Integrated inductor for integrated circuit devices
First Claim
1. A system, comprising:
- a processor;
a memory coupled to the processor;
a video controller coupled to the processor and the memory; and
a semiconductor die coupled to at least one of the processor, memory and video controller, the die having a body, a front side, a back side, and a first through-body-via-based inductor disposed in the die and having a first turn which includes first and second conductive through-body-vias passing through the body of the die from the front side of the die to the back side of the die, said first and second through-body-vias each having a front side end at the front side of the die and said first and second through-body-vias each having a back side end at the back side of the die;
said first turn further including first and second stack conductors disposed on the front side of the die and coupled to the first and second through-body-vias, respectively, each stack conductor comprising;
an interleaved stack of electrically conductive metal layers separated by insulation layers disposed at the front side of the die; and
a plurality of conductive through-layer-vias in each insulation layer, each through-layer-via passing through an insulation layer and electrically coupling adjacent metal layers of the stack conductor.
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Accused Products
Abstract
A three-dimensional inductor is formed in an integrated circuit die using conductive through-body-vias which pass through the body of the die and contact one or more metal interconnect layers on the front side of the die and terminate on the back side of the die. In another embodiment, the through-body-vias may pass through a dielectric material disposed in a plug in the body of the die. In yet another aspect, a transformer may be formed by coupling multiple inductors formed using through-body-vias. In still another aspect, a three-dimensional inductor may include conductors formed of stacks of on chip metallization layers and conductive through-layer-vias disposed in insulation layers between metallization layers. Other embodiments are described.
36 Citations
13 Claims
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1. A system, comprising:
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a processor; a memory coupled to the processor; a video controller coupled to the processor and the memory; and a semiconductor die coupled to at least one of the processor, memory and video controller, the die having a body, a front side, a back side, and a first through-body-via-based inductor disposed in the die and having a first turn which includes first and second conductive through-body-vias passing through the body of the die from the front side of the die to the back side of the die, said first and second through-body-vias each having a front side end at the front side of the die and said first and second through-body-vias each having a back side end at the back side of the die; said first turn further including first and second stack conductors disposed on the front side of the die and coupled to the first and second through-body-vias, respectively, each stack conductor comprising; an interleaved stack of electrically conductive metal layers separated by insulation layers disposed at the front side of the die; and a plurality of conductive through-layer-vias in each insulation layer, each through-layer-via passing through an insulation layer and electrically coupling adjacent metal layers of the stack conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification