×

Encapsulated electronic circuit

  • US 9,884,197 B2
  • Filed: 07/01/2014
  • Issued: 02/06/2018
  • Est. Priority Date: 07/01/2013
  • Status: Active Grant
First Claim
Patent Images

1. A device, comprising:

  • an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure, whereinthe device includes a housing configured to hermetically isolate the space and the electronic circuit from an environment in a body of a recipient; and

    the substrate forms a wall of the housing,the substrate and the housing are structures that preserve the space;

    the implantable electronic circuit is spaced away from the housing and integrated in the substrate;

    the substrate is substantially planar on both an outer surface thereof that is exposed to an ambient environment and on an inner surface thereof that is exposed to the space, andthe implantable electronic circuit is thin in height relative to a length thereof, wherein a direction in the height extends normal to a direction of extension of the substrate, wherein the outer planar portion of the substrate establishes the bottom and the housing establishes the top and the height extends from the bottom to the top, wherein the direction of extension of the substrate extends in the length direction.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×