Encapsulated electronic circuit
First Claim
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1. A device, comprising:
- an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure, whereinthe device includes a housing configured to hermetically isolate the space and the electronic circuit from an environment in a body of a recipient; and
the substrate forms a wall of the housing,the substrate and the housing are structures that preserve the space;
the implantable electronic circuit is spaced away from the housing and integrated in the substrate;
the substrate is substantially planar on both an outer surface thereof that is exposed to an ambient environment and on an inner surface thereof that is exposed to the space, andthe implantable electronic circuit is thin in height relative to a length thereof, wherein a direction in the height extends normal to a direction of extension of the substrate, wherein the outer planar portion of the substrate establishes the bottom and the housing establishes the top and the height extends from the bottom to the top, wherein the direction of extension of the substrate extends in the length direction.
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Abstract
A device, including an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure.
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Citations
21 Claims
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1. A device, comprising:
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an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure, wherein the device includes a housing configured to hermetically isolate the space and the electronic circuit from an environment in a body of a recipient; and the substrate forms a wall of the housing, the substrate and the housing are structures that preserve the space; the implantable electronic circuit is spaced away from the housing and integrated in the substrate; the substrate is substantially planar on both an outer surface thereof that is exposed to an ambient environment and on an inner surface thereof that is exposed to the space, and the implantable electronic circuit is thin in height relative to a length thereof, wherein a direction in the height extends normal to a direction of extension of the substrate, wherein the outer planar portion of the substrate establishes the bottom and the housing establishes the top and the height extends from the bottom to the top, wherein the direction of extension of the substrate extends in the length direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A device, comprising:
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an implantable electronic circuit integrated at least one of in or on a first substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure, wherein the device includes a second substrate that forms another portion of the hermetic enclosure, and at least one of; i. there is no other part that establishes the hermetic enclosure and is directly exposed to the ambient environment between the implantable electronic circuit and the first substrate;
orii. the second substrate is a planar substrate configured for an integrated circuit. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A device, comprising:
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an implantable electronic circuit integrated at least one of in or on a substrate, wherein the device includes a hermetic enclosure having a space therein, wherein the substrate forms at least a portion of the hermetic enclosure, wherein the device includes a housing configured to hermetically isolate the space and the electronic circuit from an environment in a body of a recipient, the substrate forms a wall of the housing, and the device includes one or more electrical interfaces integral with the housing, the one or more electrical interfaces corresponding to a location on the housing exposed to an ambient environment.
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Specification