Endpoint method using peak location of spectra contour plots versus time

• US 9,886,026 B2
• Filed: 02/19/2015
• Issued: 02/06/2018
• Est. Priority Date: 11/03/2009
• Status: Active Grant

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: David, Jeffrey Drue, Lee, Harry Q., Benvegnu, Dominic J., Swedek, Boguslaw A.
• Primary Examiner(s): Laughlin, Nathan L
• Application Number:
  US14/626,147
• Publication Number:
  US 20150160649A1
• Time in Patent Office: 1,083 Days
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/042 operating processes therefor
• CPC Class Codes: B24B 37/205 provided with a window for inspecting the surface of the work being lapped
• CPC Class Codes: B24B 49/12 involving optical means
• CPC Class Codes: G05B 19/418 Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
• CPC Class Codes: G05B 2219/45232 CMP chemical mechanical polishing of wafer

Abstract

In one aspect, a method of polishing includes polishing a substrate, and receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing. The method includes measuring a sequence of spectra of light reflected from the substrate while the substrate is being polished, where at least some of the spectra of the sequence differ due to material being removed during the polishing. The method of polishing includes determining a value of a characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic, fitting a function to the sequence of values, and determining either a polishing endpoint or an adjustment for a polishing rate based on the function.

Claims

1. A computer program product, tangibly embodied on a computer readable medium, comprising instructions to:

receive an identification of a selected spectral feature, a characteristic of the selected spectral feature to monitor during polishing, an expected initial value for the characteristic and a target difference for the characteristic;

receiving measurements of a sequence of spectra of light reflected from a substrate while the substrate is being polished, at least some of the spectra of the sequence differing due to material being removed during the polishing;

determine a value of the characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic;

calculate an actual initial value of the characteristic from the sequence of values;

calculate a first difference between the actual initial value and the expected initial value;

generate a weighted combination of the first difference and the target difference; and

determine at least one of a polishing endpoint or an adjustment for a polishing rate based on the weighted combination.

2. The computer program product of claim 1, wherein the selected spectral feature comprises a spectral peak, a spectral valley, or a spectral zero-crossing.

3. The computer program product of claim 2, wherein the characteristic comprises a wavelength, a width, or an intensity.

4. The computer program product of claim 2, comprising instructions to fit a function to the sequence of values.

5. The computer program product of claim 4, wherein the instructions to calculate the actual initial value of the characteristic comprise instructions to calculate the initial value of the characteristic from the function.

6. The computer program product of claim 5, comprising instructions to determine the polishing endpoint.

7. The computer program product of claim 6, wherein the instructions to determine the polishing endpoint comprise instructions to calculate a current value of the characteristic from the function, calculate a second difference between the actual initial value and the current value, and cease polishing when the second difference reaches the weighted combination.

8. The computer program product of claim 4, wherein the function is a linear function of time.

9. A method of polishing, comprising:

polishing a substrate;

receiving an identification of a selected spectral feature, a characteristic of the selected spectral feature to monitor during polishing, an expected initial value for the characteristic and a target difference for the characteristic;

measuring a sequence of spectra of light reflected from a substrate while the substrate is being polished, at least some of the spectra of the sequence differing due to material being removed during the polishing;

determining a value of the characteristic of the selected spectral feature for each of the spectra in the sequence of spectra to generate a sequence of values for the characteristic;

calculating an actual initial value of the characteristic from the sequence of values;

calculating a first difference between the actual initial value and the expected initial value;

generating a weighted combination of the first difference and the target difference; and

determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the weighted combination.

10. The method of claim 9, wherein the selected spectral feature comprises a spectral peak, a spectral valley, or a spectral zero-crossing.

11. The method of claim 10, wherein the characteristic comprises a wavelength, a width, or an intensity.

12. The method of claim 9, comprising fitting a function to the sequence of values.

13. The method of claim 12, calculating the actual initial value of the characteristic comprises calculating the initial value of the characteristic from the function.

14. The method of claim 13, comprising determining the polishing endpoint.

15. The method of claim 14, wherein determining the polishing endpoint comprises calculating a current value of the characteristic from the function, calculating a second difference between the actual initial value and the current value, and ceasing polishing when the second difference reaches the weighted combination.

16. The method of claim 12, wherein the function is a linear function of time.