One-time programmable memory and method for making the same
First Claim
1. A one-time programmable non-volatile memory cell comprising:
- a buried bitline formed in a substrate;
a dielectric layer formed over at least a portion of the buried bitline, the dielectric layer over the portion of the buried bitline having an even thickness;
insulating layers formed in the substrate on either side of the buried bitline, the insulating layers having a depth in the substrate greater than that of the buried bitline;
a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer; and
doped regions on either side of the conductive gate in the buried bitline but displaced from edges of the conductive gate wherein the channel region has no electrical interaction other than to the buried bitline or conductive gate.
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Accused Products
Abstract
A one time programmable nonvolatile memory formed from metal-insulator semiconductor cells. The cells are at the crosspoints of conductive gate lines and intersecting lines formed in a semiconductor substrate. Among others, features include forming the gate lines with polysilicon layers of one conductivity type and the intersecting lines with dopants of the opposite conductivity type in the substrate; forming the intersecting lines with differing dopant concentrations near the substrate surface and deeper in the substrate; and forming the widths of the gate lines and intersecting lines with the minimum feature size that can be patterned by a particular semiconductor technology.
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Citations
30 Claims
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1. A one-time programmable non-volatile memory cell comprising:
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a buried bitline formed in a substrate; a dielectric layer formed over at least a portion of the buried bitline, the dielectric layer over the portion of the buried bitline having an even thickness; insulating layers formed in the substrate on either side of the buried bitline, the insulating layers having a depth in the substrate greater than that of the buried bitline; a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer; and doped regions on either side of the conductive gate in the buried bitline but displaced from edges of the conductive gate wherein the channel region has no electrical interaction other than to the buried bitline or conductive gate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A one-time programmable non-volatile memory cell comprising:
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a buried bitline formed in a substrate, the buried bitline having a first conductivity; a dielectric layer formed over at least a portion of the buried bitline; insulating layers formed in the substrate on either side of the buried bitline, the insulating layers having a depth in the substrate greater than that of the buried bitline; a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer, the conductive gate has a second conductivity different from the first conductivity; and doped regions on either side of the conductive gate in the buried bitline but displaced from edges of the conductive gate wherein the channel region has no electrical interaction other than to the buried bitline or conductive gate. - View Dependent Claims (10, 11, 12, 13)
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14. A one-time programmable non-volatile memory cell comprising:
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a buried bitline formed in a substrate, the buried bitline having a first conductivity and a severe graded first conductivity dopant concentration with a lower dopant concentration near a dielectric layer and a higher dopant concentration deeper in the substrate; the dielectric layer formed over at least a portion of the buried bitline; insulating layers formed in the substrate on either side of the buried bitline; a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer, the conductive gate having a second conductivity different from the first conductivity; and wherein the channel region has no electrical interaction other than to the buried bitline or conductive gate. - View Dependent Claims (15, 16, 17)
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18. A one-time programmable non-volatile memory cell comprising:
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a buried bitline formed in a substrate, the buried bitline having a first conductivity and a severe graded first conductivity dopant concentration with a lower dopant concentration near a dielectric layer and a higher dopant concentration deeper in the substrate; the dielectric layer formed over at least a portion of the buried bitline; insulating layers formed in the substrate on either side of the buried bitline, the insulating layers having a depth in the substrate greater than that of the buried bitline; a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer; and wherein the channel region does not have electrical interaction other than to the buried bitline or conductive gate. - View Dependent Claims (19, 20, 21, 22)
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23. A one-time programmable non-volatile memory cell comprising:
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a buried bitline formed in a substrate, the buried bitline having a first conductivity; a dielectric layer formed over at least a portion of the buried bitline, the dielectric layer over the portion of the buried bitline having an even thickness; insulating layers formed in the substrate on either side of the buried bitline; a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer, the conductive gate having a second conductivity different from the first conductivity; and wherein the channel region does not have electrical interaction other than to the buried bitline or conductive gate. - View Dependent Claims (24, 25, 26)
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27. A one-time programmable non-volatile memory cell comprising:
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a buried bitline formed in a substrate, the buried bitline having a first conductivity and a severe graded first conductivity dopant concentration with a lower dopant concentration near a dielectric layer and a higher dopant concentration deeper in the substrate; the dielectric layer formed over at least a portion of the buried bitline, the dielectric layer over the portion of the buried bitline having an even thickness; insulating layers formed in the substrate on either side of the buried bitline; a conductive gate formed over the dielectric layer and a channel region under the conductive gate and dielectric layer; and wherein the channel region does not have electrical interaction other than to the buried bitline or conductive gate. - View Dependent Claims (28, 29, 30)
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Specification