Integrated fan-out package on package structure and methods of forming same
First Claim
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1. A package comprising:
- a first package comprising a first semiconductor die, wherein the first semiconductor die comprises a first semiconductor substrate;
a thermal interface material (TIM) at least partially contacting a top surface of the first package;
a second package bonded to the first package, wherein the second package comprises a second semiconductor die, wherein the second semiconductor die comprises a second semiconductor substrate, wherein the TIM at least parially contacts a first surface of the first semiconductor substrate and a second surface of the second semiconductor substrate, wherein the TIM has a same material composition throughout, and wherein the TIM extends continuously throughout an area bounded by a first line extending from a first sidewall of the first semiconductor substrate to the second semiconductor substrate, a second line extending from a second sidewall of the first semiconductor substrate to the second semiconductor substrate, the first surface of the first semiconductor substrate, and the second surface of the second semiconductor substrate, and wherein the TIM extends laterally past edges of the second semiconductor die along a surface of the second package; and
a heat spreader disposed on an opposing surface of the second package as the first package.
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Abstract
An embodiment package includes a first package; a thermal interface material (TIM) contacting a top surface of the first package, and a second package bonded to the first package. The second package includes a first semiconductor die, and the TIM contacts a bottom surface of the first semiconductor die. The package further includes a heat spreader disposed on an opposing surface of the second package as the first package.
50 Citations
18 Claims
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1. A package comprising:
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a first package comprising a first semiconductor die, wherein the first semiconductor die comprises a first semiconductor substrate; a thermal interface material (TIM) at least partially contacting a top surface of the first package; a second package bonded to the first package, wherein the second package comprises a second semiconductor die, wherein the second semiconductor die comprises a second semiconductor substrate, wherein the TIM at least parially contacts a first surface of the first semiconductor substrate and a second surface of the second semiconductor substrate, wherein the TIM has a same material composition throughout, and wherein the TIM extends continuously throughout an area bounded by a first line extending from a first sidewall of the first semiconductor substrate to the second semiconductor substrate, a second line extending from a second sidewall of the first semiconductor substrate to the second semiconductor substrate, the first surface of the first semiconductor substrate, and the second surface of the second semiconductor substrate, and wherein the TIM extends laterally past edges of the second semiconductor die along a surface of the second package; and a heat spreader disposed on an opposing surface of the second package as the first package. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A package comprising:
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a first die comprising a first input/output feature disposed on a first semiconductor substrate, wherein the first die comprises a top surface disposed on an opposing side of the first semiconductor substrate as the first input/output feature; a first molding compound extending along sidewalls of the first die; a polymer layer at least partially contacting the top surface of the first die; a second die over and separated from the first die by a gap, wherein the second die comprises a second input/output feature disposed on a second semiconductor substrate, wherein the polymer layer spans the gap and contacts a bottom surface of the second die, and wherein the bottom surface of the second die is disposed on an opposing side of the second semiconductor substrate as the second input/output feature; and a second molding compound extending along sidewalls of the second die, wherein the first molding compound and the second molding compound are separated by the gap, wherein the gap comprises an air gap, the air gap being between a top surface and a bottom surface of the first and second molding compounds respectively. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14)
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15. A package comprising:
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a first semiconductor substrate; a first molding compound encapsulating the first semiconductor substrate, wherein a surface of the first molding compound is substantially level with a surface of the first semiconductor substrate; a polymer layer at least partially contacting the surface of the first semiconductor substrate; a second semiconductor substrate disposed on an opposing side of the polymer layer as the first semiconductor substrate, wherein a surface of the second semiconductor substrate contacts the polymer layer; and a second molding compound extending along a sidewall of the second semiconductor substrate, wherein a surface of the second molding compound is substantially level with the surface of the second semiconductor substrate, and wherein the surface of the first molding compound is spaced apart from the surface of the second molding compound by an air gap. - View Dependent Claims (16, 17, 18)
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Specification