package substrate and covering the semiconductor die; a three-dimensional (3D) antenna, comprising; a planar structure portion disposed on the package substrate in the second region; and a bridge structure portion above the planar structure portion and connected thereto; and a molding compound encapsulating the conductive shielding element and the 3D antenna. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A semiconductor package, comprising:
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a package substrate having a first region and a second region defined between an edge of the package substrate and an edge of the first region; a molding compound disposed on the package substrate in the first and second regions; a semiconductor die disposed on the package substrate in the first region and inside the molding compound; a three-dimensional (3D) antenna, comprising; a planar structure portion on the package substrate in the second region; and a wall structure portion contacting the planar structure portion and covering a top surface or one of sidewalls of the molding compound in the second region; and a conductive shielding element comprising; a spacer portion between the 3D antenna and the semiconductor die and passing through the molding compound; and a U-shaped wall portion covering the sidewalls of the molding compound in the first region and separated from the wall structure portion of the 3D antenna. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A semiconductor package assembly, comprising:
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a printed circuit board (PCB) having a keep-out region; a package substrate disposed on the PCB, wherein the package substrate has a first region and a second region defined between an edge of the package substrate and an edge of the first region and corresponding to the keep-out region; a semiconductor die disposed on the package substrate in the first region; a conductive shielding element disposed on the package substrate and covering the semiconductor die; a three-dimensional (3D) antenna, comprising; a planar structure portion disposed on the package substrate in the second region; and a bridge structure portion above the planar structure portion and connected thereto; and a molding compound encapsulating the conductive shielding element and the 3D antenna. - View Dependent Claims (16, 17, 18, 19)
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20. A semiconductor package assembly, comprising:
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a printed circuit board (PCB) having a keep-out region; a package substrate disposed on the PCB, wherein the package substrate has a first region and a second region defined between an edge of the package substrate and an edge of the first region and corresponding to the keep-out region; a molding compound disposed on the package substrate in the first and second regions; a semiconductor die disposed on the package substrate in the first region and inside the molding compound; a three-dimensional (3D) antenna, comprising; a planar structure portion on the package substrate in the second region; and a wall structure portion contacting the planar structure portion and covering a top surface or one of sidewalls of the molding compound in the second region; and a conductive shielding element comprising; a spacer portion between the 3D antenna and the semiconductor die and passing through the molding compound; and a U-shaped wall portion covering the sidewalls of the molding compound in the first region and separated from the wall structure portion of the 3D antenna. - View Dependent Claims (21, 22, 23, 24, 25, 26)
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Specification