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Integrated fan-out package on package structure and methods of forming same

  • US 9,881,908 B2
  • Filed: 01/15/2016
  • Issued: 01/30/2018
  • Est. Priority Date: 01/15/2016
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a first package comprising a first semiconductor die, wherein the first semiconductor die comprises a first semiconductor substrate;

    a thermal interface material (TIM) at least partially contacting a top surface of the first package;

    a second package bonded to the first package, wherein the second package comprises a second semiconductor die, wherein the second semiconductor die comprises a second semiconductor substrate, wherein the TIM at least parially contacts a first surface of the first semiconductor substrate and a second surface of the second semiconductor substrate, wherein the TIM has a same material composition throughout, and wherein the TIM extends continuously throughout an area bounded by a first line extending from a first sidewall of the first semiconductor substrate to the second semiconductor substrate, a second line extending from a second sidewall of the first semiconductor substrate to the second semiconductor substrate, the first surface of the first semiconductor substrate, and the second surface of the second semiconductor substrate, and wherein the TIM extends laterally past edges of the second semiconductor die along a surface of the second package; and

    a heat spreader disposed on an opposing surface of the second package as the first package.

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