Organic electronic devices
First Claim
1. An organic electronic device having an inverted structure architecture, containing a substrate, a first electrode deposited on the substrate, a second electrode and at least one assembly comprising a multilayer stack placed between said electrodes, said multilayer stack comprising in succession from the first electrode:
- an n-type layer;
an electrically active layer; and
a p-type layer based on a poly(3,4-ethylenedioxythiophene);
polystyrene sulfonate mixture;
wherein said stack contains an additional layer that is what is referred to as a “
tie layer”
composed of at least one metal oxide in nanoparticle form and that is intermediate between and in contact with the active layer and the p-type layer.
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Accused Products
Abstract
An organic electronic device having an architecture with an inverted structure, containing a substrate, a first electrode deposited on the substrate, a second electrode and at least one assembly including a multilayer stack disposed between the electrodes, the multilayer stack including the following, successively from the first electrode: an N-type layer; an electrically active layer; and a P-type layer comprising a mixture of poly(3,4-ethylenedioxythiophene):poly (styrene-sulfonate), the stack containing an additional layer, known as the adhesion layer, formed by at least one metallic oxide and inserted between, and in contact with, the active layer and the P-layer. Also, a method for producing such a device.
7 Citations
15 Claims
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1. An organic electronic device having an inverted structure architecture, containing a substrate, a first electrode deposited on the substrate, a second electrode and at least one assembly comprising a multilayer stack placed between said electrodes, said multilayer stack comprising in succession from the first electrode:
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an n-type layer; an electrically active layer; and a p-type layer based on a poly(3,4-ethylenedioxythiophene);
polystyrene sulfonate mixture;wherein said stack contains an additional layer that is what is referred to as a “
tie layer”
composed of at least one metal oxide in nanoparticle form and that is intermediate between and in contact with the active layer and the p-type layer.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A process for preparing a multilayer stack, having an inverted structure architecture, comprising an electrically active layer superposed on an n-type layer, wherein said process comprises forming a layer that is what is referred to as a “
- tie layer”
intermediate between and in contact with the layer referred to as the active layer and the p-layer, said “
tie layer”
being formed from at least one metal oxide in nanoparticle state.
- tie layer”
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14. A process for preparing an organic electronic device of inverted structure comprising at least the following steps:
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(i) providing a substrate coated on one of its sides with a multilayer stack comprising in order of superposition from said substrate;
a conductive layer by way of first electrode and an n-type layer;(ii) forming an electrically active layer on the n-type layer; (iii) bringing said active layer into contact with a medium containing nanoparticles, of at least one metal oxide, and exposing the assembly to conditions propitious to the formation of what is referred to as a tie layer; (iv) forming, by wet processing, in contact with the tie layer, a p-type layer based on a blend of two polymers, poly(3,4-ethylenedioxythiophene) (PEDOT) and sodium polystyrene sulfonate (PSS), i.e. the polymer blend referred to as PEDOT;
PSS; and(v) depositing in contact with the p-type layer a conductive layer by way of second electrode.
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15. A process for improving the adhesion between an electrically active layer and a p-type layer in an organic electronic device, said process consisting in forming a layer composed of at least one metal oxide in nanoparticle form at the intersection of the two layers.
Specification