Structures for bonding a direct-bandgap chip to a silicon photonic device
First Claim
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1. A photonic device comprising:
- a base layer comprising a crystalline material, the base layer having a recess formed therein, wherein a direction that is parallel with a surface of the base layer outside of the recess defines a horizontal direction and a direction that is normal to the surface of the base layer outside of the recess defines a vertical direction;
a device layer, wherein;
the device layer is above the base layer;
the device layer defines an opening bounded on all sides by a plurality of device layer walls such that a portion of the base layer that includes the recess is exposed through the opening in the device layer;
the device layer comprises a first silicon waveguide portion extending along a first portion of an optical path and a second silicon waveguide portion extending along a second portion of the optical path, such that the optical path is defined by a line that begins with the first silicon waveguide portion, continues through the opening in the direction of the first silicon waveguide portion, and continues along the second silicon waveguide portion;
the first silicon waveguide portion has a first termination at a first wall of the plurality of device layer walls at a first side of the opening;
the second silicon waveguide portion has a second termination at a second wall of the plurality of device layer walls at a second side of the opening, across the opening from the first side of the opening; and
wherein;
the base layer defines two or more pedestals below the opening, wherein;
a first one of the two or more pedestals extends from a bottommost surface of the recess in a direction normal to the bottommost surface toward the device layer; and
the first pedestal is disposed adjoining the first wall of the plurality of device layer walls directly under the line of the optical path;
a second one of the two or more pedestals extends from the bottommost surface of the recess in the direction normal to the bottommost surface toward the device layer; and
the second pedestal is disposed adjoining the second wall of the plurality of device layer walls directly under the line of the optical path.
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Abstract
A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path.
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Citations
10 Claims
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1. A photonic device comprising:
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a base layer comprising a crystalline material, the base layer having a recess formed therein, wherein a direction that is parallel with a surface of the base layer outside of the recess defines a horizontal direction and a direction that is normal to the surface of the base layer outside of the recess defines a vertical direction; a device layer, wherein; the device layer is above the base layer; the device layer defines an opening bounded on all sides by a plurality of device layer walls such that a portion of the base layer that includes the recess is exposed through the opening in the device layer; the device layer comprises a first silicon waveguide portion extending along a first portion of an optical path and a second silicon waveguide portion extending along a second portion of the optical path, such that the optical path is defined by a line that begins with the first silicon waveguide portion, continues through the opening in the direction of the first silicon waveguide portion, and continues along the second silicon waveguide portion; the first silicon waveguide portion has a first termination at a first wall of the plurality of device layer walls at a first side of the opening; the second silicon waveguide portion has a second termination at a second wall of the plurality of device layer walls at a second side of the opening, across the opening from the first side of the opening; and
wherein;the base layer defines two or more pedestals below the opening, wherein; a first one of the two or more pedestals extends from a bottommost surface of the recess in a direction normal to the bottommost surface toward the device layer; and the first pedestal is disposed adjoining the first wall of the plurality of device layer walls directly under the line of the optical path; a second one of the two or more pedestals extends from the bottommost surface of the recess in the direction normal to the bottommost surface toward the device layer; and the second pedestal is disposed adjoining the second wall of the plurality of device layer walls directly under the line of the optical path. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification