Light emitting diode structure and method for manufacturing the same

• US 9,882,096 B2
• Filed: 03/18/2016
• Issued: 01/30/2018
• Est. Priority Date: 03/18/2015
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Hung, Cheng-Wei, Lin, Yu-Feng
• Primary Examiner(s): Cao, Phat X
• Application Number:
  US15/073,715
• Publication Number:
  US 20160276547A1
• Time in Patent Office: 683 Days
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/40 Materials therefor
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/502 Wavelength conversion materials
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

An edge lighting light emitting diode (LED) structure and a method of manufacturing the same are provided. The edge lighting LED structure includes a substrate, an electrode pattern, a chip, an encapsulation layer and a fluorescent layer. The electrode pattern at least includes two first conducting portions separately disposed on an upper surface of the substrate, two second conducting portions separately disposed on a lower surface of the substrate, and two conducting holes separately vertically penetrating through the substrate, each conducting hole connects a first conducting portion and a second conducting portion, and the conducting holes are exposed on a lateral surface of the substrate. A second surface of the chip is disposed on the first conducting portions. A top surface of the encapsulation layer exposes and is aligned with the first surface of the chip. The fluorescent layer covers a first surface of the chip.

Claims

1. A light emitting diode (LED), comprising:

a substrate having an upper surface and a lower surface positioned oppositely, and a lateral surface connecting the upper surface and the lower surface;

an electrode pattern at least comprising;

two first conducting portions separately disposed on the upper surface of the substrate;

two second conducting portions separately disposed on the lower surface of the substrate; and

two conducting holes separately penetrating through the substrate, wherein each of the conducting holes connects one of the first conducting portions and one of the second conducting portions, and the conducting holes are exposed on the lateral surface of the substrate;

a chip having a first surface and a second surface positioned oppositely, wherein the second surface of the chip is disposed on the two first conducting portions;

an encapsulation layer covering the upper surface of the substrate, the encapsulation layer encapsulating the chip and exposing the first surface of the chip; and

a fluorescent layer disposed on the first surface of the chip.

2. The LED according to claim 1, wherein junctions of the conducting holes extend from the first conducting portions to the second conducting portions and are exposed on the lateral surface of the substrate, and the junctions are aligned with the lateral surface.

3. The LED according to claim 1, wherein the first surface of the chip is a light emitting surface, and an extending direction of the first surface is substantially perpendicular to an extending direction of junctions of the conducting holes.

4. The LED according to claim 1, wherein each of the conducting holes is a through hole filled with a conducting material.

5. The LED according to claim 4, wherein the conducting material comprises a metal or a composite metal comprising two or more metals.

6. The LED according to claim 4, wherein the conducting material comprises at least one of gold, silver, and copper.

7. The LED according to claim 1, wherein the substrate has two first side surfaces each connecting the upper surface and the lower surface, the encapsulation layer has two second side surfaces each connecting a top surface of the encapsulation layer, and the two second side surfaces of the encapsulation layer are aligned with the two first side surfaces of the substrate, respectively.

8. The LED according to claim 1, wherein the fluorescent layer directly contacts the first surface of the chip and at least completely covers the first surface of the chip.

9. The LED according to claim 1, wherein an area of the fluorescent layer is substantially equal to or larger than an area of the chip and smaller than an area of the top surface of the encapsulation layer.

10. The LED according to claim 1, wherein two side edges of the fluorescent layer are correspondingly between two edges of the chip and two outer edges of the first conducting portions.